IC,SRAM,2KX8,CMOS,DIP,24PIN,CERAMIC
| Parameter Name | Attribute value |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Filter level | MIL-STD-883 Class B (Modified) |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Objectid | 1125526196 |
| Reach Compliance Code | Not Compliant |
| ECCN code | 3A001.A.2.C |
| Is Samacsys | N |
| YTEOL | 0 |
| Is it lead-free? | No |
| Is it Rohs certified? | No |
| memory density | 16384 bit |
| memory width | 8 |
| organize | 2KX8 |
| Nominal supply voltage (Vsup) | 5 V |
| Maximum access time | 70 ns |
| I/O type | COMMON |
| Operating mode | ASYNCHRONOUS |
| Maximum standby current | 0.00002 A |
| Temperature level | MILITARY |
| Maximum slew rate | 0.07 mA |
| technology | CMOS |
| Memory IC Type | STANDARD SRAM |
| word count | 2048 words |
| character code | 2000 |
| Output characteristics | 3-STATE |
| Parallel/Serial | PARALLEL |
| Minimum standby current | 2 V |
| JESD-30 code | R-XDIP-T24 |
| Certification status | Not Qualified |
| Terminal location | DUAL |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Package form | IN-LINE |
| Terminal pitch | 2.54 mm |
| Terminal form | THROUGH-HOLE |
| Number of terminals | 24 |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| surface mount | NO |
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