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33305

Description
protoboard smt for sot-953
Categoryaccessories   
File Size201KB,1 Pages
ManufacturerCapital Advanced Technologies
Environmental Compliance  
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33305 Overview

protoboard smt for sot-953

SURFBOARDS
THE BREADBOARDING MEDIUM
FOR
R
SURFACE MOUNT
TM
IDS33305
REV A- 10-2011
33000
SERIES
APPLICATION SPECIFIC ADAPTERS
MODEL
33305
ACCEPTS
SOT-953
PARTIAL
LISTING
5 LEAD
.35 mm
PITCH DEVICES
DEVICE LEAD WIDTH 1.0 To Max 2.5 MM
ALWAYS CONSULT DEVICE DATA SHEET TO INSURE PROPER FIT
Pins on .1 in. Centers designed for use with Solderless
breadboards, Conventional Breadboards, and Sockets
with standard .1 in. centers.
Use For Prototyping, Device Test or Evaluation and SMD
to Through Hole Conversion.
Oversize Pads Permit hand soldering and accept a wide
range of device widths and tolerances.
FIG.
A
B
C
D
E
MM
12.7
8.89
2.54
1.8
.35
1.1
.2
.7
2.5
1.0
3.3
1.57
.5
IN.
.500
.350
.100
.071
.014
.043
.008
.028
.098
.039
.130
.062
.020
NOTE:
BOARD WIDTH
+- .5mm .020in.
BOARD HEIGHT
+-.5mm .020in.
SIP PIN SPACE
+-.20mm .008in.
PAD CENTERLINE
DEVICE LEAD PITCH
PAD LENGTH
PAD WIDTH
GAP
MAX LEAD WIDTH
TYPICAL LEAD WIDTH
LENGTH FROM SHOULDER
+-.5mm .020in.
SINGLE-IN-LINE ( SIP ) PINS
ON .100 in. CENTERS
PAD SET
DRAWINGS
NOT TO
SCALE
F
G
H
I
J
P
S
W
EXAMPLE DEVICE ( J )
AND MAX WIDTH ( I )
PIN SHOULDER HEGHT
PIN WIDTH
TOLERANCES:
If not noted are +- 20%. Nominal values are given. Controlling unit is Millimeters.
Slight Variations due to manufacturing process can occur.
MOUNTING PADS ARE OVERSIZED IN LENGTH TO
ACCEPT A WIDER RANGE OF DEVICE WIDTHS AND
TOLERANCES AND TO PERMIT HAND SOLDERING.
SEE WEBSITE FOR SOLDERING SUGGESTIONS
BOARD SPECIFICATIONS
BOARD MATERIAL:
.8mm, +-.13mm .031in+-..005 in.
Thick G-10 FR-4 Glass Epoxy or equivalent.
CIRCUITS:
1 oz. Copper with RoHS compliant Lead Free
solder coating. Patten Position on board +- .5mm .020in.
RoHS
Compliant
EC 2002/95
Copyright 2011
by
Capital Advanced Technologies, Inc.
All rights reserved. Surfboards is a registered trademark of Capital Advanced Technologies, Inc. The Breadboarding medium for surface mount, and the Leaf Circuit Logo
are trademarks of Capital Advanced Technologies, Inc. All other trademarks are the property of their respective owners. Specifications, availability, and price is subject to change without notice. All information given is believed to
be accurate but is not guaranteed. The user of information given or products represented by such information is responsible for determining the suitability of said information or products for a given purpose. No inducement is
intended or permission granted for infringement of any patent or unauthorized use of any intellectual property of Capital Advanced Technologies or others.
CAPITAL ADVANCED TECHNOLOGIES, INC.
CAROL STREAM, ILLINOIS. USA
PHONE 630-690-1696
FAX 630-690-2498
MADE
IN
WWW.CapitalAdvanced.Com
USA

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