IC,FLIP-FLOP,9-BIT,D TYPE,AC-CMOS,DIP,24PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP |
| MaximumI(ol) | 0.024 A |
| Number of functions | 9 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Trigger type | POSITIVE EDGE |
| Base Number Matches | 1 |
| 54AC823DMQB | 54AC823LMQB | 54AC823FMQB | 74AC823PC | 74AC823LC | 74AC823DC | |
|---|---|---|---|---|---|---|
| Description | IC,FLIP-FLOP,9-BIT,D TYPE,AC-CMOS,DIP,24PIN,CERAMIC | IC,FLIP-FLOP,9-BIT,D TYPE,AC-CMOS,LLCC,28PIN,CERAMIC | IC,FLIP-FLOP,9-BIT,D TYPE,AC-CMOS,FP,24PIN,CERAMIC | AC SERIES, 9-BIT DRIVER, TRUE OUTPUT, PDIP24, PLASTIC, DIP-24 | AC SERIES, 9-BIT DRIVER, TRUE OUTPUT, CQCC28, CERAMIC, LCC-28 | AC SERIES, 9-BIT DRIVER, TRUE OUTPUT, CDIP24, CERAMIC, DIP-24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP24,.6 | QCCN, LCC28,.45SQ | DFP, FL24,.4 | DIP, DIP24,.6 | QCCN, LCC28,.45SQ | DIP, DIP24,.6 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T24 | S-XQCC-N28 | R-XDFP-F24 | R-PDIP-T24 | S-CQCC-N28 | R-GDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| Number of functions | 9 | 9 | 9 | 1 | 1 | 1 |
| Number of terminals | 24 | 28 | 24 | 24 | 28 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | QCCN | DFP | DIP | QCCN | DIP |
| Encapsulate equivalent code | DIP24,.6 | LCC28,.45SQ | FL24,.4 | DIP24,.6 | LCC28,.45SQ | DIP24,.6 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE |
| power supply | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | YES | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |