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BU-65170V2-540

Description
Serial IO/Communication Controller, 2 Channel(s), 0.125MBps, CMOS, CDFP70, 1.900 INCH, CERAMIC, DFP-70
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,47 Pages
ManufacturerData Device Corporation
Download Datasheet Parametric View All

BU-65170V2-540 Overview

Serial IO/Communication Controller, 2 Channel(s), 0.125MBps, CMOS, CDFP70, 1.900 INCH, CERAMIC, DFP-70

BU-65170V2-540 Parametric

Parameter NameAttribute value
Other featuresLG-MAX; WD-MAX
boundary scanNO
letter of agreementMIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838
Data encoding/decoding methodsNRZ; BIPH-LEVEL(MANCHESTER)
low power modeYES
Number of serial I/Os2
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
technologyCMOS
Temperature levelINDUSTRIAL
External data bus width16
Nominal supply voltage5 V
surface mountYES
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Address bus width16
maximum clock frequency16 MHz
Maximum data transfer rate0.125 MBps
JESD-30 codeR-CDFP-F70
JESD-609 codee4
Certification statusNot Qualified
length48.26 mm
Maximum seat height3.81 mm
width25.4 mm
Number of terminals70
Package body materialCERAMIC, METAL-SEALED COFIRED
Encapsulate equivalent codeFL70,1.0
Terminal surfaceGOLD OVER NICKEL
Terminal pitch1.27 mm
Terminal locationDUAL
encapsulated codeDFP
Package shapeRECTANGULAR
Package formFLATPACK
Terminal formFLAT
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Filter levelMIL-PRF-38534
Reach Compliance CodeCompliant
YTEOL7
Objectid1154992556
package instructionDFP, FL70,1.0
Contacts70
Is SamacsysN
Country Of OriginTaiwan, USA
BU-65170/61580 AND BU-61585
MIL-STD-1553A/B NOTICE 2 RT
AND BC/RT/MT, ADVANCED
COMMUNICATION ENGINE (ACE)
Make sure the next
Card you purchase
has...
®
FEATURES
Fully Integrated MIL-STD-1553
Interface Terminal
Flexible Processor/Memory Interface
Standard 4K x 16 RAM and Optional
12K x 16 or 8K x 17 RAM Available
Optional RAM Parity Generation/
Checking
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Flexible RT Data Buffering
Programmable
Illegalization
Selective Message Monitor
Simultaneous RT/Monitor Mode
DESCRIPTION
DDC's BU-65170, BU-61580 and BU-61585 Bus Controller / Remote
Terminal / Monitor Terminal (BC/RT/MT) Advanced Communication
Engine (ACE) terminals comprise a complete integrated interface
between a host processor and a MIL-STD-1553 A and B or STANAG
3838 bus.
The ACE series is packaged in a 1.9 -square-inch, 70-pin, low-profile,
cofired MultiChip Module (MCM) ceramic package that is well suited
for applications with stringent height requirements.
The BU-61585 ACE integrates dual transceiver, protocol, memory
management, processor interface logic, and a total of 12K words of
RAM in a choice of DIP or flat pack packages. The BU-61585 requires
+5 V power and either -15 V or -12 V power.
The BU-61585 internal RAM can be configured as 12K x 16 or 8K x
17. The 8K x 17 RAM feature provides capability for memory integrity
checking by implementing RAM parity generation and verification on
all accesses. To minimize board space and “glue” logic, the ACE pro-
vides ultimate flexibility in interfacing to a host processor and internal/
external RAM.
The advanced functional architecture of the ACE terminals provides
software compatibility to DDC's Advanced Integrated Multiplexer
(AIM) series hybrids, while incorporating a multiplicity of architectural
enhancements. It allows flexible operation while off-loading the host
processor, ensuring data sample consistency, and supports bulk data
transfers.The ACE hybrids may be operated at either 12 or 16 MHz.
Wire bond options allow for programmable RT address (hardwired is
standard) and external transmitter inhibit inputs.
FOR MORE INFORMATION CONTACT:
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
Technical Support:
1-800-DDC-5757 ext. 7771
All trademarks are the property of their respective owners.
©
1992, 1999 Data Device Corporation
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