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517.028.009.026.000

Description
Board Connector, 26 Contact(s), 2 Row(s), Female, Straight, Solder Terminal
CategoryThe connector    The connector   
File Size66KB,2 Pages
ManufacturerODU
Environmental Compliance
Download Datasheet Parametric View All

517.028.009.026.000 Overview

Board Connector, 26 Contact(s), 2 Row(s), Female, Straight, Solder Terminal

517.028.009.026.000 Parametric

Parameter NameAttribute value
Is it Rohs certified?Yes
Objectid8101897967
Reach Compliance CodeUnknown
ECCN codeEAR99
Is SamacsysN
YTEOL9.1
Terminal pitch2.54 mm
Total number of contacts26
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD (20) OVER NICKEL (50)
Contact point genderFEMALE
Installation methodSTRAIGHT
Installation typeBOARD
Number of rows loaded2
Contact completed and terminatedTIN OVER NICKEL
Contact materialCOPPER ALLOY
Mixed contactsNO
Number of connectorsONE
OptionsGENERAL PURPOSE
Termination typeSOLDER
MIL complianceNO
UL Flammability Code94V-0
DIN complianceNO
IEC complianceNO
JESD-609 codee3
Filter functionNO
ODU CARD
ODU CARD female headers, Series 517
for pin headers in cross-section 0.64 × 0.64 mm
2-row, for vertical assembly with angled soldering lugs
Brief description
Female headers, 2-row, in through-hole design with a
2.54-mm pitch, matching the ODU CARD pin headers.
The soldering lugs are angled, the solder hole is next to
the mating hole. The advantages of this female header
model are:
– No manual soldering because these connectors can be
soldered together with other components in the splash
bath.
– No covering the sockets contacts because they are not
moistened by the rising solder.
– Special holes are eliminated because the soldering lugs
are produced in the 7.62-mm pitch.
Technical data
Electrical specification
Contact load:
Contact resistance:
Insulation resistance:
Test voltage:
Female headers, 2-row
Dimensions
L +1/-0.15
5.08
5A
≤4m
> 1 GΩ
1,500 V ~
2.54
max. 2.02
max. 1.52
3.1
7.62
min. 6.5 mm
Mechanical specification
Operating temperature: – 40 °C to +125 °C
Humidity level:
75 % rel. humidity in
accordance with
DIN EN 60721-3-3
Material and surface plating
Contact surface
Mating area:
0.5 μm Au on 1.25 μm Ni /
MIL-G-45204 Cl. 00 *)
Termination area:
2.0 μm Sn on 1.25 μm Ni
Insulator material:
PBT grey
GF in accordance with
UL94 V-0
Contact material:
Copper alloy
Terminations:
Solder contacts
*) Applies to contact points in the mating area.
Rest of surface plating is flash-gold-plated or Sn on Ni.
Mating
direction
min. 6.5 mm
Mating
direction
www.odu.de
7.1
Page 14

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