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74LVC2G34GW,125

Description
buffers & line drivers dual buffer
Categorylogic    logic   
File Size189KB,17 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LVC2G34GW,125 Overview

buffers & line drivers dual buffer

74LVC2G34GW,125 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP6,.08
Contacts6
Manufacturer packaging codeSOT363
Reach Compliance Codecompliant
ECCN codeEAR99
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G6
JESD-609 codee3
length2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions2
Number of entries1
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP6,.08
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Sup5.1 ns
propagation delay (tpd)10.8 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width1.25 mm
Base Number Matches1
74LVC2G34
Dual buffer gate
Rev. 7 — 4 July 2012
Product data sheet
1. General description
The 74LVC2G34 provides two buffers.
Inputs can be driven from either 3.3 V or 5 V devices. These features allow the use of
these devices in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant inputs for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8B/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
24
mA output drive (V
CC
= 3.0 V)
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C.

74LVC2G34GW,125 Related Products

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Description buffers & line drivers dual buffer buffers & line drivers single 2-input OR buffers & line drivers 3.3V dual buffer
Brand Name NXP Semiconductor NXP Semiconduc NXP Semiconductor
Is it Rohs certified? conform to conform to conform to
Maker NXP NXP NXP
Parts packaging code TSSOP SON SON
package instruction TSSOP, TSSOP6,.08 VSON, SOLCC6,.04,20 VSON, SOLCC6,.04,20
Contacts 6 6 6
Manufacturer packaging code SOT363 SOT886 SOT886
Reach Compliance Code compliant compli compliant
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PDSO-G6 R-PDSO-N6 R-PDSO-N6
JESD-609 code e3 e3 e3
length 2 mm 1.45 mm 1.45 mm
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type BUFFER BUFFER BUFFER
MaximumI(ol) 0.024 A 0.024 A 0.024 A
Humidity sensitivity level 1 1 1
Number of functions 2 2 2
Number of entries 1 1 1
Number of terminals 6 6 6
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP VSON VSON
Encapsulate equivalent code TSSOP6,.08 SOLCC6,.04,20 SOLCC6,.04,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
method of packing TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260
power supply 3.3 V 3.3 V 3.3 V
propagation delay (tpd) 10.8 ns 10.8 ns 10.8 ns
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
Maximum seat height 1.1 mm 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin (Sn) Tin (Sn) Tin (Sn)
Terminal form GULL WING NO LEAD NO LEAD
Terminal pitch 0.65 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30
width 1.25 mm 1 mm 1 mm
Prop。Delay @ Nom-Sup 5.1 ns - 5.1 ns
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