that uses a pair of optically coupled GaAIAs LEDs to
drive two photodiode arrays. When the input current
is applied to the LED, the light emitted activates
the photodiode array, and generates a voltage at the
output. The photodiode arrays are capable of
generating a floating source voltage and current
sufficient to drive high power MOSFET transistors.
The optical coupling provides a high level of input to
output isolation. The FDA215 is well suited for use in
discrete solid state relay designs and other isolated
switching applications.
Features
•
Optically Isolated, Input to Output
•
Dual Independent, Floating Outputs for Parallel,
Series, or Isolated Configuration
•
5mA Control Current
•
May Be Configured for AC and DC Switching
•
Replacement of Discrete Components
•
VDE Compatible
•
Solid State Reliability
•
No EMI/RFI Generation
•
Machine Insertable, Wave Solderable
•
Surface Mount and Tape & Reel Version Available
Applications
•
MOSFET Driver
•
Programmable Control
•
Process Control
•
Instrumentation
•
Telecommunications
Approvals
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Part #
FDA215
FDA215S
FDA215STR
Description
8-Pin DIP (50/tube)
8-Pin Surface Mount (50/tube)
8-Pin Surface Mount (1000/reel)
Pin Configuration
1
Input
2
3
Input
4
+
–
+
–
– 8
Output
+
7
–
+
6
Output
5
PV
PV
Pb
DS-FDA215-R06
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Absolute Maximum Ratings @ 25ºC
Parameter
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Capacitance, Input to Output
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
FDA215
Ratings
5
100
1
150
500
1
3750
-40 to +85
-40 to +125
Units
V
mA
A
mW
mW
pF
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Open Circuit Voltage
Short Circuit Current
Switching Speeds
Turn-On
Turn-Off
Offstate Clamping Resistance
Input Characteristics
Input Control Current
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
I
F
=5mA
I
F
=5mA
I
F
=25mA
I
F
=5mA, C
LOAD
=200pF
V
L
=1V
-
I
F
=5mA
V
R
=5V
-
Symbol
V
OC
I
SC
t
on
t
off
R
CL
I
F
V
F
I
R
-
Min
3
1
2.5
-
-
100
-
0.9
-
-
Typ
5.5
2.5
3.5
-
-
250
-
1.2
-
3
Max
8
9
20
5
5
3300
5
1.4
10
-
Units
V
A
ms
mA
V
µA
pF
2
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Manufacturing Information
Moisture Sensitivity
FDA215
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
FDA215 / FDA215S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
FDA215 / FDA215S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
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3
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MECHANICAL DIMENSIONS
FDA215S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
3.302 ± 0.051
(0.130 ± 0.002)
0.635 ± 0.127
(0.025 ± 0.005)
FDA215
PCB Land Pattern
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
1.65
(0.0649)
8.90
(0.3503)
0.457 ± 0.076
(0.018 ± 0.003)
4.445 ± 0.127
(0.175 ± 0.005)
0.65
(0.0255)
0.813 ± 0.102
(0.032 ± 0.004)
Dimensions
mm
(inches)
FDA215STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K
0
=4.90
(0.193)
K
1
=4.20
(0.165)
Ao=10.30
(0.406)
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
Embossed Carrier
Embossment
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
4
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FDA215
FDA215
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
7.239 TYP.
(0.285)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
PCB Hole Pattern
8-0.800 DIA.
(8-0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
0.813 ± 0.102
(0.032 ± 0.004)
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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