AM29LV160MB100WAF datasheet, PDF

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AM29LV160MB100WAF: DescriptionFlash, 1MX16, 100ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, FBGA-48; Categorystorage storage; File Size1MB，63 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM29LV160MB100WAF Overview

Flash, 1MX16, 100ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, FBGA-48

AM29LV160MB100WAF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	6 X 8 MM, 0.80 MM PITCH, FBGA-48
Contacts	48
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	100 ns
Other features	BOTTOM BOOT BLOCK
Spare memory width	8
startup block	BOTTOM
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	8.15 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
width	6.15 mm
Base Number Matches	1

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Am29LV160M

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not available for designs. For new and current designs,

S29GL016A supersedes Am29LV160M and is the factory-recommended migration path. Please refer

to the S29GL016A datasheet for specifications and ordering information. Availability of this docu-

ment is retained for reference and historical purposes only.

The following document contains information on Spansion memory products.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal data sheet improvement and are noted in the

document revision summary.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

25974

Revision

Amendment

Issue Date

January 31, 2007

D a t a

S h e e t

Table of Contents

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29LV160M Device Bus Operations .......................10

DQ7: Data# Polling .............................................................................. 33

Figure 7. Data# Polling Algorithm ....................................... 34

RY/BY#: Ready/Busy# ..........................................................................34

DQ6: Toggle Bit I .................................................................................. 35

DQ2: Toggle Bit II ................................................................................. 35

Reading Toggle Bits DQ6/DQ2 ........................................................36

Figure 8. Toggle Bit Algorithm ............................................ 37

Word/Byte Configuration .................................................................. 10

Requirements for Reading Array Data ........................................... 10

Writing Commands/Command Sequences .....................................11

Program and Erase Operation Status ...............................................11

Standby Mode ...........................................................................................11

Automatic Sleep Mode .........................................................................12

RESET#: Hardware Reset Pin .............................................................12

Output Disable Mode ...........................................................................12

Table 2. Sector Address Tables (Am29LV160MT) ...................13

Table 3. Sector Address Tables (Am29LV160MB) ...................14

DQ5: Exceeded Timing Limits .......................................................... 37

DQ3: Sector Erase Timer ...................................................................38

Table 12. Write Operation Status ........................................ 38

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . .39

Figure 9. Maximum Negative Overshoot Waveform ............... 39

Figure 10. Maximum Positive Overshoot Waveform ............... 39

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 39

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 40

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Figure 11. Test Setup........................................................ 41

Table 13. Test Specifications .............................................. 41

Figure 12. Input Waveforms and Measurement Levels ........... 41

Autoselect Mode ....................................................................................15

Table 4. Autoselect Codes (High Voltage Method) ..................15

Sector Protection/Unprotection .......................................................15

Temporary Sector Unprotect ............................................................16

Figure 1. Temporary Sector Unprotect Operation................... 16

Figure 2. In-System Single High Voltage Sector Protect/

Unprotect Algorithms ........................................................ 17

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .42

Read Operations ...................................................................................42

Figure 13. Read Operations Timings.................................... 42

Hardware Reset (RESET#) .................................................................43

Figure 14. RESET# Timings ............................................... 43

Secured Silicon Sector Flash Memory Region .............................. 18

Table 5. Secured Silicon Sector Addressing ...........................18

Word/Byte Configuration (BYTE#) ..............................................44

Figure 15. BYTE# Timings for Read Operations..................... 44

Figure 16. BYTE# Timings for Write Operations .................... 44

Customer Lockable: Secured Silicon Sector NOT Programmed

or Protected At the Factory .............................................................. 18

Figure 3. Secured Silicon Sector Protect Verify ...................... 19

Erase/Program Operations ................................................................45

Figure 17. Program Operation Timings ................................

Figure 18. Chip/Sector Erase Operation Timings ...................

Figure 19. Data# Polling Timings

(During Embedded Algorithms) ..........................................

Figure 20. Toggle Bit Timings

(During Embedded Algorithms) ..........................................

Figure 21. DQ2 vs. DQ6 for Erase and

Erase Suspend Operations .................................................

Figure 22. Temporary Sector Unprotect/Timing Diagram........

Figure 23. Sector Protect/Unprotect Timing Diagram .............

Figure 24. Alternate CE# Controlled Write Operation Timings .

Common Flash Memory Interface (CFI) ....................................... 20

Table 6. CFI Query Identification String ...............................20

Table 7. System Interface String .........................................21

Table 8. Device Geometry Definition ....................................21

Table 9. Primary Vendor-Specific Extended Query .................22

Hardware Data Protection ................................................................22

Low V

Write Inhibit ........................................................................22

Write Pulse “Glitch” Protection ......................................................22

Logical Inhibit ..........................................................................................23

Power-Up Write Inhibit ......................................................................23

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 23

Reading Array Data ..............................................................................23

Reset Command ....................................................................................23

Autoselect Command Sequence ......................................................24

Word/Byte Program Command Sequence ...................................24

Unlock Bypass Command Sequence ...............................................25

Figure 4. Program Operation .............................................. 26

Chip Erase Command Sequence ......................................................26

Sector Erase Command Sequence ...................................................27

Erase Suspend/Erase Resume Commands .....................................27

Figure 5. Erase Operation .................................................. 29

Erase and Programming Performance . . . . . . . . .53

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 53

TSOP Pin and BGA Package Capacitance . . . . . 53

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . .54

TS 048—48-Pin Standard TSOP ......................................................54

TSR048—48-Pin Reverse TSOP ......................................................55

FBA048—48-Ball Fine-Pitch Ball Grid Array (BGA)

6 x 8 mm Package .................................................................................56

LAA064—64-Ball Fortified Ball Grid Array (BGA)

13 x 11 mm Package ................................................................................57

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 58

Program Suspend/Program Resume Command Sequence .......29

Figure 6. Program Suspend/Program Resume ....................... 30

Command Definitions Tables .............................................................31

Write Operation Status . . . . . . . . . . . . . . . . . . . . 33

January 31, 2007 25974B5

Am29LV160M

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