The DAC900 is a high-speed, digital-to-analog converter (DAC)
offering a 10-bit resolution option within the
SpeedPlus
family
of high-performance converters. Featuring pin compatibility
among family members, the DAC908, DAC902, and DAC904
provide a component selection option to an 8-, 12-, and 14-bit
resolution, respectively. All models within this family of D/A
converters support update rates in excess of 165MSPS with
excellent dynamic performance, and are especially suited to
fulfill the demands of a variety of applications.
The advanced segmentation architecture of the DAC900 is
optimized to provide a high Spurious-Free Dynamic Range
(SFDR) for single-tone, as well as for multi-tone signals—
essential when used for the transmit signal path of communica-
tion systems.
The DAC900 has a high impedance (200kΩ) current output with
a nominal range of 20mA and an output compliance of up to
1.25V. The differential outputs allow for both a differential, or
single-ended analog signal interface. The close matching of the
current outputs ensures superior dynamic performance in the
differential configuration, which can be implemented with a
transformer.
Utilizing a small geometry CMOS process, the monolithic
DAC900 can be operated on a wide, single-supply range of
+2.7V to +5.5V. Its low power consumption allows for use in
portable and battery operated systems. Further optimization can
be realized by lowering the output current with the adjustable
full-scale option.
For noncontinuous operation of the DAC900, a power-down
mode results in only 45mW of standby power.
The DAC900 comes with an integrated 1.24V bandgap refer-
ence and edge-triggered input latches, offering a complete
converter solution. Both +3V and +5V CMOS logic families
can be interfaced to the DAC900.
The reference structure of the DAC900 allows for additional
flexibility by utilizing the on-chip reference, or applying an
external reference. The full-scale output current can be adjusted
over a span of 2mA to 20mA, with one external resistor, while
maintaining the specified dynamic performance.
The DAC900 is available in SO-28 and TSSOP-28 packages.
+V
A
DAC900
BW
+V
D
FSA
REF
IN
Current
Sources
LSB
Switches
Segmented
Switches
I
OUT
I
OUT
BYP
INT/EXT
Latches
+1.24V Ref.
10-Bit Data Input
AGND
CLK
D9...D0
DGND
PD
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
, while driving a virtual ground. (2) Measured single-ended into 50Ω Load. (3) Nominal full-scale output current is 32x I
REF
; see Application
Section for details. (4) Reference bandwidth depends on size of external capacitor at the BW pin and signal level. (5) Typically 45µA for the PD pin, which has an
internal pull-down resistor. (6) Measured at f
CLOCK
= 50MSPS and f
OUT
= 1.0MHz.
ABSOLUTE MAXIMUM RATINGS
+VA to AGND ........................................................................ –0.3V to +6V
+VD to DGND ........................................................................ –0.3V to +6V
AGND to DGND ................................................................. –0.3V to +0.3V
+VA to +VD .............................................................................. –6V to +6V
CLK, PD to DGND ...................................................... –0.3V to VD + 0.3V
D0-D9 to DGND .......................................................... –0.3V to VD + 0.3V
I
OUT
, I
OUT
to AGND ............................................................ –1V to VA + 0.3V
BW, BYP to AGND ....................................................... –0.3V to VA + 0.3V
REFIN, FSA to AGND .................................................. –0.3V to VA + 0.3V
INT/EXT to AGND ........................................................ –0.3V to VA + 0.3V
Junction Temperature .................................................................... +150°C
Case Temperature ......................................................................... +100°C
Storage Temperature ..................................................................... +125°C
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
PACKAGE
DRAWING
NUMBER
217
SPECIFIED
TEMPERATURE
RANGE
–40°C to +85°C
PACKAGE
MARKING
DAC900U
ORDERING
NUMBER
(1)
DAC900U
DAC900U/1K
DAC900E
DAC900E/2K5
TRANSPORT
MEDIA
Rails
Tape and Reel
Rails
Tape and Reel
PRODUCT
DAC900U
PACKAGE
SO-28
"
DAC900E
"
TSSOP-28
"
360
"
–40°C to +85°C
"
DAC900E
"
"
"
"
"
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “DAC900E/2K5” will get a single 2500-piece Tape and Reel.
DEMO BOARD ORDERING INFORMATION
PRODUCT
DAC900U
DAC900E
DEMO BOARD
ORDERING NUMBER
DEM-DAC90xU
DEM-DAC900E
COMMENT
Populated evaluation board without D/A converter. Order sample of desired DAC90x model separately.
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