• Low ESR, Ultra High-Q, High Self-Resonant Frequencies
• RF & Microwave capacitors
• Voltage range: 50V - 1,500V
• Capacitance range: 0.1pF - 1,000pF
• Operating temperature up to 125°C*
• Porcelain Capacitors P100
• Laser Marked (optional)
• RoHS compliant
ELECTRICAL AND ENVIRONMENTAL SPECIFICATIONS
Electrical specifications
Parameter
Capacitance
Tolerances
Working voltage (WV
DC
)
Temperature coefficient
Insulation Resistance
Dielectric Withstanding
(test voltage applied for 5 seconds)
Aging
Piezo Effect
Value
0.1pF - 1,000pF
A, B, C, D below 10pF
F, G, J, K above 10pF
See capacitance range chart
(100 ± 30) ppm/°C, –55°C to +125°C
10
6
MΩ min.
2.5 x WV
DC
for WV
DC
≤ 500V
1.8 x WV
DC
for extended range values ≥ 820pF
1.5 x WV
DC
for WV
DC
> 500V
none
none
APPLICATIONS
• Cellular Base Station Amplifiers
• Industrial
• Medical (MRI)
• Scientific
Environmental specifications
Parameter
Life Test
Moisture Resistance Test 1
Moisture Resistance Test 2
Value
2,000 hours, +125°C at 2 x WV
DC
(standard WV
DC
range)
And CHB up to 100pF: 1,000 hours, 175°C at 500V
240 hours, 85% relative humidity at 85°C
(ESA/SCC n°3009)
56 days, 93% relative humidity at 40°C
0V, 5V, WV
DC
CIRCUIT APPLICATIONS
• DC to RF Conversion
• Matching Networks
• Tuning, Coupling and DC Blocking
PHYSICAL CHARACTERISTICS
• Chip capacitors for surface mounting with copper
(non magnetic) or nickel barrier and tinning
• Ribbon leads for surface mounting
* The temperature range for the CHB up to 100pF is upgrated from +125°C to +175°C.
HOW TO ORDER
152
Voltage code
500
= 50V
101
= 100V
201
= 200V
251
= 250V
301
= 300V
501
= 500V
601
= 600V
102
= 1,000V
152
= 1,500V
Please refer to voltage given
in capacitance range chart
CH
Dielectric
CH
=
(100±30)
ppm/°C
B
Size code
A
= 0505
B
= 1111
100
Capacitance code
Please refer to
capacitance code
given in capacitance
range chart
J
Tolerance code
A
= ±0.05pF
B
= ±0.1pF
C
= ±0.25pF
D
= ±0.5pF
F
= ±1%
G
= ±2%
J
= ±5%
K
= ±10%
See note 1
S
Termination code
S = Standard:
tin-plated nickel
C = Non-magnetic:
tin-plated copper
See note 2
1
Ribbon code
-:
no lead or ribbon
Available on size
1111:
1
= Micro-strip
ribbons
6
= Radial leads
0.1pF (0R1) non
available with
these terminations.
See note 3
L
Marking code
-:
no marking
L
= laser marking
E
Tape and reel
-:
no tape and reel
E
= horizontal orientation
X
= verticale orientation
CHA:
3,000 components per reel
CHB:
1,000 components per reel
The RoHS tag is
not part of the
reference
Tag added at the
end of P/N for
information
-RoHS
Note 1: For capacitance values less than 10pF, tolerances B, C and D available. Tolerance code A available for: A case for capacitance values of 0.1pF - 4.7pF. B case for capacitance values of 0.1pF - 3.3pF. For capacitance values of 10pF or higher,
tolerances F, G, J and K available.
Note 2: All terminations are backward compatible and lead-free. The non-magnetic terminations are all Magnetism-free Rated.
Note 3: When coding ribbons for the description of the part, the termination has to be mentioned for MR certified types to ensure that only non-magnetic materials are used.
Note 4: Ribbon lead styles capacitors are not available in Tape and Reel.
Examples:
501 CHB 470 J1L any termination material could be used. 501 CHB 470 JC1L only non-magnetic termination materials could be used.
