MC9S08PA16VTJR datasheet, PDF - EEWORLD Datasheet

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MC9S08PA16VTJR: DescriptionIC mcu 8bit 16kb flash 20tssop; Categorysemiconductor The embedded processor and controller; File Size771KB，35 Pages; ManufacturerFREESCALE (NXP); Environmental Compliance

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number MC9S08PA16

Rev 2, 09/2014

MC9S08PA16 Series Data

Sheet

Supports: MC9S08PA16(A) and

MC9S08PA8(A)

Key features

• 8-Bit S08 central processor unit (CPU)

– Up to 20 MHz bus at 2.7 V to 5.5 V across

temperature range of -40 °C to 105 °C

– Supporting up to 40 interrupt/reset sources

– Supporting up to four-level nested interrupt

– On-chip memory

– Up to 16 KB flash read/program/erase over full

operating voltage and temperature

– Up to 256 byte EEPROM; 2-byte erase sector;

program and erase while executing flash

– Up to 2048 byte random-access memory (RAM)

– Flash and RAM access protection

• Power-saving modes

– One low-power stop mode; reduced power wait

mode

– Peripheral clock enable register can disable

clocks to unused modules, reducing currents;

allows clocks to remain enabled to specific

peripherals in stop3 mode

• Clocks

– Oscillator (XOSC) - loop-controlled Pierce

oscillator; crystal or ceramic resonator range of

31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz

– Internal clock source (ICS) - containing a

frequency-locked-loop (FLL) controlled by

internal or external reference; precision

trimming of internal reference allowing 1%

deviation across temperature range of 0 °C to

70 °C and 2% deviation across temperature

range of -40 °C to 105 °C; up to 20 MHz

• System protection

– Watchdog with independent clock source

– Low-voltage detection with reset or interrupt;

selectable trip points

– Illegal opcode detection with reset

– Illegal address detection with reset

MC9S08PA16

MC9S08PA16A and MC9S08PA8A

are recommended for new design

• Development support

– Single-wire background debug interface

– Breakpoint capability to allow three breakpoints

setting during in-circuit debugging

– On-chip in-circuit emulator (ICE) debug module

containing two comparators and nine trigger

modes

• Peripherals

– ACMP - one analog comparator with both

positive and negative inputs; separately

selectable interrupt on rising and falling

comparator output; filtering

– ADC - 12-channel, 12-bit resolution; 2.5 µs

conversion time; data buffers with optional

watermark; automatic compare function;

internal bandgap reference channel; operation

in stop mode; optional hardware trigger

– CRC - programmable cyclic redundancy check

module

– FTM - two flex timer modulators modules

including one 6-channel and one 2-channel

ones; 16-bit counter; each channel can be

configured for input capture, output compare,

edge- or center-aligned PWM mode

– IIC - One inter-integrated circuit module; up to

400 kbps; multi-master operation;

programmable slave address; supporting

broadcast mode and 10-bit addressing;

supporting SMBUS and PMBUS

– MTIM - One modulo timer with 8-bit prescaler

and overflow interrupt

– RTC - 16-bit real timer counter (RTC)

– SCI - two serial communication interface (SCI/

UART) modules optional 13-bit break; full

duplex non-return to zero (NRZ); LIN extension

support

– SPI - one 8-bit serial peripheral interface (SPI)

modules; full-duplex or single-wire bidirectional;

master or slave mode

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts........................................................................... 4

1.1 Determining valid orderable parts......................................4

2 Part identification...................................................................... 4

2.1 Description.........................................................................4

2.2 Format............................................................................... 4

2.3 Fields................................................................................. 4

2.4 Example............................................................................ 5

3 Parameter Classification........................................................... 5

4 Ratings...................................................................................... 6

4.1 Thermal handling ratings................................................... 6

4.2 Moisture handling ratings.................................................. 6

4.3 ESD handling ratings.........................................................6

4.4 Voltage and current operating ratings............................... 6

5 General..................................................................................... 7

5.1 Nonswitching electrical specifications............................... 7

5.1.1

5.1.2

5.1.3

DC characteristics................................................. 7

Supply current characteristics............................... 14

EMC performance................................................. 15

5.2.1

5.2.2

5.2.3

Control timing........................................................ 16

Debug trace timing specifications......................... 17

FTM module timing............................................... 18

5.3 Thermal specifications.......................................................19

5.3.1

Thermal characteristics......................................... 19

6 Peripheral operating requirements and behaviors.................... 20

6.1 External oscillator (XOSC) and ICS characteristics...........20

6.2 NVM specifications............................................................ 22

6.3 Analog............................................................................... 23

6.3.1

6.3.2

ADC characteristics...............................................23

Analog comparator (ACMP) electricals................. 26

6.4 Communication interfaces................................................. 26

6.4.1

SPI switching specifications.................................. 26

7 Dimensions............................................................................... 29

7.1 Obtaining package dimensions......................................... 29

8 Pinout........................................................................................ 30

8.1 Signal multiplexing and pin assignments...........................30

8.2 Device pin assignment...................................................... 32

9 Revision history.........................................................................34

5.2 Switching specifications.....................................................16

MC9S08PA16 Series Data Sheet, Rev2, 09/2014.

Freescale Semiconductor, Inc.

MC9S08PA16VTJR Related Products

	MC9S08PA16VTJR	MC9S08PA8VWJR	MC9S08PA8VTGR	MC9S08PA16VLCR
Description	IC mcu 8bit 16kb flash 20tssop	IC mcu 8bit 8kb flash 20soic	IC mcu 8bit 8kb flash 16soic	IC mcu 8bit 16kb flash 32qfp

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