EEWORLDEEWORLDEEWORLD

Part Number

Search

HCHP1010M360JNT

Description
RESISTOR, METAL GLAZE/THICK FILM, 0.5W, 5%, 300ppm, 36ohm, SURFACE MOUNT, 1010, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size103KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

HCHP1010M360JNT Overview

RESISTOR, METAL GLAZE/THICK FILM, 0.5W, 5%, 300ppm, 36ohm, SURFACE MOUNT, 1010, CHIP, ROHS COMPLIANT

HCHP1010M360JNT Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instruction, 1010
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresSTANDARD: MIL-R-55342D
JESD-609 codee2
Manufacturer's serial numberHCHP
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR; WAFFLE PACK
Rated power dissipation(P)0.5 W
Rated temperature70 °C
resistance36 Ω
Resistor typeFIXED RESISTOR
size code1010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfaceTin/Silver (Sn/Ag)
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage100 V
Base Number Matches1
CHP, HCHP
Vishay Sfernice
High Stability Resistor Chips
Thick Film Technology
FEATURES
Robust terminations
Large ohmic value range 0.1
Ω
to 100 MΩ
Tight tolerance to 0.5 %
CHP: standard passivated version for industrial,
professional and military applications
HCHP: for high frequency applications
ESCC approvals in progress
VISHAY SFERNICE thick film resistor chips are specially
designed to meet very stringent specifications in terms of
reliability, stability 0.5 % at Pn at 70 °C during 2000 hrs.,
homogeneity, reproductibility and quality.
They conform
MIL-R-55342 D.
to
specifications
NFC
83-240
and
Sputtered Thin Film terminations, with nickel barrier, are very
convenient for high temperature operating conditions. They
can withstand thousands of very severe thermal shocks.
B (W/A), N (W/A) and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
Pb-free
Available
RoHS*
COMPLIANT
ESCC and EN 140 401 802 certifications is in progress.
DIMENSIONS
in millimeters (inches)
A
D
D
D
A
D
C
C
B
E
E
DIMENSIONS
A
CASE
SIZE
MAX .TOL
+ 0.152 (0.006)
MIN. TOL.
- 0.152 (- 0.006)
1.27 (0.05)
1.27 (0.05)
1.52 (0.080)
1.91 (0.075)
2.54 (0.100)
3.05 (0.120)
3.81 (0.150)
5.08 (0.200)
2.54 (0.100)
5.58 (0.22)
6.35 (0.250)
2.54 (0.100)
B
MAX. TOL.
+ 0.127 (0.005)
MIN. TOL.
- 0.127 (- 0.005)
0.6 (0.023)
1.27 (0.050)
0.85 (0.033)
1.27 (0.050)
1.27 (0.050)
1.60 (0.063)
1.32 (0.054)
2.54 (0.100)
5.08 (0.200)
1.91 (0.075)
3.06 (0.120)
2.54 (0.100)
C
MAX. TOL.
+ 0.127 (0.005)
MIN. TOL.
- 0.127 (- 0.005)
0.5 (0.02)
0.5 (0.02)
0.5 (0.02)
0.5 (0.02)
0.5 (0.02)
0.5 (0.02)
0.5 (0.02)
0.5 (0.02)
0.5 (0.02)
0.5 (0.02)
0.5 (0.02)
0.5 (0.02)
D/E
MAX. TOL.
+ 0.13 (0.005)
MIN. TOL.
- 0.13 (- 0.005)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
0.38 (0.015)
POWER
RATING
mW
Pn
50
125
125
200
250
250
500
1000
2)
1000
2)
750
2000
2)
500
LIMITING
ELEMENT
VOLTAGE
V
50
50
50
75
100
150
150
200
100
200
250
100
MAXIMUM
1)
RESISTANCE
UNIT
WEIGHT
IN
mG
1
3
2
4
5
8
8
26
25
21
42
12
0502
0505
0603
0705
0805
1005
1206
1505
2010
1020
2208
2512
1010
1)
Shall
2)
With
25
10
25
25
50
50
75
100
10
100
100
25
be read in conjunction with other tables
special assembly care
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 52023
Revision: 19-Jul-06
For technical questions contact: sfer@vishay.com
www.vishay.com
1
Does the thermal pad on the back of the THS3001 need to be connected to the ground plane?
[i=s] This post was last edited by dontium on 2015-1-23 13:12 [/i] rt, today I was studying the chip manual of THS3001 and found that THS3001 also uses PowerPad technology, but the chip manual does no...
GXT_Python Analogue and Mixed Signal
E There are good books in the gold mine. Read one.
I won’t say much, just look at the picture and you will know....
dongguanze Talking
How to set the coordinate mapping method in EVC
The coordinate mapping method in vc++ can be set directly through SetMapMade(), but EVC drawing cannot. How can I solve this problem? ? ? Thank you...
nwuwmz Embedded System
Principles and requirements for the 2009 National Undergraduate Electronic Design Competition
[i=s]This post was last edited by paulhyde on 2014-9-15 09:30[/i][b][font=华文中宋][size=16pt][font=宋体]I. Principles and requirements of proposition[/font][/size][/font][/b] [font=宋体][font=新宋体-18030][size...
open82977352 Electronics Design Contest
A small problem in the FPGA course design, please help me take a look...
Recently, the teacher assigned a course design to realize a music jukebox using FPGA. Store 3 music scores in ROM, and then switch songs by pressing buttons. The specific requirements are as follows: ...
panxiao FPGA/CPLD
In the ECG common mode rejection ratio test, why is a 20Vrms/50Hz sinusoidal signal selected as the test signal?
As the title says, I have looked at the common mode rejection ratio test schemes of YY1139 and IEC60601-2-25 before. I don’t quite understand why the 20Vrms/50Hz sine test signal is selected. I would ...
dswu233 Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2456  1186  1074  387  2288  50  24  22  8  47 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号