Please consult us for specific requirements.
www.exxelia.com
144
info@exxelia.com
Page revised 06/20
CERAMIC CAPACITORS
Classic HiQ
TYPICAL PERFORMANCE DATA CHA (0505 SIZE):
S-Parameters available with ABC software.
ESR VERSUS FREQUENCY
ESR (Ω)
10pF
56pF
68 pF
General characteristics
CH Series
TYPICAL PERFORMANCE DATA CHB (SIZE 1111):
S-Parameters available with ABC software.
ESR VERSUS FREQUENCY
ESR (Ω)
10 pF
27 pF
33 pF
0.10
0.10
0.01
100
0.01
Frequency (MHz)
1,000
100
Frequency (MHz)
1,000
CURRENT RATING VERSUS CAPACITANCE
10
CURRENT RATING VERSUS CAPACITANCE
RMS current (A)
2 GHz
1 GHz
500 MHz
RMS current (A)
T max = 125°C
T amb = 25°C
10
1
1
0.1
1
0.1
T max = 125°C
T amb = 25°C
Capacitance (pF)
10
100
1
10
Capacitance (pF)
100
1000
Q FACTOR VERSUS FREQUENCY
100,000
Q FACTOR VERSUS FREQUENCY
100,000
Q factor
Q factor
10,000
10,000
1,000
1,000
100
100
10
10
1
10
1
Frequency (MHz)
100
1,000
10
Frequency (MHz)
100
1,000
SERIES RESONANCE FREQUENCY VERSUS CAPACITANCE
Frequency (MHz)
10,000
SERIES RESONANCE FREQUENCY VERSUS CAPACITANCE
10,000
Frequency (MHz)
1,000
1,000
100
1
100
Capacitance (pF)
10
100
1
10
Capacitance (pF)
100
1,000
www.exxelia.com
145
info@exxelia.com
Page revised 06/20
RF CAPACITORS
CERAMIC CAPACITORS
CH Series
Taping : dimensions
DIMENSIONS in inches (mm)
Chips
Micro-strip ribbon leads (Type 1)
Radial leads (Type 6)
Classic HiQ
STANDARD RATINGS
Size
Size code
L
Dimensions
inches (mm)
W
T
e
Value (pF)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
Cap. Code
0R1
0R2
0R3
0R4
0R5
0R6
0R7
0R8
0R9
1R0
1R1
1R2
1R3
1R4
1R5
1R6
1R7
1R8
1R9
2R0
2R1
2R2
2R4
2R7
3R0
3R3
3R6
3R9
4R3
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
0505
A
0.055 ± 0.01
(1.4 ± 0.25)
0.055 ± 0.01
(1.4 ± 0.25)
0.056 max
(1.4 max)
0.01 ± 0.006
(0.25 ± 0.15)
Standard
1111
B
0.11 ± 0.016
(2.8 ± 0.4)
0.11 ± 0.016
(2.8 ± 0.4)
0.103 max
(2.6 max)
0.016 ± 0.01
(0.4 ± 0.25)
Standard
Extended
Value (pF)
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
250V
500V
1,500V
300
330
360
390
430
470
510
560
620
680
750
820
910
1,000
Dimensions
inches (mm)
Size
Size code
L
W
T
e
Cap. Code
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
50V
300V
100V
200V
600V
300V
1,000V
200V
500V
1,500V
0505
A
0.055 ± 0.01
(1.4 ± 0.25)
0.055 ± 0.01
(1.4 ± 0.25)
0.056 max
(1.4 max)
0.01 ± 0.006
(0.25 ± 0.15)
Standard
1111
B
0.11 ± 0.016
(2.8 ± 0.4)
0.11 ± 0.016
(2.8 ± 0.4)
0.103 max
(2.6 max)
0.016 ± 0.01
(0.4 ± 0.25)
Standard
Extended
Special values, tolerances, higher WV
DC
and matching available, please consult factory.
www.exxelia.com
146
info@exxelia.com
Page revised 06/20
CERAMIC CAPACITORS
General Information
Taping : dimensions
CAPACITOR TERMINATIONS AND SOLDERING
RECOMMENDATIONS
I. TERMINATION TYPES
Our capacitors are delivered with one of the following terminations (for
technical reasons, only a limited number of termination types are available in
certain cases). All our terminations are backward compatible.
