Inverter, HC/UH Series, 6-Func, 1-Input, CMOS, CDFP14, CERAMIC, DFP-14
| Parameter Name | Attribute value |
| Maker | Harris |
| package instruction | DFP, |
| Reach Compliance Code | unknown |
| series | HC/UH |
| JESD-30 code | R-CDFP-F14 |
| JESD-609 code | e4 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | INVERTER |
| Number of functions | 6 |
| Number of entries | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | OPEN-DRAIN |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| propagation delay (tpd) | 20 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | GOLD |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| total dose | 100k Rad(Si) V |
| Base Number Matches | 1 |
| 5962R9580101VXC | 5962R9580101VCC | 5962R9580101V9A | |
|---|---|---|---|
| Description | Inverter, HC/UH Series, 6-Func, 1-Input, CMOS, CDFP14, CERAMIC, DFP-14 | Inverter, HC/UH Series, 6-Func, 1-Input, CMOS, CDIP14 | Inverter, HC/UH Series, 6-Func, 1-Input, CMOS |
| package instruction | DFP, | , | DIE, |
| Reach Compliance Code | unknown | unknown | unknown |
| series | HC/UH | HC/UH | HC/UH |
| JESD-30 code | R-CDFP-F14 | R-CDIP-T14 | X-XUUC-N14 |
| JESD-609 code | e4 | e4 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | INVERTER | INVERTER | INVERTER |
| Number of functions | 6 | 6 | 6 |
| Number of entries | 1 | 1 | 1 |
| Number of terminals | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| Output characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| Package form | FLATPACK | IN-LINE | UNCASED CHIP |
| propagation delay (tpd) | 20 ns | 20 ns | 18 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | GOLD | GOLD | TIN LEAD |
| Terminal form | FLAT | THROUGH-HOLE | NO LEAD |
| Terminal location | DUAL | DUAL | UPPER |
| total dose | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
| Base Number Matches | 1 | 1 | 1 |
| Maker | Harris | - | Harris |
| encapsulated code | DFP | - | DIE |