LX1677
TM
®
AMD64 Processor VRM Controller
P
RODUCTION
D
ATA
S
HEET
DESCRIPTION
KEY FEATURES
High Current Biphase
Operation
Outputs As Low As 0.800V
† Biphase LoadSHARE
TM
‡ Transient Correction Loop™
Reduces Required
Capacitance
Differential Amplifier For
Remote Voltage Sensing
Integrated High Current
MOSFET Drivers
200KHz to 1MHz Frequency
Operation
Programmable Slew Rate
Control For Start-Up Sequence
and VID change
VID Changes On The Fly
Power Good Indicator
Short Circuit Protection
Output Over Voltage and
Under Voltage Protection
No current-sense resistors
APPLICATIONS
The LX1677 is a highly integrated
VRM power supply controller IC
featuring two PWM switching
regulator stages.
The two constant frequency
voltage-mode PWM phases are
configured as a single biphase high
current output core supply.
In biphase operation, the high
current (>35A) output is generated by
a LoadSHARE
TM
† technique that
balances the currents in the two
phases. Power loss and noise, due to
the ESR of the input capacitors, are
minimized by operating the PWMs
180° out of phase.
A
synchronized
Transient
Correction
Loop†
provides
exceptional control of the output
droop and overshoot during very high
di/dt load changes, the circuit can be
configured for droop only, overshoot
only or both.
This architecture also minimizes
capacitor
requirements
while
maximizing regulator response.
A true differential input amplifier is
used for remote voltage sensing at the
processor core.
A VID code generator provides an
internal reference that will set the
output voltage. This VID code can be
changed during operation and the
reference will slew the output voltage to
its new setting at a preset rate. During
VID changes on the fly the Power Good
indication will stay valid.
The current through the lower phase
1 MOSFET will be sampled using its
R
DS(ON)
for current limit and shut
down.
For further protection, an over
voltage circuit will trip at a specified
setting and clamp the output by turning
off the upper MOSFETs and turning on
the lower MOSFETs.
The upper MOSFET drivers use a
bootstrap capacitor to provide the upper
drive voltage over the input voltage
range of 6 to 24 volts.
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Microsemi
.C
OM
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
†
Protected By US Patents: US6292378,US6285571
‡ Protected By US Patents: US6825571, US6356063, US6605931
AMD Athlon 64™ and AMD
Opteron™ Processors
Processor Core Voltage Supply
Voltage Regulator Modules
PRODUCT HIGHLIGHT
T r a n s ie n t C o r e c tio n L o o p
V in + 5 V
V in 6 to 2 4 V
70nH
5 B it V ID
LX1677
V in 6 to 2 4 V
Vout
LX1677
LX1677
PACKAGE ORDER INFO
T
J
(°C)
0 to 70
PW
Plastic TSSOP
38-Pin
LX1677CPW
LQ
Plastic MLPQ
38-Pin
LX1677CLQ
RoHS Compliant / Pb-free Transition DC: 0518
RoHS Compliant / Pb-free Transition DC: 0512
Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX1677CLQ-TR)
Copyright
©
2000
Rev 1.1, 2003-03-03
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
LX1677
TM
®
AMD64 Processor VRM Controller
P
RODUCTION
D
ATA
S
HEET
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
WWW .
