EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202AS-02-7593-B

Description
Fixed Resistor, Thin Film, 0.25W, 759000ohm, 100V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202AS-02-7593-B Overview

Fixed Resistor, Thin Film, 0.25W, 759000ohm, 100V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

B0202AS-02-7593-B Parametric

Parameter NameAttribute value
Is SamacsysN
YTEOL0
Objectid1579375663
package instructionCHIP
Reach Compliance CodeCompliant
ECCN codeEAR99
Installation featuresSURFACE MOUNT
Rated power dissipation(P)0.25 W
resistance759000 Ω
Resistor typeFIXED RESISTOR
size code0202
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Tolerance0.1%
Number of terminals2
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Terminal shapeONE SURFACE
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Rated temperature70 °C
surface mountYES
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
2007 China Embedded Industry Engineer Survey Report
[i]Key points of the report: 1. Engineers tend to be male and young 2. Teamwork and learning are key 3. Entrepreneurship is the way out if income is not ideal [/i] Embedded systems have undoubtedly be...
1ying Automotive Electronics
An error occurs when connecting to MSP430 using JTAG
Hello everyone, I am a beginner of MSP430. I am using the MSP430F1232 chip, the JTAG controller model is MSPFET-UIF, and the operating software is IAR. When I programmig the program into the chip afte...
m9907614 Microcontroller MCU
LM324 pin diagram information and circuit application
LM324 pin diagram data and circuit application LM324 data: LM324 is a four-op-amp integrated circuit, using a 14-pin dual in-line plastic package. There are four operational amplifiers inside, with a ...
weigaole Analog electronics
Wince platform construction
I am a wince beginner. I have seen different ways to build a wince platform on the Internet, but I don't know which one I should choose. Do different development types have different environments? "??...
truelygo Embedded System
How does ring3 call the keyboard filter driver
As the title says, this keyboard filter driver generates many devices, which are bound to the devices on Kdbclass. How to use this driver in ring3...
lilizhen329 Embedded System
Ultra-large capacity Nand Flash driver
I am planning to install a Samsung 4GB/8GB/64GB Nand Flash on a WinCE system based on S3C2440. I hope you can support me! Please give me suggestions!...
123456654 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 818  2773  948  2362  2275  17  56  20  48  46 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号