MT41K128M16JT-107 AAT:K TR datasheet, PDF

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MT41K128M16JT-107 AAT:K TR: DescriptionSDRAM - DDR3L 存储器 IC 2Gb（128M x 16）并联 933 MHz 20 ns 96-FBGA（8x14）; Categorysemiconductor memory; File Size16MB，211 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT41K128M16JT-107 AAT:K TR Overview

SDRAM - DDR3L 存储器 IC 2Gb（128M x 16）并联 933 MHz 20 ns 96-FBGA（8x14）

MT41K128M16JT-107 AAT:K TR Parametric

Parameter Name	Attribute value
category
Maker	Micron Technology
series	Automotive, AEC-Q100
Package	Tape and Reel (TR)
memory type	Volatile
memory format	DRAM
technology	SDRAM - DDR3L
storage	2Gb（128M x 16）
memory interface	in parallel
Write cycle time - words, pages	15ns
Voltage - Power supply	1.283V ~ 1.45V
Operating temperature	-40°C ~ 105°C（TC）
Installation type	surface mount type
Package/casing	96-TFBGA
Supplier device packaging	96-FBGA（8x14）
Clock frequency	933 MHz
interview time	20 ns
Basic product number	MT41K128M16

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2Gb: x8, x16 Automotive DDR3L SDRAM

Description

1.35V Automotive DDR3L SDRAM

MT41K256M8 – 32 Meg x 8 x 8 banks

MT41K128M16 – 16 Meg x 16 x 8 banks

Description

The 1.35V DDR3L SDRAM device is a low-voltage ver-

sion of the 1.5V DDR3 SDRAM device. Refer to the

DDR3 (1.5V) SDRAM data sheet specifications when

running in 1.5V compatible mode.

•

Output driver calibration

AEC-Q100

PPAP submission

8D response time

Options

• Configuration

– 256 Meg x 8

– 128 Meg x 16

• FBGA package (Pb-free)

– 78-ball FBGA (8mm x 10.5mm)

– x8

– 96-ball FBGA (8mm x 14mm)

– x16

• Timing – cycle time

– 1.07ns @ CL = 13 (DDR3-1866)

– 1.25ns @ CL = 11 (DDR3-1600)

– 1.5ns @ CL = 9 (DDR3-1333)

– 1.875ns @ CL = 7 (DDR3-1066)

• Product certification

– Automotive

• Operating temperature

– Industrial (–40°C

≤

+95°C)

– Automotive (–40°C

≤

+105°C)

– Ultra-high (–40°C

≤

+125°C)

• Revision

Notes:

Marking

256M8

128M16

-107

-125

-15E

-187E

Features

•

= V

DDQ

= 1.35V (1.283–1.45V)

Backward-compatible to V

= V

DDQ

= 1.5V ±0.075V

Differential bidirectional data strobe

8n-bit prefetch architecture

Differential clock inputs (CK, CK#)

8 internal banks

Nominal and dynamic on-die termination (ODT)

for data, strobe, and mask signals

Programmable CAS (READ) latency (CL)

Programmable posted CAS additive latency (AL)

Programmable CAS (WRITE) latency (CWL)

Fixed burst length (BL) of 8 and burst chop (BC) of 4

(via the mode register set [MRS])

Selectable BC4 or BL8 on-the-fly (OTF)

Self refresh mode

Refresh maximum interval time at T

temperature

range

– 64ms at –40°C to +85°C

– 32ms at +85°C to +105°C

– 16ms at +105°C to +115°C

– 8ms at +115°C to +125°C

Self refresh temperature (SRT)

Automatic self refresh (ASR)

Write leveling

Multipurpose register

•

1. Not all options listed can be combined to

define an offered product. Use the part cat-

alog search on

http://www.micron.com for available offer-

ings.

2. The UT option use based on automotive us-

age model. Please contact Micron sales rep-

resentative if you have questions. The UT

option is not available for -107 speed grade.

