GS840NBT32PT133 datasheet, PDF

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GS840NBT32PT133: DescriptionZBT SRAM, 128KX32, 4.2ns, CMOS, PQFP100; Categorystorage storage; File Size895KB，18 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS840NBT32PT133 Overview

ZBT SRAM, 128KX32, 4.2ns, CMOS, PQFP100

GS840NBT32PT133 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	GSI Technology
package instruction	QFP, QFP100,.63X.87
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	4.2 ns
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
memory density	4194304 bit
Memory IC Type	ZBT SRAM
memory width	32
Humidity sensitivity level	3
Number of terminals	100
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum standby current	0.01 A
Minimum standby current	3.14 V
Maximum slew rate	0.29 mA
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	QUAD
Base Number Matches	1

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GS840NBT32PT133 Related Products

	GS840NBT32PT133	GS840NBT32PT100I	GS840NBT32PT133I	GS840NBT32PT100	GS840NBT32PT117	GS840NBT32PT117I
Description	ZBT SRAM, 128KX32, 4.2ns, CMOS, PQFP100	ZBT SRAM, 128KX32, 5ns, CMOS, PQFP100	ZBT SRAM, 128KX32, 4.2ns, CMOS, PQFP100	ZBT SRAM, 128KX32, 5ns, CMOS, PQFP100	ZBT SRAM, 128KX32, 4.5ns, CMOS, PQFP100	ZBT SRAM, 128KX32, 4.5ns, CMOS, PQFP100
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology
package instruction	QFP, QFP100,.63X.87	QFP, QFP100,.63X.87	QFP, QFP100,.63X.87	QFP, QFP100,.63X.87	QFP, QFP100,.63X.87	QFP, QFP100,.63X.87
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	4.2 ns	5 ns	4.2 ns	5 ns	4.5 ns	4.5 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM
memory width	32	32	32	32	32	32
Humidity sensitivity level	3	3	3	3	3	3
Number of terminals	100	100	100	100	100	100
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	85 °C	70 °C	70 °C	85 °C
organize	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP	QFP	QFP	QFP	QFP
Encapsulate equivalent code	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.01 A	0.015 A	0.015 A	0.01 A	0.01 A	0.015 A
Minimum standby current	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
Maximum slew rate	0.29 mA	0.23 mA	0.3 mA	0.22 mA	0.24 mA	0.25 mA
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Base Number Matches	1	1	1	1	1	1

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