Microsemi
.C
OM
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
x
denotes respective pin designator 1, 2, or 3
THERMAL DATA
LQ
Plastic MLPQ 38-Pin
8°C/W
35°C/W
THERMAL RESISTANCE
-
JUNCTION TO
C
ASE
,
θ
JC
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
PW
Plastic TSSOP 38-Pin
12.2°C/W
38°C/W
THERMAL RESISTANCE
-
JUNCTION TO
C
ASE
,
θ
JC
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
EA2-
EO2
FB+
FB-
DFOUT
EO1
EA1-
DACOUT
PWGD
GND
VIN
ROSC
ENA
VID4
VID3
VID2
VID1
VID0
VS2
1
VID2
VID1
VID0
VS2
HO2
VC2
VCC
Supply Input Voltage (VCCL, VCC)................................................-0.3V to 6.0V
Battery Input Voltage (VIN) ..............................................................-0.3V to 24V
Current Limit Sense (ILIM1, ILIM3) ................................................-0.3V to 30V
Topside Driver Supply Input Voltage (VC1, VC2, VC3)........ -0.3 to VSx + 6.0V
Topside Driver Return Input Voltage (VS1, VS2)................................-5V to 24V
Differential Sense Input Voltage (FB+, FB-)....................................-0.3V to 6.0V
VID0 – VID4, Input Voltage ...............................................................-0.3V to 6V
High Side Driver Peak (<500ns) Current (HO1/2, I-MAX) ............................+1A
Low Side Driver Peak (<500ns) Sink Current (LO1/2, I-MIN)....................+1.5A
Operating Junction Temperature.................................................................. 150°C
Storage Temperature Range...........................................................-65°C to 150°C
Lead Temperature (Soldering 10 seconds) .................................................. 300°C
RoHS Peak Package Solder Reflow Temperature
(40 second maximum exposure) ..................................................... 260°C (+0, -5)
FB+
EO2
EA2-
LP2
LP1
ILIM1
FB-
DFOUT
EO1
EA1-
DACOUT
PWGD
GND
VIN
ROSC
ENA
VID4
VID3
1
2
3
4
5
6
7
8
9
10
11
12
38
37 36
35
34
33
32
ILIM3
31
30
29
28
27
Connect Bottom to
Power GND
26
25
24
23
22
21
13
14
15
16
17
18
19
20
VS3
I-MAX
VC3
VC1
HO1
VS1
LO1
PGN
LO2
VCCL
I-MIN
PGN3
LQ P
ACKAGE
(Top View)
38
19
20
(Top View)
LP2
LP1
ILIM1
ILIM3
VS3
I-MAX
VC3
VC1
HO1
VS1
LO1
PGN
LO2
VCCL
I-MIN
PGN3
VCC
VC2
HO2
PW P
ACKAGE
RoHS / Pb-free 100% Matte Tin Lead Finish
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
RECOMMENDED OPERATING CONDITIONS
Parameter
IC Input Supply Voltage
Battery Input Voltage
Biphase Topside Driver Return Voltage
Transient Correction Phase Driver Return Voltage
Symbol
VCC
VIN
VS1, VS2
VS3
LX1677
Min
Typ
4.5
5.7
0
0
Units
V
V
V
V
Max
5.5
24.0
24.0
5.5
P
ACKAGE
D
ATA
P
ACKAGE
D
ATA
Copyright
©
2000
Rev 1.1, 2003-03-03
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
LX1677
TM
®
AMD64 Processor VRM Controller
P
RODUCTION
D
ATA
S
HEET
FUNCTIONAL PIN DESCRIPTION
Name
FB+
FB-
DFOUT
EA1-
EO1
GND
ROSC
ENA
DACOUT
VID4
VID3
VID2
VID1
VID0
PWGD
VCC
VC3
PGN3
I-MIN
VS3
I-MAX
ILIM3
LP1
EA2-
EO2
LP2
VIN
LO2
VS2
HO2
VC2
PGN
LO1
ILIM1
VS1
HO1
VC1
VCCL
Description
Differential Amplifier Positive Input – Feedback from output
Differential Amplifier Negative Input – Feedback from output
Differential Amplifier Output
Phase 1 Error Amplifier Negative Input
Phase 1 Error Amplifier Output
Analog Ground
A resister to ground sets PWM frequency
Enable Input – Logic Low disables all converter phases
DAC Output voltage – 50uA bi-directional current source
Digital Input for VID code – Has an internal pull-up resister
Digital Input for VID code – Has an internal pull-up resister
Digital Input for VID code – Has an internal pull-up resister
Digital Input for VID code – Has an internal pull-up resister
Digital Input for VID code – Has an internal pull-up resister
Power Good Output Pin – Open drain output pin for power good indication. High = Power Good
IC Supply Voltage. Nominal +5V
Supply for transient correction phase upper MOSFET driver, bootstrap voltage
Power ground pin for Transient Correction Loop driver
Output Driver for lower Transient Correction Loop MOSFET
Low side of upper driver for Transient Correction Loop – MOSFET Driver power return
Output Driver for upper Transient Correction Loop MOSFET
Transient Correction Loop current sense – A resister sets an upper limit for over current detection and shut down.
