EEWORLDEEWORLDEEWORLD

Part Number

Search

BC031A1R2CZB6AA0

Description
Ceramic Capacitor, Multilayer, Ceramic, 100V, 20.8333% +Tol, 20.8333% -Tol, C0G, 30ppm/Cel TC, 0.0000012uF, Surface Mount, 0603, CHIP
CategoryPassive components    capacitor   
File Size141KB,8 Pages
ManufacturerAVX
Download Datasheet Parametric View All

BC031A1R2CZB6AA0 Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 20.8333% +Tol, 20.8333% -Tol, C0G, 30ppm/Cel TC, 0.0000012uF, Surface Mount, 0603, CHIP

BC031A1R2CZB6AA0 Parametric

Parameter NameAttribute value
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
YTEOL0
Objectid145115900756
package instruction, 0603
size code0603
Temperature characteristic codeC0G
capacitance0.0000012 µF
dielectric materialsCERAMIC
Installation featuresSURFACE MOUNT
positive tolerance20.8333%
Capacitor typeCERAMIC CAPACITOR
multi-layerYes
negative tolerance20.8333%
Rated (DC) voltage (URdc)100 V
width0.81 mm
high0.9 mm
length1.6 mm
JESD-609 codee0
Terminal shapeWRAPAROUND
Number of terminals2
Package formSMT
method of packingWaffle Pack
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Temperature Coefficient30ppm/Cel ppm/°C
COTS Plus - BC Series
General Specifications
GENERAL DESCRIPTION
Extended range MLCCs for avionic, defense, and space applications have
been available from AVX for many years, typically to customer specification
control documents. The COTS PLUS - BC series now consolidates the main
test options into standard catalog offerings, eliminating the need to generate
custom specifications for each application. Key test options from MIL-PRF-
55681 are applied to BME and PME devices in NP0 and X7R temperature
characteristic dielectrics.
PRODUCT ADVANTAGES
• Higher CV capability than standard PME
• BME and PME technology
• Voltage Range up to 500V
APPLICATIONS
Defense/Aerospace
• Extended Range MLCC for all Applications
• Low weight/payload, small footprint
• Low Voltage Ratings to Maximize Capacitance for High Speed Decoupling
HOW TO ORDER
BC
Series
03
Size
02 = 0402
03 = 0603
05 = 0805
06 = 1206
10 = 1210
12 = 1812
13 = 1825
5
C
102
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
K*
Z
T
9
AA
1
Extened Test Level
0 = Not Applicable
1 = DPA IAW EIA-469
2 = 85/85 @ RV for 96 hours
3 = DPA and 85/85 @ RV
Dielectric
Voltage
Z = 10V A = C0G (NP0)
Y = 16V C = X7R
3 = 25V
5 = 50V
1 = 100V
2 = 200V
V = 250V
7 = 500V
Capacitance
Failure Rate
Termination
Tolerance
Z = COTS Plus T = 100% TN
B = ±.10 pF
B = Tin/Lead
C = ±.25 pF
(5% min Lead)
D = ±.50 pF
J = Tin/Lead (60/40)
F = ±1% (≥ 10 pF)
G = ±2% (≥ 10 pF)
J = ±5%
K = ±10%
M = ±20%
* B, C & D tolerance for ≤10 pF values.
Packaging
Base Group A Test Level
1 = 7" T&R
AA = Group A per MIL-PRF-55681
3 = 13" T&R
SA = Group A per MIL-PRF-55681
6 = Waffle Pack
with SLDC
(SLDC = Single Lot Date Code)
9 = Bulk
CONFORMANCE TEST LEVELS
Base Group A Test Options
Voltage Conditioning IAW MIL-PRF-55681
Elevated IR Sample
Visual and Mechanical Inspection
Solderability
Single Lot Date Code (SLDC)
Group A Data Summary
AA
SA
Extended Test Options
Not Applicable
DPA IAW EIA-469
85°C/85% RH @ Rated Voltage / 96 Hrs
DPA and 85/85 @ Rated Voltage
Code
0
1
2
3
081516
1
Please tell me, why is copper deposited on the inner wall of the via?
This is a MEMS microphone package with a bottom hole. When it was received on the PCB, the hole wall was coppered. I have drawn a similar package before. At that time, I used a soldering pad, and the ...
littleshrimp PCB Design
I would like to ask you about the problem of making a PDA installation program: When I use the installation package to download a program to the PDA, the program name cannot be displayed in Chinese. How can I solve this problem?
I used ePocketSetup2001, ePocketSetup2003, ePocketSetup4 installation package making tools to make installation packages. The packaged programs were made with evc++. After Pocket PC 2003 was installed...
darkkingdom Embedded System
Quick, help me calculate the baud rate error problem, click here to see the picture and formula
Just the information on these three pictures. I want to know how the error values in the table below are calculated. I have been calculating for a long time but it doesn’t match up:Cry:...
shijizai stm32/stm8
Is it better to learn C language or assembly language for R&D work?
Is it better to learn C language or assembly language for R&D work? Which language is more widely used in work? Which one will be better for future development? And which language is easier to learn?...
hanshu61 MCU
Jlink prompts error message when burning external flash
[i=s]This post was last edited by Xiaoxiaoliaodou on 2019-12-30 10:58[/i]When I use jlin to burn external flash, the following prompt often appears: Burning fails. But it will be OK if I burn it again...
小小料豆 ARM Technology
Communication problem between host computer and USB device
Communication problem between host computer and USB device. The problem with mass storage protocol is that it cannot be used by non-administrators. Use fopen, fread, fwrite and other methods to access...
nsz Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 834  435  102  1843  2226  17  9  3  38  45 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号