EDO DRAM Module, 8MX36, 50ns, CMOS, PSMA72
| Parameter Name | Attribute value |
| Maker | SAMSUNG |
| package instruction | SIMM, SSIM72 |
| Reach Compliance Code | unknown |
| Maximum access time | 50 ns |
| I/O type | COMMON |
| JESD-30 code | R-PSMA-N72 |
| memory density | 301989888 bit |
| Memory IC Type | EDO DRAM MODULE |
| memory width | 36 |
| Number of terminals | 72 |
| word count | 8388608 words |
| character code | 8000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8MX36 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SIMM |
| Encapsulate equivalent code | SSIM72 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 4096 |
| Maximum standby current | 0.006 A |
| Maximum slew rate | 0.396 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | SINGLE |
| Base Number Matches | 1 |
| KMM5368005ASWG-5 | KMM5368005ASWG-6 | KMM5368005ASW-5 | |
|---|---|---|---|
| Description | EDO DRAM Module, 8MX36, 50ns, CMOS, PSMA72 | EDO DRAM Module, 8MX36, 60ns, CMOS, PSMA72 | EDO DRAM Module, 8MX36, 50ns, CMOS, PSMA72 |
| Maker | SAMSUNG | SAMSUNG | SAMSUNG |
| package instruction | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum access time | 50 ns | 60 ns | 50 ns |
| I/O type | COMMON | COMMON | COMMON |
| JESD-30 code | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 |
| memory density | 301989888 bit | 301989888 bit | 301989888 bit |
| Memory IC Type | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
| memory width | 36 | 36 | 36 |
| Number of terminals | 72 | 72 | 72 |
| word count | 8388608 words | 8388608 words | 8388608 words |
| character code | 8000000 | 8000000 | 8000000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 8MX36 | 8MX36 | 8MX36 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SIMM | SIMM | SIMM |
| Encapsulate equivalent code | SSIM72 | SSIM72 | SSIM72 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 4096 | 4096 | 4096 |
| Maximum standby current | 0.006 A | 0.006 A | 0.006 A |
| Maximum slew rate | 0.396 mA | 0.366 mA | 0.396 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | SINGLE | SINGLE | SINGLE |
| Base Number Matches | 1 | 1 | 1 |