AC SERIES, DUAL 4-INPUT NAND GATE, UUC14
| Parameter Name | Attribute value |
| package instruction | DIE, |
| Reach Compliance Code | unknown |
| series | AC |
| JESD-30 code | X-XUUC-N14 |
| Logic integrated circuit type | NAND GATE |
| Number of functions | 2 |
| Number of entries | 4 |
| Number of terminals | 14 |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| surface mount | YES |
| technology | CMOS |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Base Number Matches | 1 |
| 54AC20MW8 | 54AC20MDS | 5962-8761301CA | BDL36070 | JM38510R75003S2 | JM38510/75003BCA | JM38510R75003SC | |
|---|---|---|---|---|---|---|---|
| Description | AC SERIES, DUAL 4-INPUT NAND GATE, UUC14 | AC SERIES, DUAL 4-INPUT NAND GATE, UUC14 | AC SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | PowerPact B Circuit Breaker, 70A, 3P, 600Y/347V AC, 14kA at 600Y/347 UL EverLink | AC SERIES, DUAL 4-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 | AC SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | AC SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 |
| package instruction | DIE, | DIE, | DIP, DIP14,.3 | - | QCCN, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | - | unknown | unknown | unknown |
| series | AC | AC | AC | - | AC | AC | AC |
| JESD-30 code | X-XUUC-N14 | X-XUUC-N14 | R-GDIP-T14 | - | S-CQCC-N20 | R-GDIP-T14 | R-GDIP-T14 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | - | NAND GATE | NAND GATE | NAND GATE |
| Number of functions | 2 | 2 | 2 | - | 2 | 2 | 2 |
| Number of entries | 4 | 4 | 4 | - | 4 | 4 | 4 |
| Number of terminals | 14 | 14 | 14 | - | 20 | 14 | 14 |
| Package body material | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIE | DIE | DIP | - | QCCN | DIP | DIP |
| Package shape | UNSPECIFIED | UNSPECIFIED | RECTANGULAR | - | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | UNCASED CHIP | IN-LINE | - | CHIP CARRIER | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | - | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | - | 2 V | 2 V | 2 V |
| surface mount | YES | YES | NO | - | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| Terminal form | NO LEAD | NO LEAD | THROUGH-HOLE | - | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | UPPER | UPPER | DUAL | - | QUAD | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | - | 1 | - | - |
| length | - | - | 19.43 mm | - | 8.89 mm | 19.43 mm | 19.43 mm |
| Maximum operating temperature | - | - | 125 °C | - | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | -55 °C | - | -55 °C | -55 °C | -55 °C |
| propagation delay (tpd) | - | - | 11 ns | - | 10 ns | 10 ns | 10 ns |
| Maximum seat height | - | - | 5.08 mm | - | 1.905 mm | 5.08 mm | 5.08 mm |
| Temperature level | - | - | MILITARY | - | MILITARY | MILITARY | MILITARY |
| Terminal pitch | - | - | 2.54 mm | - | 1.27 mm | 2.54 mm | 2.54 mm |
| width | - | - | 7.62 mm | - | 8.89 mm | 7.62 mm | 7.62 mm |