Parameter
Termination
Materials
Value
A
C
S
Comment
non-magnetic (silver-palladium)
non-magnetic (pure tin over copper barrier)
lead-free (pure tin over nickel barrier)
condition. The vapor phase and IR reflow soldering are less aggressive,
inducing more restricted thermal shocks. This is the reason why they are
preferred to the wave soldering method for reliable applications. In all cases,
proper pre-heating is essential.
The circuit should be pre-heated at a typical rate of 1°C/s within 65°C to 100°C of
the maximum soldering temperature. While multilayer ceramic capacitors can
withstand the peak soldering temperatures for short durations, they should be
minimized whenever possible.
Above precaution given for SMD types are applicable for the implementation
of large bare chips (1515 and above). But in general, large bare chips above
2225 are not recommended to be mounted on epoxy printed board due to the
thermal expansion mismatch between ceramic capacitor body and epoxy. This
is the reason why leaded components will be preferred especially for reliable
applications.
For information, the typical thermal profiles of these three soldering processes
are given hereafter. These typical diagrams are only given as an aid to SMD
users in determining specific processes linked to their instrumentations and
to their own experience.
NB: reference documents are IEC 61760-1, CECC30000 and IEC68 standards.
Please, refer to this standard for more information.
NB:
• terminations type C recommended for non magnetic applications.
• termination type A available for non magnetic applications (for historical
reason, we have also another code, the code “P”, for the same type of
termination. The parts that were designed-in before 2005 might still have
a code “P” instead of “A” in the part numbering. But both codes correspond
to the same type of termination).
II. SPECIFICATIONS
Care must be taken when using particular terminations: if the terminations are
heated up above a particular temperature and/or for too long a period of time,
there is a risk of leaching (dissolution of the termination revealing the inner
electrodes).
The chart below gives the resistance to soldering heat per termination type,
based on a SAC387 solder bath at 260°C.
Dielectric Type
CHA / SHA
CHB / SHB
CPX / CLX / CPE / CLE
CLF
SHL
SHS
SHF / SHN / SHT
5
±1s
(2)
10
±1s
(4)
10
±2s
(1)
A
C
10
±1s
(3)
30
±2s
30
±2s
On request
S
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
120
±5s
III.1.1. Vapour Phase Soldering
250°C
230°C
217°C
200°C
20s ... 40s
ca. 60s ... 130s
>217°C
Ramp down
rate <6K/s
150°C
100°C
Ramp up
rate <3K/s
50°C
0°C
0s
20s
40s 60s
80s 100s 120s 140s 160s 180s 200s 220s 240s
Lead free SnAgCu solders - Vapour Phase
250°C
210°C
20s ... 40s
(1): results extrapolated from 30±2s data obtained with Sn62/Pb36/Ag2 solder bath.
(2): data obtained with Sn62/Pb36/Ag2 solder bath.
(3): termination only available on CHA series.
(4): preliminary data.
200°C
180°C
150°C
ca. 60s ... 150s
<180°C
Ramp down
rate <6K/s
Ramp up
rate <3K/s
100°C
III. STANDARD SMD REQUIREMENTS
III.1. Soldering Recommendations
Regarding the soldering attachments, three methods are generally used: the
vapor phase soldering, the infrared reflow soldering and the wave soldering.
Unless particular skill about the use of the wave soldering, this method is not
recommended since the melted solder is directly in contact with the ceramic.
