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PDTC114T series
NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open
Rev. 08 — 9 February 2006
Product data sheet
1. Product profile
1.1 General description
NPN Resistor-Equipped Transistors (RET) family.
Table 1:
Product overview
Package
Philips
PDTC114TE
PDTC114TK
PDTC114TM
PDTC114TS
[1]
PDTC114TT
PDTC114TU
[1]
Type number
PNP complement
JEITA
SC-75
SC-59A
SC-101
SC-43A
-
SC-70
JEDEC
-
TO-236
-
TO-92
TO-236AB
-
PDTA114TE
PDTA114TK
PDTA114TM
PDTA114TS
PDTA114TT
PDTA114TU
SOT416
SOT346
SOT883
SOT54
SOT23
SOT323
Also available in SOT54A and SOT54 variant packages (see
Section 2).
1.2 Features
s
Built-in bias resistors
s
Simplifies circuit design
s
100 mA output current capability
s
Reduces component count
s
Reduces pick and place costs
1.3 Applications
s
Digital applications
s
Controlling IC inputs
s
Cost-saving alternative for BC847 series
in digital applications
s
Switching loads
1.4 Quick reference data
Table 2:
Symbol
V
CEO
I
O
R1
Quick reference data
Parameter
collector-emitter voltage
output current
bias resistor 1 (input)
Conditions
open base
Min
-
-
7
Typ
-
-
10
Max
50
100
13
Unit
V
mA
kΩ
Philips Semiconductors
PDTC114T series
NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open
2. Pinning information
Table 3:
Pin
SOT54
1
2
3
input (base)
output (collector)
GND (emitter)
1
2
3
001aab347
006aaa218
R1
Pinning
Description
Simplified outline
Symbol
2
1
3
SOT54A
1
2
3
input (base)
output (collector)
GND (emitter)
1
2
3
001aab348
006aaa218
R1
2
1
3
SOT54 variant
1
2
3
input (base)
output (collector)
GND (emitter)
1
2
3
001aab447
006aaa218
R1
2
1
3
SOT23; SOT323; SOT346; SOT416
1
2
3
input (base)
GND (emitter)
output (collector)
1
1
2
006aaa144
sym012
3
R1
3
2
SOT883
1
2
3
input (base)
GND (emitter)
output (collector)
1
3
2
Transparent
top view
1
R1
3
2
sym012
PDTC114T_SER_8
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 — 9 February 2006
2 of 11
Philips Semiconductors
PDTC114T series
NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open
3. Ordering information
Table 4:
Ordering information
Package
Name
PDTC114TE
PDTC114TK
PDTC114TM
SC-75
SC-59A
SC-101
Description
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
leadless ultra small plastic package; 3 solder lands;
body 1.0
×
0.6
×
0.5 mm
plastic single-ended leaded (through hole) package;
3 leads
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
Version
SOT416
SOT346
SOT883
SOT54
SOT23
SOT323
Type number
PDTC114TS
[1]
SC-43A
PDTC114TT
PDTC114TU
[1]
-
SC-70
Also available in SOT54A and SOT54 variant packages (see
Section 2
and
Section 9).
4. Marking
Table 5:
Marking codes
Marking code
[1]
24
24
DT
TC114T
*12
*24
Type number
PDTC114TE
PDTC114TK
PDTC114TM
PDTC114TS
PDTC114TT
PDTC114TU
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
PDTC114T_SER_8
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 — 9 February 2006
3 of 11
Philips Semiconductors
PDTC114T series
NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open
5. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
O
I
CM
P
tot
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
output current
peak collector current
total power dissipation
SOT416
SOT346
SOT883
SOT54
SOT23
SOT323
T
stg
T
j
T
amb
[1]
[2]
[3]
Conditions
open emitter
open base
open collector
single pulse;
t
p
≤
1 ms
T
amb
≤
25
°C
[1]
[1]
[2] [3]
[1]
[1]
[1]
Min
-
-
-
-
-
Max
50
50
5
100
100
Unit
V
V
V
mA
mA
-
-
-
-
-
-
−65
-
−65
150
250
250
500
250
200
+150
150
+150
mW
mW
mW
mW
mW
mW
°C
°C
°C
storage temperature
junction temperature
ambient temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB with 60
µm
copper strip line, standard footprint.
6. Thermal characteristics
Table 7:
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
SOT416
SOT346
SOT883
SOT54
SOT23
SOT323
[1]
[2]
[3]
Conditions
in free air
[1]
[1]
[2] [3]
[1]
[1]
[1]
Min
Typ
Max
Unit
-
-
-
-
-
-
-
-
-
-
-
-
833
500
500
250
500
625
K/W
K/W
K/W
K/W
K/W
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB with 60
µm
copper strip line, standard footprint.
PDTC114T_SER_8
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 — 9 February 2006
4 of 11
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