Phase 2 differential amplifier positive input, filtered feedback from phase 1 output
Negative Input of phase 2 integrating amplifier
Output of phase 2 integrating amplifier
Phase 2 differential amplifier negative input, filtered feedback from phase 2 output
Battery Voltage Input.
Driver Output for phase 2 lower MOSFET
Low side of upper gate driver for phase 2.
Driver Output for phase 2 upper MOSFET
Supply for phase 2 upper MOSFET driver, bootstrap voltage
Power ground pin for current sensing of lower MOSFET R
DS(ON)
for phase 1.
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OM
P
ACKAGE
D
ATA
P
ACKAGE
D
ATA
Driver Output for phase 1 lower MOSFET
Over-Current Limit Set – A resister sets an upper limit for over current detection and shut down.
Low side of upper gate driver for phase #1.
Driver Output for phase 1 upper MOSFET
Supply for phase 1 upper MOSFET driver, bootstrap voltage
Voltage bus for the lower MOSFET drivers. Nominal +5V
Copyright
©
2000
Rev 1.1, 2003-03-03
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 3
LX1677
TM
®
AMD64 Processor VRM Controller
P
RODUCTION
D
ATA
S
HEET
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C
≤
T
A
≤
70°C except where
otherwise noted and the following test conditions: VCC = 5V, VCCL = 5V, VIN = 12V, Switching Frequency = 500KHz.
Parameter
REGULATOR
WWW .
Microsemi
.C
OM
Symbol
Test Conditions
ENA = VCC, FB+ = FB-
ENA = GND
ENA = VCC, FB+ = FB-
ENA = VCC, FB+ = FB-
Common Mode Voltage (V
CM
) = 1.4V
Min
1
LX1677
Typ
5
0.5
2
Max
9
1
1
4
6
100
Units
mA
µA
mA
mA
mV
nA
dB
V
V
MHz
IC Supply Current
Low Side Driver Operating
Current
High Side Driver Operating
Current
ERROR AMPLIFIER: PHASE 1
I
Q(VCC)
I
Q(VCCL)
I
Q(VCx)
V
OS
I
EA1
V
ICM
V
EO1(MAX)
V
EO1(MIN)
UGBW
V
OS
A
DA
CMRR
DA
R
IN
V
CM
V
DFOUT(MAX)
V
DFOUT (MIN)
UGBW
SR
f
MAX
f
MIN
Input Offset Voltage
Input Bias Current
DC Open Loop Gain
Input Common Mode Range
Output Voltage Swing
Unity Gain Bandwidth
DIFFERENTIAL AMPLIFIER
CMRR > 50dB
I
EA1
= 2mA
I
EA1
= -20µA
-6
-100
60
0.8
70
2.5
4.0
0.15
20
0.5
Input Offset Voltage
Gain
Common Mode Rejection Ratio
Input Resistance
Input Common Mode Range
Source / Sink Current
Output Voltage Swing
Unity Gain Bandwidth
Slew Rate
OSCILLATOR
V
CM
=1.4V
0.8V < V
CM
< 2.5V
Measured at FB+ Input
-6
0.99
1
65
30
5
4.0
0.2
10
5
6
1.01
0
V
DFOUT
= 0V
I
DFOUT
= 2mA
I
EA1
= -20µA
3
mV
V/V
dB
KΩ
V
mA
V
MHz
V/µs
Maximum Clock Frequency
Minimum Clock Frequency
Frequency Stability
PWM OUTPUT
R
PWM
=10kΩ
R
PWM
=50kΩ
0.9
150
1
200
4
1.1
220
MHz
KHz
%
%
nS
nS
V
Maximum Duty Cycle
Minimum Pulse Width
Dead Time
Ramp Amplitude
PHASE 2 INTEGRATING AMPLIFIER
DC
MAX
t
PWM(MIN)
V
RAMP
During Transient Correction Switching
Transient Correction Not Switching
3000pF Load
3000pF Load at 50% of VCCL
VIN = 6V
VIN = 12
VIN = 24V
V
CM
=1.4V
I
EA2
= 2mA
I
EA2
= -20µA
40
50
60
80
0.70
1.40
2.80
100
50
200
E
LECTRICALS
E
LECTRICALS
Input Offset Voltage
DC Open Loop Gain
Output Voltage Swing
Unity Gain Bandwidth
V
OS
V
EO2(MAX)
V
EO2(MIN)
UGBW
-6
70
4.0
0.15
20
6
mV
dB
V
MHz
0.5
Copyright
©
2000
Rev 1.1, 2003-03-03
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 4
LX1677
TM
®
AMD64 Processor VRM Controller
P
RODUCTION
D
ATA
S
HEET
ELECTRICAL CHARACTERISTICS (CONT)
Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C
≤
T
A
≤
70°C except where
otherwise noted and the following test conditions: VCC = 5V, VCCL = 5V, VIN = 12V, Switching Frequency = 500KHz.
