microwire serial eeprom
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Catalyst |
| package instruction | SOP, SOP8,.3 |
| Reach Compliance Code | unknown |
| Spare memory width | 8 |
| Data retention time - minimum | 100 |
| Durability | 100000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e0 |
| memory density | 8192 bit |
| Memory IC Type | EEPROM |
| memory width | 16 |
| Number of terminals | 8 |
| word count | 512 words |
| character code | 512 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 512X16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP8,.3 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Serial bus type | MICROWIRE |
| Maximum standby current | 0.00001 A |
| Maximum slew rate | 0.004 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| write protect | HARDWARE/SOFTWARE |

| CAT35C108KI-TE7 | CAT35C108K-TE7 | |
|---|---|---|
| Description | microwire serial eeprom | microwire serial eeprom |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Catalyst | Catalyst |
| package instruction | SOP, SOP8,.3 | SOP, SOP8,.3 |
| Reach Compliance Code | unknown | unknown |
| Spare memory width | 8 | 8 |
| Data retention time - minimum | 100 | 100 |
| Durability | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e0 | e0 |
| memory density | 8192 bit | 8192 bit |
| Memory IC Type | EEPROM | EEPROM |
| memory width | 16 | 16 |
| Number of terminals | 8 | 8 |
| word count | 512 words | 512 words |
| character code | 512 | 512 |
| Maximum operating temperature | 85 °C | 70 °C |
| organize | 512X16 | 512X16 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP |
| Encapsulate equivalent code | SOP8,.3 | SOP8,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Serial bus type | MICROWIRE | MICROWIRE |
| Maximum standby current | 0.00001 A | 0.00001 A |
| Maximum slew rate | 0.004 mA | 0.003 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| write protect | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |