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IDT71T016SA12BFG8

Description
Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48
Categorystorage    storage   
File Size100KB,9 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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IDT71T016SA12BFG8 Overview

Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48

IDT71T016SA12BFG8 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeBGA
package instruction7 X 7 MM, PLASTIC, FBGA-48
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time12 ns
JESD-30 codeS-PBGA-B48
JESD-609 codee1
length7 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals48
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX16
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.34 mm
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width7 mm
Base Number Matches1
2.5V CMOS Static RAM
1 Meg (64K x 16-Bit)
Features
x
x
Advance
Information
IDT71T016SA
Description
The IDT71T016 is a 1,048,576-bit high-speed Static RAM organized
as 64K x 16. It is fabricated using IDT’s high-perfomance, high-reliability
CMOS technology. This state-of-the-art technology, combined with inno-
vative circuit design techniques, provides a cost-effective solution for high-
speed memory needs.
The IDT71T016 has an output enable pin which operates as fast as
5ns, with address access times as fast as 10ns. All bidirectional inputs and
outputs of the IDT71T016 are LVTTL-compatible and operation is from a
single 2.5V supply. Fully static asynchronous circuitry is used, requiring
no clocks or refresh for operation.
The IDT71T016 is packaged in a JEDEC standard a 44-pin Plastic
SOJ, 44-pin TSOP Type II, and a 48-ball plastic 7 x 7 mm FBGA.
x
x
x
x
x
x
64K x 16 advanced high-speed CMOS Static RAM
Equal access and cycle times
— Commercial: 10/12/15/20ns
— Industrial: 12/15/20ns
One Chip Select plus one Output Enable pin
Bidirectional data inputs and outputs directly
LVTTL-compatible
Low power consumption via chip deselect
Upper and Lower Byte Enable Pins
Single 2.5V power supply
Available in 44-pin Plastic SOJ, 44-pin TSOP, and 48-Ball
Plastic FBGA packages
Functional Block Diagram
OE
Output
Enable
Buffer
A
0
– A
15
Address
Buffers
Row / Column
Decoders
I/O
15
Chip
Enable
Buffer
Sense
Amps
and
Write
Drivers
8
Low
Byte
I/O
Buffer
8
8
High
Byte
I/O
Buffer
8
CS
I/O
8
WE
Write
Enable
Buffer
64K x 16
Memory
Array
16
I/O
7
I/O
0
BHE
Byte
Enable
Buffers
BLE
5326 drw 01
AUGUST 2001
1
©2001 Integrated Device Technology, Inc.
DSC-5326/00

IDT71T016SA12BFG8 Related Products

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Description Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48 Standard SRAM, 64KX16, 20ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48 Standard SRAM, 64KX16, 20ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48 Standard SRAM, 64KX16, 15ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 Standard SRAM, 64KX16, 20ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 Standard SRAM, 64KX16, 15ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48 Standard SRAM, 64KX16, 15ns, CMOS, PBGA48, 7 X 7 MM, PLASTIC, FBGA-48 Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
Parts packaging code BGA BGA BGA SOJ SOJ SOJ BGA BGA TSOP2
package instruction 7 X 7 MM, PLASTIC, FBGA-48 7 X 7 MM, PLASTIC, FBGA-48 7 X 7 MM, PLASTIC, FBGA-48 SOJ, SOJ, SOJ, 7 X 7 MM, PLASTIC, FBGA-48 7 X 7 MM, PLASTIC, FBGA-48 0.400 INCH, TSOP2-44
Contacts 48 48 48 44 44 44 48 48 44
Reach Compliance Code compliant compli compliant unknown unknown unknown compliant compliant unknown
ECCN code 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Maximum access time 12 ns 20 ns 20 ns 15 ns 20 ns 12 ns 15 ns 15 ns 12 ns
JESD-30 code S-PBGA-B48 S-PBGA-B48 S-PBGA-B48 R-PDSO-J44 R-PDSO-J44 R-PDSO-J44 S-PBGA-B48 S-PBGA-B48 R-PDSO-G44
JESD-609 code e1 e1 e1 e3 e3 e3 e1 e1 e3
length 7 mm 7 mm 7 mm 28.575 mm 28.575 mm 28.575 mm 7 mm 7 mm 18.41 mm
memory density 1048576 bit 1048576 bi 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 16 16 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 48 48 48 44 44 44 48 48 44
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 64KX16 64KX16 64KX16 64KX16 64KX16 64KX16 64KX16 64KX16 64KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFBGA SOJ SOJ SOJ LFBGA LFBGA TSOP2
Package shape SQUARE SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 260 260 NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.34 mm 1.34 mm 1.34 mm 3.683 mm 3.683 mm 3.683 mm 1.34 mm 1.34 mm 1.2 mm
Maximum supply voltage (Vsup) 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER MATTE TIN MATTE TIN MATTE TIN TIN SILVER COPPER TIN SILVER COPPER Matte Tin (Sn) - annealed
Terminal form BALL BALL BALL J BEND J BEND J BEND BALL BALL GULL WING
Terminal pitch 0.75 mm 0.75 mm 0.75 mm 1.27 mm 1.27 mm 1.27 mm 0.75 mm 0.75 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM DUAL DUAL DUAL BOTTOM BOTTOM DUAL
Maximum time at peak reflow temperature 30 30 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30 30 NOT SPECIFIED
width 7 mm 7 mm 7 mm 10.16 mm 10.16 mm 10.16 mm 7 mm 7 mm 10.16 mm
Base Number Matches 1 1 1 1 1 1 1 1 1
Is it lead-free? Lead free Lead free Lead free - - - Lead free Lead free -
Is it Rohs certified? conform to conform to conform to - - - conform to conform to conform to
Humidity sensitivity level 3 3 3 - - - 3 3 3
Maker - - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)

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