MT47H128M16RT-25E AAT:C TR datasheet, PDF

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MT47H128M16RT-25E AAT:C TR: DescriptionSDRAM - DDR2 存储器 IC 2Gb（128M x 16）并联 84-FBGA（9x12.5）; Categorysemiconductor memory; File Size9MB，127 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT47H128M16RT-25E AAT:C TR Overview

SDRAM - DDR2 存储器 IC 2Gb（128M x 16）并联 84-FBGA（9x12.5）

MT47H128M16RT-25E AAT:C TR Parametric

Parameter Name	Attribute value
category
Maker	Micron Technology
series	Automotive, AEC-Q100
Package	卷带（TR）剪切带（CT）Digi-Reel®
memory type	Volatile
memory format	DRAM
technology	SDRAM - DDR2
storage	2Gb（128M x 16）
memory interface	in parallel
Write cycle time - words, pages	15ns
Voltage - Power supply	1.7V ~ 1.9V
Operating temperature	-40°C ~ 105°C（TC）
Installation type	surface mount type
Package/casing	84-TFBGA
Supplier device packaging	84-FBGA（9x12.5）
Basic product number	MT47H128M16

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2Gb: x8, x16 Automotive DDR2 SDRAM

Features

Automotive DDR2 SDRAM

MT47H256M8 – 32 Meg x 8 x 8 banks

MT47H128M16 – 16 Meg x 16 x 8 banks

Features

•

Industrial and automotive temperature compliant

= 1.8V ±0.1V, V

DDQ

= 1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

8 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Programmable burst lengths (BL): 4 or 8

Adjustable data-output drive strength

32ms, 8192-cycle refresh

On-die termination (ODT)

RoHS-compliant

Supports JEDEC clock jitter specification

AEC-Q100

PPAP submisson

8D response time

Options

• Configuration

– 256 Meg x 8 (32 Meg x 8 x 8 banks)

– 128 Meg x 16 (16 Meg x 16 x 8 banks)

• FBGA package (Pb-free) – x8

– 60-ball FBGA (9mm x 11.5mm)

• FBGA package (Pb-free) – x16

– 84-ball FBGA (9mm x 12.5mm)

• FBGA package (lead solder) – x16

– 84-ball FBGA (9mm x 12.5mm)

• Timing – cycle time

– 2.5ns @ CL = 5 (DDR2-800)

– 3.0ns @ CL = 5 (DDR2-667)

• Self refresh

– Standard

• Operating temperature

– Industrial (–40°C

≤

+95°C;

–40°C

≤

+85°C)

– Automotive (–40°C

≤

, T

≤

+105°C)

• Revision

Note:

Marking

256M8

128M16

-25E

-3

None

AIT

AAT

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

Table 1: Key Timing Parameters

Data Rate (MT/s)

Speed Grade

-25E

-25

-3

CL = 3

n/a

400

CL = 4

533

CL = 5

800

667

CL = 6

800

n/a

CL = 7

n/a

(ns)

09005aef8441c566

2gbddr2_ait_aat.pdf – Rev. F 06/18 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x8, x16 Automotive DDR2 SDRAM

Features

Contents

Important Notes and Warnings ......................................................................................................................... 8

State Diagram .................................................................................................................................................. 9

Functional Description ................................................................................................................................... 10

Automotive Industrial Temperature ............................................................................................................. 10

Automotive Temperature ............................................................................................................................ 11

General Notes ............................................................................................................................................ 11

Ball Assignments and Descriptions ................................................................................................................. 12

Packaging ...................................................................................................................................................... 16

Package Dimensions ................................................................................................................................... 16

FBGA Package Capacitance ......................................................................................................................... 18

Electrical Specifications – Absolute Ratings ..................................................................................................... 19

Temperature and Thermal Impedance ........................................................................................................ 19

Electrical Specifications – I

Parameters ........................................................................................................ 21

Specifications and Conditions ............................................................................................................... 21

DD7

Conditions .......................................................................................................................................... 22

AC Timing Operating Specifications ................................................................................................................ 25

AC and DC Operating Conditions .................................................................................................................... 37

ODT DC Electrical Characteristics ................................................................................................................... 38

Input Electrical Characteristics and Operating Conditions ............................................................................... 39

Output Electrical Characteristics and Operating Conditions ............................................................................. 42

Output Driver Characteristics ......................................................................................................................... 44

Power and Ground Clamp Characteristics ....................................................................................................... 48

AC Overshoot/Undershoot Specification ......................................................................................................... 49

Input Slew Rate Derating ................................................................................................................................ 51

Commands .................................................................................................................................................... 64

Truth Tables ............................................................................................................................................... 64

DESELECT ................................................................................................................................................. 68

NO OPERATION (NOP) ............................................................................................................................... 69

LOAD MODE (LM) ...................................................................................................................................... 69

ACTIVATE .................................................................................................................................................. 69

READ ......................................................................................................................................................... 69

WRITE ....................................................................................................................................................... 69

PRECHARGE .............................................................................................................................................. 70

REFRESH ................................................................................................................................................... 70

SELF REFRESH ........................................................................................................................................... 70

Mode Register (MR) ........................................................................................................................................ 70

Burst Length .............................................................................................................................................. 71

Burst Type .................................................................................................................................................. 72

