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15431326-228

Description
Board Connector
CategoryThe connector    The connector   
File Size209KB,2 Pages
ManufacturerDelphi Connection Systems
Download Datasheet Parametric View All

15431326-228 Overview

Board Connector

15431326-228 Parametric

Parameter NameAttribute value
Connector typeBOARD CONNECTOR
Objectid1973266546
Reach Compliance CodeUnknown
ECCN codeEAR99
Is SamacsysN
Connection
Systems
Two-Piece Backplanes
Futurebus
Connectors
Description:
Modular
two-piece
backplane connection system
Typical Applications:
Servers
Switches
Routers
Add/drop
multiplexers
Benefits/Features:
Industry Standard . . . . . Meets IEC 61076-4-104 specification identifying mounting, mating, and performance requirements.
Versatility . . . . . . . . . . . Standard "block" sizes allow mix-and-match to create simple modular solutions.
5-row versions are available for increased line/inch density.
Multiple length pins allow virtually unlimited variations of EMLB (Early Mate, Last Break) and reduced mating force.
Solder-tail and press-fit versions are available and intermatable.
Reliability . . . . . . . . . . . Generous lead-in allows self-alignment for blind mating.
Several gold plating options are available for improved reliability.
Mechanical and Electrical Characteristics:
Mechanical Specifications
Grid Size
Temperature Range
Insulation Material
Contact Base Material
Creepage and Clearance
Distance
Contact Levels (Post Lengths)
Mating Force per Signal Contact
Unmating Force
Termination Technique
Misalignment
Inclination
2.0 mm
-55°C to +125°C
Glass filled LCP UL 94V-0
,
Phosphor bronze
0.40 mm contact row
0.40 mm adjacent contacts
Press-fit: 4.25 mm
Solder-tail: 3.2, 4.25 mm
0.7 N [0.16 lbf] max.
0.12 N [0.027 lbf] min.
Press-fit or solder-tail
Sn
0.15 µm max.
0.75 +0.05/-0.10
Insulation Resistance
Dielectric Withstanding Voltage
Electrical Performance
Current Rating
Voltage Rating
Contact Resistance
1 amp (25ºC)
30 VAC
25, 35, 40, 45, 50 mΩ
(rows a-e, respectively)
Initial: 5000 MΩ
Final: 100 MΩ
1000 VAC
Recommended PCB Plated Through Holes
Drilled Hole
Cu
0.81 - 0.86 mm
0.25 µm min.
Transverse: 2.5 mm
Longitudinal: ± 4°
Transverse: ± 2°
Plated Through Hole
Performance Levels
1
250 mating cycles
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