This can potentially crack the capacitor because the ceramic is sensible to the
thermal shocks. Moreover, this method needs to maintain the components
with an insulating resin which increases the thermo-mechanical strains
between the ceramic and the board both on soldering phase and operating
50°C
0°C
0s
20s
40s 60s
80s 100s 120s 140s 160s 180s 200s 220s 240s
SnPb solders – Infrared Soldering
NB: the lines indicate the upper and lower limits of typical process (terminal
temperature).
www.exxelia.com
120
info@exxelia.com
Page revised 06/20
CERAMIC CAPACITORS
General characteristics
General Information
III.1.2. Infrared Soldering
300°C
250°C
200°C
150°C
100°C
50°C
0°C
0s
Ramp up
rate <3K/s
Ramp down
rate <6K/s
245°C
235°C
220°C
Preheating
ca. 45s ... 90s
>220°C
III.2. Moisture Sensitivity Classification
Our standard lead-free terminations - S and C types - have been fully tested
and are compliant with the requirements mentioned in specification JEDEC STD
020 (level 1: not moisture sensitive).
III.3. Whiskers Classification
Our standard lead-free terminations - S and C types - have been fully tested
and are compliant with the requirements mentioned in specification JEDEC
STD 201. Our terminations exhibit a matte finish and receive a special heat
treatment to relieve stress inside the tin.
III.4. Pad Dimensions
The metalized pads on the end user’s substrate must be properly designed.
Improper spacing or dimensioning of the pads may result in poor solder joints
or a tombstone effect. Pad designs are given below for the most common sizes
of multilayer ceramic capacitors for both wave and reflow soldering.
1. For example, C8051F350, its internal reference voltage is 2.5V. If the analog voltage range I want to measure is 0~5V, isn't it over the range? 2. For example, ADS1211, its input analog voltage ran...
1. Introduction
The previous article [ https://bbs.eeworld.com.cn/thread-1191327-1-1.html ] briefly introduced the use of ST60 and tested the distance parameters. It was found that the angle and dista...
The problem is as the title says: In PCB drawing, after selecting (S+P) a certain network, F11 enters the revision interface. When I change the attribute layer from TOP to bottom, the attributes of th...
To enable real-time monitoring of home security and automatically dial a number for voice prompts or send text messages when an alarm occurs, a GPRS-based embedded telephone alarm system was design...[Details]
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
Recently, AstroBo Robot, a subsidiary of Chenxing Automation, launched a new mobile collaborative palletizing product. Leveraging an omnidirectional mobile chassis, an intelligent scheduling system...[Details]
Chinese characters are extensive and profound, and there are many different names for ESD tubes. How many of them do you know?
As far as I know, ESD diodes are currently known as ESD p...[Details]
According to Nikkei, a survey found that global electric vehicle battery supply is expected to reach more than three times the required quantity due to
cooling
demand for electric vehicles,...[Details]
Tiantai Robot's official Weibo account announced on the evening of August 20 that Tiantai Robot Co., Ltd., together with strategic partners including Shandong Future Robot Technology Co., Ltd., Sha...[Details]
MQTT Ethernet I/O modules primarily collect I/O port information and transmit data over the network. In addition to being a TCP server, Ethernet I/O modules can also function as TCP clients. Furthe...[Details]
The driving mode is not unfamiliar to vehicles. According to the driving mode of the vehicle, there are front-wheel drive, rear-wheel drive and even four-wheel drive. Four-wheel drive is a major se...[Details]
On August 21, it was reported that Intel's new generation of AI chip Jaguar Shores was recently exposed for the first time.
According to photos shared by Andreas Schilling, the Jaguar Shores t...[Details]
introduction
Inverter air conditioners are a trend in the current era and have gradually become commonplace in countless households. Beyond their basic cooling and heating functions, air condi...[Details]
High-definition media consumption is experiencing a dual growth: an increase in the number of consumers and a transition to higher-definition content. This growth is driven by increasingly widespre...[Details]
With the prevalence of online conferencing, live streaming, and voice communication in gaming, high-quality audio input devices are becoming increasingly important. To this end, XMOS, an expert in ...[Details]
introduction
As core electronic components used in vastly different fields, automotive-grade chips and mobile/consumer-grade chips exhibit significant differences in their...[Details]
The evolution of high-speed networks remains guided by the same core objectives: increasing data rates, reducing latency, improving reliability, lowering power consumption, and maintaining or exten...[Details]
Since the beginning of the 21st century, with the rapid development of my country's urban and rural economies and the improvement of people's living standards, more and more people have begun to ow...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
