MEMORY MODULE,SRAM,8KX8,CMOS,DIP,28PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | No |
| Maximum access time | 100 ns |
| memory density | 65536 bit |
| memory width | 8 |
| organize | 8KX8 |
| Nominal supply voltage (Vsup) | 5 V |
| character code | 8000 |
| Output characteristics | 3-STATE |
| Parallel/Serial | PARALLEL |
| Maximum standby current | 0.000125 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.115 mA |
| technology | CMOS |
| word count | 8192 words |
| Temperature level | MILITARY |
| Memory IC Type | SRAM MODULE |
| Operating mode | ASYNCHRONOUS |
| I/O type | COMMON |
| JESD-30 code | R-XDIP-T28 |
| Certification status | Not Qualified |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Number of terminals | 28 |
| Package body material | CERAMIC |
| Terminal pitch | 2.54 mm |
| Encapsulate equivalent code | DIP28,.6 |
| surface mount | NO |
| Filter level | 38535Q/M;38534H;883B |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Is Samacsys | N |
| YTEOL | 0 |
| Objectid | 1164069994 |
| Reach Compliance Code | Not Compliant |
| ECCN code | 3A001.A.2.C |
京公网安备 11010802033920号
EEWORLD
