5962-9091201MXA datasheet, PDF

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5962-9091201MXA: DescriptionUVPROM, 256KX8, 250ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32; Categorystorage storage; File Size313KB，12 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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5962-9091201MXA Overview

UVPROM, 256KX8, 250ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32

5962-9091201MXA Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	WDIP, DIP32,.6
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	250 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T32
JESD-609 code	e0
length	42.1005 mm
memory density	2097152 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.588 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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5962-9091201MXA Related Products

	5962-9091201MXA	5962-9091201MYA	5962-9091202MXA	5962-9091203MXA	5962-9091202MYA	5962-9091203MYA
Description	UVPROM, 256KX8, 250ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32	UVPROM, 256KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 256KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32	UVPROM, 256KX8, 150ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32	UVPROM, 256KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 256KX8, 150ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
Parts packaging code	DIP	QFJ	DIP	DIP	QFJ	QFJ
package instruction	WDIP, DIP32,.6	WQCCN, LCC32,.45X.55	WDIP, DIP32,.6	WDIP, DIP32,.6	WQCCN, LCC32,.45X.55	WQCCN, LCC32,.45X.55
Contacts	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	250 ns	250 ns	200 ns	150 ns	200 ns	150 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-GDIP-T32	R-CQCC-N32	R-GDIP-T32	R-GDIP-T32	R-CQCC-N32	R-CQCC-N32
JESD-609 code	e0	e0	e0	e0	e0	e0
length	42.1005 mm	13.97 mm	42.1005 mm	42.1005 mm	13.97 mm	13.97 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WDIP	WQCCN	WDIP	WDIP	WQCCN	WQCCN
Encapsulate equivalent code	DIP32,.6	LCC32,.45X.55	DIP32,.6	DIP32,.6	LCC32,.45X.55	LCC32,.45X.55
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum seat height	5.588 mm	3.556 mm	5.588 mm	5.588 mm	3.556 mm	3.556 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	QUAD	QUAD
width	15.24 mm	11.43 mm	15.24 mm	15.24 mm	11.43 mm	11.43 mm
Base Number Matches	1	1	1	1	1	1

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