FIFO, 512X9, 50ns, Asynchronous, CMOS, PDIP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 2030611665 |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| YTEOL | 0 |
| Maximum access time | 50 ns |
| period time | 65 ns |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| memory density | 4608 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 512 words |
| character code | 512 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X9 |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum slew rate | 0.125 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 20 |
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