Parameter
PHASE 2 DIFFERENTIAL AMPLIFIER
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Microsemi
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OM
Symbol
V
OS
A
DA
CMRR
DA
R
B
UGBW
LP1=LP2
Test Conditions
Min
-6
0.98
LX1677
Typ
Max
6
1.02
Units
mV
V/V
dB
KΩ
MHz
Input Offset Voltage
Gain
Common Mode Rejection Ratio
Input Resistance
Unity Gain Bandwidth
TRANSIENT CONTROL LOOP
Common Mode Voltage = 0 to 2 V
1
60
180
4
Voltage Droop Sense
Propagation Delay : FB+ and
FB- to I-MAX
Voltage Overshoot Sense
Propagation Delay : FB+ and
FB- to I-MIN
Voltage Droop Sense Threshold
Voltage Overshoot Sense
Threshold
OUTPUT DRIVERS
50
nS
50
V
DFOUT
Rising 3000pF Load
V
DFOUT
Falling 3000pF Load
40
40
nS
mV
mV
Driver
Rise Time
Fall Time
High Side Driver Voltage:
[V
HOx
- V
VSx
]
Drive High
Drive Low
Low Side Driver Voltage:
[V
LOx
– V
PGN
]
Drive High
Drive Low
High Side Driver Current
Lower MOSFET Driver Current
Current Sense Bias Current
Current Sense Delay
Current Sense Bias Current
Current Sense Delay
Logic Low Threshold
Hysteresis
Pullup Resistance
POWER GOOD
t
RISE
t
FALL
CL = 3000pF, VCx - VSx = 5V
50
50
nS
V
HOx
= 20mA, VCx - VSx = 5.0 V
V
HOx
= -20mA, VCx - VSx = 5.0 V
4.8
4.9
0.1
V
0.2
V
0.2
A
A
I
HOx
I
LOx
V
LOx
= 20mA, VCCL - VPGN = 5.0 V
V
LOx
= -20mA, VCCL - VPGN = 5.0 V
VCx - VSx = 5.0 V, Load = 3300pf at
<500nSec
VCCL - PGN = 5.0 V, Load = 3300pf at
<500nSec
4.8
4.9
0.1
1
1.5
PHASE 1 OVER CURRENT PROTECTION
I
ILIM1
t
CSD(ILIM1)
I
ILIM3
t
CSD(ILIM3)
44
200
40
200
50
400
50
400
1.5
0.3
100
60
500
60
500
µA
nS
µA
nS
TRANSIENT CORRECTION LOOP OVER CURRENT PROTECTION
ENABLE INPUT / VOLTAGE IDENTIFICATION (VID)
E
LECTRICALS
E
LECTRICALS
V
V
KΩ
V
Low Output Voltage
V
PWGD
I
PWGD
= -3mA
0.5
Copyright
©
2000
Rev 1.1, 2003-03-03
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 5
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