Freescale Semiconductor
Data Sheet: Technical Data
Document Number MC9S08PA16
Rev 2, 09/2014
MC9S08PA16 Series Data
Sheet
Supports: MC9S08PA16(A) and
MC9S08PA8(A)
Key features
• 8-Bit S08 central processor unit (CPU)
– Up to 20 MHz bus at 2.7 V to 5.5 V across
temperature range of -40 °C to 105 °C
– Supporting up to 40 interrupt/reset sources
– Supporting up to four-level nested interrupt
– On-chip memory
– Up to 16 KB flash read/program/erase over full
operating voltage and temperature
– Up to 256 byte EEPROM; 2-byte erase sector;
program and erase while executing flash
– Up to 2048 byte random-access memory (RAM)
– Flash and RAM access protection
• Power-saving modes
– One low-power stop mode; reduced power wait
mode
– Peripheral clock enable register can disable
clocks to unused modules, reducing currents;
allows clocks to remain enabled to specific
peripherals in stop3 mode
• Clocks
– Oscillator (XOSC) - loop-controlled Pierce
oscillator; crystal or ceramic resonator range of
31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz
– Internal clock source (ICS) - containing a
frequency-locked-loop (FLL) controlled by
internal or external reference; precision
trimming of internal reference allowing 1%
deviation across temperature range of 0 °C to
70 °C and 2% deviation across temperature
range of -40 °C to 105 °C; up to 20 MHz
• System protection
– Watchdog with independent clock source
– Low-voltage detection with reset or interrupt;
selectable trip points
– Illegal opcode detection with reset
– Illegal address detection with reset
MC9S08PA16
MC9S08PA16A and MC9S08PA8A
are recommended for new design
• Development support
– Single-wire background debug interface
– Breakpoint capability to allow three breakpoints
setting during in-circuit debugging
– On-chip in-circuit emulator (ICE) debug module
containing two comparators and nine trigger
modes
• Peripherals
– ACMP - one analog comparator with both
positive and negative inputs; separately
selectable interrupt on rising and falling
comparator output; filtering
– ADC - 12-channel, 12-bit resolution; 2.5 µs
conversion time; data buffers with optional
watermark; automatic compare function;
internal bandgap reference channel; operation
in stop mode; optional hardware trigger
– CRC - programmable cyclic redundancy check
module
– FTM - two flex timer modulators modules
including one 6-channel and one 2-channel
ones; 16-bit counter; each channel can be
configured for input capture, output compare,
edge- or center-aligned PWM mode
– IIC - One inter-integrated circuit module; up to
400 kbps; multi-master operation;
programmable slave address; supporting
broadcast mode and 10-bit addressing;
supporting SMBUS and PMBUS
– MTIM - One modulo timer with 8-bit prescaler
and overflow interrupt
– RTC - 16-bit real timer counter (RTC)
– SCI - two serial communication interface (SCI/
UART) modules optional 13-bit break; full
duplex non-return to zero (NRZ); LIN extension
support
– SPI - one 8-bit serial peripheral interface (SPI)
modules; full-duplex or single-wire bidirectional;
master or slave mode
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2011–2014 Freescale Semiconductor, Inc.
• Input/Output
– Up to 37 GPIOs including one output-only pin
– One 8-bit keyboard interrupt module (KBI)
– Two true open-drain output pins
– Four, ultra-high current sink pins supporting 20 mA source/sink current
• Package options
– 44-pin LQFP
– 32-pin LQFP
– 20-pin SOIC; 20-pin TSSOP
– 16-pin TSSOP
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
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Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts........................................................................... 4
1.1 Determining valid orderable parts......................................4
2 Part identification...................................................................... 4
2.1 Description.........................................................................4
2.2 Format............................................................................... 4
2.3 Fields................................................................................. 4
2.4 Example............................................................................ 5
3 Parameter Classification........................................................... 5
4 Ratings...................................................................................... 6
4.1 Thermal handling ratings................................................... 6
4.2 Moisture handling ratings.................................................. 6
4.3 ESD handling ratings.........................................................6
4.4 Voltage and current operating ratings............................... 6
5 General..................................................................................... 7
5.1 Nonswitching electrical specifications............................... 7
5.1.1
5.1.2
5.1.3
DC characteristics................................................. 7
Supply current characteristics............................... 14
EMC performance................................................. 15
5.2.1
5.2.2
5.2.3
Control timing........................................................ 16
Debug trace timing specifications......................... 17
FTM module timing............................................... 18
5.3 Thermal specifications.......................................................19
5.3.1
Thermal characteristics......................................... 19
6 Peripheral operating requirements and behaviors.................... 20
6.1 External oscillator (XOSC) and ICS characteristics...........20
6.2 NVM specifications............................................................ 22
6.3 Analog............................................................................... 23
6.3.1
6.3.2
ADC characteristics...............................................23
Analog comparator (ACMP) electricals................. 26
6.4 Communication interfaces................................................. 26
6.4.1
SPI switching specifications.................................. 26
7 Dimensions............................................................................... 29
7.1 Obtaining package dimensions......................................... 29
8 Pinout........................................................................................ 30
8.1 Signal multiplexing and pin assignments...........................30
8.2 Device pin assignment...................................................... 32
9 Revision history.........................................................................34
5.2 Switching specifications.....................................................16
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc.
3
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
freescale.com
and perform a part number search for the
following device numbers: PA16 and PA8.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
MC 9 S08 PA AA (V) B CC
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
MC
9
S08
PA
AA
(V)
Qualification status
Memory
Core
Device family
Approximate flash size in KB
Mask set version
Description
• 9 = flash based
• S08 = 8-bit CPU
• PA
• 16 = 16 KB
• 8 = 8 KB
• (blank) = Any version
• A = Rev. 2 or later version, this is
recommended for new design
Table continues on the next page...
Values
• MC = fully qualified, general market flow
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
4
Freescale Semiconductor, Inc.
Parameter Classification
Field
B
CC
Package designator
Description
Operating temperature range (°C)
• V = –40 to 105
•
•
•
•
•
LD = 44-LQFP
LC = 32-LQFP
TJ = 20-TSSOP
WJ = 20-SOIC
TG = 16-TSSOP
Values
2.4 Example
This is an example part number:
MC9S08PA16VLD
3 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods.
To give the customer a better understanding, the following classification is used and the
parameters are tagged accordingly in the tables where appropriate:
Table 1. Parameter Classifications
P
C
T
D
Those parameters are guaranteed during production testing on each individual device.
Those parameters are achieved by the design characterization by measuring a statistically relevant sample size
across process variations.
Those parameters are achieved by design characterization on a small sample size from typical devices under
typical conditions unless otherwise noted. All values shown in the typical column are within this category.
Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the
parameter tables where appropriate.
MC9S08PA16 Series Data Sheet, Rev2, 09/2014.
Freescale Semiconductor, Inc.
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