Operating Mode ......................................................................................................................................... 72

DLL RESET ................................................................................................................................................. 72

Write Recovery ........................................................................................................................................... 73

Power-Down Mode ..................................................................................................................................... 73

CAS Latency (CL) ........................................................................................................................................ 74

Extended Mode Register (EMR) ....................................................................................................................... 75

DLL Enable/Disable ................................................................................................................................... 76

Output Drive Strength ................................................................................................................................ 76

DQS# Enable/Disable ................................................................................................................................. 76

RDQS Enable/Disable ................................................................................................................................. 76

Output Enable/Disable ............................................................................................................................... 76

On-Die Termination (ODT) ......................................................................................................................... 77

09005aef8441c566

2gbddr2_ait_aat.pdf – Rev. F 06/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x8, x16 Automotive DDR2 SDRAM

Features

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 77

Posted CAS Additive Latency (AL) ................................................................................................................ 77

Extended Mode Register 2 (EMR2) ................................................................................................................... 79

Extended Mode Register 3 (EMR3) ................................................................................................................... 80

Initialization .................................................................................................................................................. 81

ACTIVATE ...................................................................................................................................................... 84

READ ............................................................................................................................................................. 86

READ with Precharge .................................................................................................................................. 90

READ with Auto Precharge .......................................................................................................................... 92

WRITE ........................................................................................................................................................... 97

PRECHARGE ................................................................................................................................................. 107

REFRESH ...................................................................................................................................................... 108

SELF REFRESH .............................................................................................................................................. 109

Power-Down Mode ........................................................................................................................................ 111

Precharge Power-Down Clock Frequency Change ........................................................................................... 118

Reset ............................................................................................................................................................. 119

CKE Low Anytime ...................................................................................................................................... 119

ODT Timing .................................................................................................................................................. 121

MRS Command to ODT Update Delay ........................................................................................................ 123

09005aef8441c566

2gbddr2_ait_aat.pdf – Rev. F 06/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x8, x16 Automotive DDR2 SDRAM

Features

List of Tables

Table 1: Key Timing Parameters ....................................................................................................................... 1

Table 2: Addressing ......................................................................................................................................... 2

Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions .......................................................................... 14

Table 4: Input Capacitance ............................................................................................................................ 18

Table 5: Absolute Maximum DC Ratings ......................................................................................................... 19

Table 6: Temperature Limits .......................................................................................................................... 20

Table 7: Thermal Impedance ......................................................................................................................... 20

Table 8: General I

Parameters ..................................................................................................................... 21

Table 9: I

DD7

Timing Patterns (8-Bank Interleave READ Operation) ................................................................. 22

Table 10: DDR2 I

Specifications and Conditions (Die Revision C) ................................................................ 23

Table 11: AC Operating Specifications and Conditions .................................................................................... 25

Table 12: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 37

Table 13: ODT DC Electrical Characteristics ................................................................................................... 38

Table 14: Input DC Logic Levels ..................................................................................................................... 39

Table 15: Input AC Logic Levels ...................................................................................................................... 39

Table 16: Differential Input Logic Levels ......................................................................................................... 40

Table 17: Differential AC Output Parameters ................................................................................................... 42

Table 18: Output DC Current Drive ................................................................................................................ 42

Table 19: Output Characteristics .................................................................................................................... 43

Table 20: Full Strength Pull-Down Current (mA) ............................................................................................. 44

Table 21: Full Strength Pull-Up Current (mA) .................................................................................................. 45

Table 22: Reduced Strength Pull-Down Current (mA) ...................................................................................... 46

Table 23: Reduced Strength Pull-Up Current (mA) .......................................................................................... 47

Table 24: Input Clamp Characteristics ............................................................................................................ 48

Table 25: Address and Control Balls ................................................................................................................ 49

Table 26: Clock, Data, Strobe, and Mask Balls ................................................................................................. 49

Table 27: AC Input Test Conditions ................................................................................................................ 49

Table 28: DDR2-400/533 Setup and Hold Time Derating Values (

IS and

IH) .................................................... 52

Table 29: DDR2-667/800/1066 Setup and Hold Time Derating Values (

IS and

IH) ........................................... 53

Table 30: DDR2-400/533

DS,

DH Derating Values with Differential Strobe ...................................................... 56

Table 31: DDR2-667/800/1066

DS,

DH Derating Values with Differential Strobe ............................................. 57

Table 32: Single-Ended DQS Slew Rate Derating Values Using

and

................................................... 58

Table 33: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-667 ...................................... 58

Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-533 ...................................... 59

Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-400 ...................................... 59

Table 36: Truth Table – DDR2 Commands ...................................................................................................... 64

Table 37: Truth Table – Current State Bank

– Command to Bank

................................................................ 65

Table 38: Truth Table – Current State Bank

– Command to Bank

............................................................... 67

Table 39: Minimum Delay with Auto Precharge Enabled ................................................................................. 68

Table 40: Burst Definition .............................................................................................................................. 72

Table 41: READ Using Concurrent Auto Precharge .......................................................................................... 92

Table 42: WRITE Using Concurrent Auto Precharge ........................................................................................ 98

Table 43: Truth Table – CKE .......................................................................................................................... 113

09005aef8441c566

2gbddr2_ait_aat.pdf – Rev. F 06/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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