Table 1: Key Timing Parameters

Speed Grade

-107

1, 2, 3

-125

1, 2

-15E

Data Rate (MT/s)

1866

1600

1333

Target

RCD-

RP-CL

13-13-13

11-11-11

9-9-9

RCD

(ns)

CL (ns)

13.91

13.75

13.5

13.91

13.75

13.5

13.91

13.75

13.5

09005aef85741711

2Gb_auto_DDR3L.pdf - Rev. E 8/20 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x8, x16 Automotive DDR3L SDRAM

Description

Contents

Important Notes and Warnings ....................................................................................................................... 11

State Diagram ................................................................................................................................................ 12

Functional Description ................................................................................................................................... 13

Industrial Temperature ............................................................................................................................... 13

Automotive Temperature ............................................................................................................................ 13

Ultra-high Temperature .............................................................................................................................. 14

General Notes ............................................................................................................................................ 14

Functional Block Diagrams ............................................................................................................................. 15

Ball Assignments and Descriptions ................................................................................................................. 17

Package Dimensions ....................................................................................................................................... 23

Electrical Specifications .................................................................................................................................. 25

Absolute Ratings ......................................................................................................................................... 25

Input/Output Capacitance .......................................................................................................................... 26

Thermal Characteristics .................................................................................................................................. 27

Electrical Specifications – I

Specifications and Conditions ............................................................................ 29

Electrical Characteristics – I

Specifications .................................................................................................. 40

Electrical Specifications – DC and AC .............................................................................................................. 42

DC Operating Conditions ........................................................................................................................... 42

Input Operating Conditions ........................................................................................................................ 43

DDR3L 1.35V AC Overshoot/Undershoot Specification ................................................................................ 47

DDR3L 1.35V Slew Rate Definitions for Single-Ended Input Signals .............................................................. 51

DDR3L 1.35V Slew Rate Definitions for Differential Input Signals ................................................................. 53

ODT Characteristics ....................................................................................................................................... 54

1.35V ODT Resistors ................................................................................................................................... 55

ODT Sensitivity .......................................................................................................................................... 56

ODT Timing Definitions ............................................................................................................................. 56

Output Driver Impedance ............................................................................................................................... 60

34 Ohm Output Driver Impedance .............................................................................................................. 61

DDR3L 34 Ohm Driver ................................................................................................................................ 62

DDR3L 34 Ohm Output Driver Sensitivity .................................................................................................... 63

DDR3L Alternative 40 Ohm Driver ............................................................................................................... 64

DDR3L 40 Ohm Output Driver Sensitivity .................................................................................................... 64

Output Characteristics and Operating Conditions ............................................................................................ 66

Reference Output Load ............................................................................................................................... 69

Slew Rate Definitions for Single-Ended Output Signals ................................................................................. 69

Slew Rate Definitions for Differential Output Signals .................................................................................... 71

Speed Bin Tables ............................................................................................................................................ 72

Electrical Characteristics and AC Operating Conditions ................................................................................... 76

Command and Address Setup, Hold, and Derating ........................................................................................... 95

Data Setup, Hold, and Derating ...................................................................................................................... 102

Commands – Truth Tables ............................................................................................................................. 111

Commands ................................................................................................................................................... 114

DESELECT ................................................................................................................................................ 114

NO OPERATION ........................................................................................................................................ 114

ZQ CALIBRATION LONG ........................................................................................................................... 114

ZQ CALIBRATION SHORT .......................................................................................................................... 114

ACTIVATE ................................................................................................................................................. 114

READ ........................................................................................................................................................ 114

WRITE ...................................................................................................................................................... 115

PRECHARGE ............................................................................................................................................. 116

09005aef85741711

2Gb_auto_DDR3L.pdf - Rev. E 8/20 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x8, x16 Automotive DDR3L SDRAM

Description

REFRESH .................................................................................................................................................. 116

SELF REFRESH .......................................................................................................................................... 117

DLL Disable Mode ..................................................................................................................................... 118

Input Clock Frequency Change ...................................................................................................................... 122

Write Leveling ............................................................................................................................................... 124

