SLIDE SWITCHES
CL-SB
INTERNAL STRUCTURE
2
3
1
RoHS compliant
6
4
5
Part name
Material
Stainless steel (SUS 304)
Polyamido
Polyamide
Polyphenylenesulphide
Copper alloy, gold or silver plate
Copper alloy, gold or silver plate
Copper alloy, gold or silver plate
Flammability
①
Cover
Slider
Housing
Moving contact
Fixed contact
Terminal pin
—
UL-94V-0
UL94 V-0
■
FEATURES
●
Wide variety
(circuit composition, operating direction, terminal shape:
J-hook, Gull wing, Through hole pins)
●
Standardzation of the silver contacts as well as gold
contacts
●
Stroke is 2mm
●
Using heat-resistant resin to support reflow soldering
mounting
●
Adopted Twin-contacts mechanism
②
③
④
⑤
⑥
UL94 V-0
UL-94V-0
—
—
—
■
PART NUMBER DESIGNATION
CL - SB - 2 3 B - 0 2 T
Series name
Form of packaging
T
：
Taping
Bulk in
Bulk in plastic bag
Blank :
plastic bag Blank
No.
of poles
bits
1
：
1 pole
2
：
2 pole
poles
Contact material
1：Silver
2：Gold
No. of
positions
contacts
positions
2
：
2 contacts
3
：
3 contacts
positions
Setting position
0
：
Top setting
1
：
Side setting
Shape of terminal
A
：
J-hook
B
：
Gull wing
C
：
Through hole pins
※Please
refer to the LIST OF PART NUMBERS when placing orders.
Specifications are subject to change without notice.
SLIDE SWITCHES
CL-SB
■
STANDARD SPECIFICATIONS
Operating temperature range
−
40 ~ 85 °C
Storage temperature range
Sealing
Non Washable
0.21 g (CL-SB-12
0.22 g (CL-SB-22
0.26 g (CL-SB-13
0.28 g (CL-SB-23
-0
-0
-0
-0
)
)
)
)
0.21 g (CL-SB-12
0.22 g (CL-SB-22
0.26 g (CL-SB-13
0.28 g (CL-SB-23
-1
-1
-1
-1
)
)
)
)
■
ELECTRICAL CHARACTERISTICS
Contact rating
Non-switching
Switching
Minimum
DC50 V 200 mA
DC12 V 200 mA
DC20 mV 1
μA
(Gold contacts)
10mA (Silver contacts)
DC5 V 10
μA
(Silver contacts)
Non-shorting
70mΩ maximum
（
Gold contacts）
50mΩ maximum
（Silver
contacts）
Net weight
Contact timing
Contact resistance
1.5 mA 1 kHz
20 mV maximum
■
MECHANICAL CHARACTERISTICS
Insulation resistance
No. of positions
Stroke
2 Contacts
(CL-SB- 2 -
Operation force
3 Contacts
(CL-SB- 3 -
Stop strength
Solderability
2, 3
2 mm
1
A B
) 1.5
±
1.0 N {0.153
±
0.102kgf}
2
→ →
A→B / C→B
1.5
±
1.0 N {0.153
±
0.102kgf}
) A→B / C→B
→
→
2.5
±
1.5 N {0.255
±
0.153kgf}
(DC 500V)
100 MΩ minimum (DC100 V)
AC500 V, 60 s
Dielectric strength
■
ENVIRONMENTAL CHARACTERISTICS
Vibration
(Amplitude) 1.5 mm or
(Acceleration) 98 m/s
2
,
10-500-10 Hz, 3 directions for
10 cycles
2 h each
490 m/s
2
, 11 ms
6 directions for 3 times each
Continuous load 10000 cycles
10000 cycles
DC12
±
0.5V,
200
±
10mA
40 °C, Relative humidity 90 ~ 95 %,
240 h
240 h, No load
85 °C, 96 h No load
−
40 °C, 96 h No load
−
40 (0.5 h) ~ 85 °C ( 0.5 h ), 5 cycles
20 N {2.04 kgf} 15 s (Top setting)
20 N {2.04 kgf} 15 s
245
±
3 °C, 2 ~ 3 s
Reflow：255 °C (Peak temperature)
（
Please refer to the profile below）
Reflow : 255 (Peak temt.)
Manual soldering：
<Please refer to the profile
3 ~ 4 s
350
±
10 °C,
below>
Flow : 260±3 , 5~6 s
Manual soldering : 350±10 , 3~4 s
Shock
Load life
Humidity
High temperature exposure
Low temperature exposure
Thermal shock
Soldering heat
Flow : 260
±
3 °C, 5 ~ 6 s
Manual soldering：
380
±
10 °C, 3 ~ 4 s
Shear
Substrate bending
Pull-off strength
5 N {0.51 kgf} 10 s
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf} 10s
{ } : Reference only
Reflow profile for soldering heat evaluation
〉
(°C)
250
Temperature
200
150
100
50
Peak : 250
+5
0
°C
Over 230
°C
※1
A B
※2
A B C
180
°C
150
°C
Pre Heating Zone
90
±
30 s
30
±
10 s
Heating time
Soldering Zone
Reflow : two times maximum
Specifications are subject to change without notice.
MCU
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