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P87LPC760BN

Description
8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDSO14
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size290KB,56 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
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P87LPC760BN Overview

8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDSO14

P87LPC760BN Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP14,.3
Reach Compliance Codeunknow
bit size8
CPU series8051
JESD-30 codeR-PDIP-T14
JESD-609 codee4
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply3/5 V
Certification statusNot Qualified
RAM (bytes)128
rom(word)1024
ROM programmabilityUVPROM
speed20 MHz
Maximum slew rate25 mA
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
P87LPC760
Low power, low price, low pin count
(14 pin) microcontroller with 1 kbyte OTP
Preliminary data
IC28 Data Handbook
2002 Mar 07
Philips
Semiconductors

P87LPC760BN Related Products

P87LPC760BN P87LPC760BDH P87LPC760
Description 8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDSO14 8-BIT, OTPROM, 20 MHz, MICROCONTROLLER, PDSO14 Low power, low price, low pin count (14 pin) microcontroller with 1 kbyte OTP
Is it Rohs certified? conform to conform to -
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) -
package instruction DIP, DIP14,.3 TSSOP, TSSOP14,.25 -
Reach Compliance Code unknow unknown -
bit size 8 8 -
CPU series 8051 8051 -
JESD-30 code R-PDIP-T14 R-PDSO-G14 -
Number of terminals 14 14 -
Maximum operating temperature 70 °C 70 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code DIP TSSOP -
Encapsulate equivalent code DIP14,.3 TSSOP14,.25 -
Package shape RECTANGULAR RECTANGULAR -
Package form IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH -
power supply 3/5 V 3/5 V -
Certification status Not Qualified Not Qualified -
RAM (bytes) 128 128 -
rom(word) 1024 1024 -
ROM programmability UVPROM UVPROM -
speed 20 MHz 20 MHz -
Maximum slew rate 25 mA 25 mA -
surface mount NO YES -
technology CMOS CMOS -
Temperature level COMMERCIAL COMMERCIAL -
Terminal form THROUGH-HOLE GULL WING -
Terminal pitch 2.54 mm 0.635 mm -
Terminal location DUAL DUAL -
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