Write Leveling Procedure ........................................................................................................................... 126

Write Leveling Mode Exit Procedure ........................................................................................................... 128

Initialization ................................................................................................................................................. 129

Voltage Initialization/Change ........................................................................................................................ 131

Voltage Switching ............................................................................................................................... 132

Mode Registers .............................................................................................................................................. 133

Mode Register 0 (MR0) ................................................................................................................................... 134

Burst Length ............................................................................................................................................. 134

Burst Type ................................................................................................................................................. 135

DLL RESET ................................................................................................................................................ 136

Write Recovery .......................................................................................................................................... 137

Precharge Power-Down (Precharge PD) ...................................................................................................... 137

CAS Latency (CL) ....................................................................................................................................... 137

Mode Register 1 (MR1) ................................................................................................................................... 139

DLL Enable/DLL Disable ........................................................................................................................... 139

Output Drive Strength ............................................................................................................................... 140

OUTPUT ENABLE/DISABLE ...................................................................................................................... 140

TDQS Enable ............................................................................................................................................. 140

On-Die Termination .................................................................................................................................. 141

WRITE LEVELING ..................................................................................................................................... 141

POSTED CAS ADDITIVE Latency ................................................................................................................ 141

Mode Register 2 (MR2) ................................................................................................................................... 142

CAS Write Latency (CWL) ........................................................................................................................... 143

AUTO SELF REFRESH (ASR) ....................................................................................................................... 143

SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 144

SRT vs. ASR ............................................................................................................................................... 144

DYNAMIC ODT ......................................................................................................................................... 144

Mode Register 3 (MR3) ................................................................................................................................... 145

MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 145

MPR Functional Description ...................................................................................................................... 146

MPR Register Address Definitions and Bursting Order ................................................................................. 147

MPR Read Predefined Pattern .................................................................................................................... 152

MODE REGISTER SET (MRS) Command ........................................................................................................ 152

ZQ CALIBRATION Operation ......................................................................................................................... 153

ACTIVATE Operation ..................................................................................................................................... 154

READ Operation ............................................................................................................................................ 156

WRITE Operation .......................................................................................................................................... 167

DQ Input Timing ....................................................................................................................................... 175

PRECHARGE Operation ................................................................................................................................. 177

SELF REFRESH Operation .............................................................................................................................. 177

Extended Temperature Usage ........................................................................................................................ 179

Power-Down Mode ........................................................................................................................................ 180

RESET Operation ........................................................................................................................................... 188

On-Die Termination (ODT) ............................................................................................................................ 190

Functional Representation of ODT ............................................................................................................. 190

Nominal ODT ............................................................................................................................................ 190

Dynamic ODT ............................................................................................................................................... 192

09005aef85741711

2Gb_auto_DDR3L.pdf - Rev. E 8/20 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x8, x16 Automotive DDR3L SDRAM

Description

Dynamic ODT Special Use Case ................................................................................................................. 192

Functional Description .............................................................................................................................. 192

Synchronous ODT Mode ................................................................................................................................ 198

ODT Latency and Posted ODT .................................................................................................................... 198

Timing Parameters .................................................................................................................................... 198

ODT Off During READs .............................................................................................................................. 201

Asynchronous ODT Mode .............................................................................................................................. 203

Synchronous to Asynchronous ODT Mode Transition (Power-Down Entry) .................................................. 205

Asynchronous to Synchronous ODT Mode Transition (Power-Down Exit) ........................................................ 207

Asynchronous to Synchronous ODT Mode Transition (Short CKE Pulse) ...................................................... 209

Revision History ............................................................................................................................................ 211

Rev. E – 08/20 ............................................................................................................................................ 211

Rev. D – 10/19 ............................................................................................................................................ 211

Rev. C – 3/18 .............................................................................................................................................. 211

Rev. B – 6/16 .............................................................................................................................................. 211

Rev. A – 3/14 .............................................................................................................................................. 211

09005aef85741711

2Gb_auto_DDR3L.pdf - Rev. E 8/20 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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