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P87LPC760BDH

Description
8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDSO14
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size290KB,56 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
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P87LPC760BDH Overview

8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDSO14

P87LPC760BDH Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionTSSOP, TSSOP14,.25
Reach Compliance Codeunknown
bit size8
CPU series8051
JESD-30 codeR-PDSO-G14
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply3/5 V
Certification statusNot Qualified
RAM (bytes)128
rom(word)1024
ROM programmabilityUVPROM
speed20 MHz
Maximum slew rate25 mA
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
P87LPC760
Low power, low price, low pin count
(14 pin) microcontroller with 1 kbyte OTP
Preliminary data
IC28 Data Handbook
2002 Mar 07
Philips
Semiconductors

P87LPC760BDH Related Products

P87LPC760BDH P87LPC760BN P87LPC760
Description 8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDSO14 8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDSO14 Low power, low price, low pin count (14 pin) microcontroller with 1 kbyte OTP
Is it Rohs certified? conform to conform to -
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) -
package instruction TSSOP, TSSOP14,.25 DIP, DIP14,.3 -
Reach Compliance Code unknown unknow -
bit size 8 8 -
CPU series 8051 8051 -
JESD-30 code R-PDSO-G14 R-PDIP-T14 -
Number of terminals 14 14 -
Maximum operating temperature 70 °C 70 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code TSSOP DIP -
Encapsulate equivalent code TSSOP14,.25 DIP14,.3 -
Package shape RECTANGULAR RECTANGULAR -
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE -
power supply 3/5 V 3/5 V -
Certification status Not Qualified Not Qualified -
RAM (bytes) 128 128 -
rom(word) 1024 1024 -
ROM programmability UVPROM UVPROM -
speed 20 MHz 20 MHz -
Maximum slew rate 25 mA 25 mA -
surface mount YES NO -
technology CMOS CMOS -
Temperature level COMMERCIAL COMMERCIAL -
Terminal form GULL WING THROUGH-HOLE -
Terminal pitch 0.635 mm 2.54 mm -
Terminal location DUAL DUAL -
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