MT48LC32M16A2P-75 IT:C datasheet, PDF

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MT48LC32M16A2P-75 IT:C: DescriptionSDRAM 存储器 IC 512Mb（32M x 16）并联 133 MHz 5.4 ns 54-TSOP II; Categorysemiconductor memory; File Size1MB，77 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT48LC32M16A2P-75 IT:C Overview

SDRAM 存储器 IC 512Mb（32M x 16）并联 133 MHz 5.4 ns 54-TSOP II

MT48LC32M16A2P-75 IT:C Parametric

Parameter Name	Attribute value
category
Maker	Micron Technology
series	-
Package	tray
memory type	Volatile
memory format	DRAM
technology	SDRAM
storage	512Mb（32M x 16）
memory interface	in parallel
Write cycle time - words, pages	15ns
Voltage - Power supply	3V ~ 3.6V
Operating temperature	-40°C ~ 85°C（TA）
Installation type	surface mount type
Package/casing	54-TSOP (0.400", 10.16mm wide)
Supplier device packaging	54-TSOP II
Clock frequency	133 MHz
interview time	5.4 ns
Basic product number	MT48LC32M16A2

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512Mb: x4, x8, x16 SDRAM

Features

SDR SDRAM

MT48LC128M4A2 – 32 Meg x 4 x 4 banks

MT48LC64M8A2 – 16 Meg x 8 x 4 banks

MT48LC32M16A2 – 8 Meg x 16 x 4 banks

Features

• PC100- and PC133-compliant

• Fully synchronous; all signals registered on positive

edge of system clock

• Internal, pipelined operation; column address can

be changed every clock cycle

• Internal banks for hiding row access/precharge

• Programmable burst lengths: 1, 2, 4, 8, or full page

• Auto precharge, includes concurrent auto precharge

and auto refresh modes

• Self refresh mode

• Auto refresh

– 64ms, 8192-cycle refresh (commercial and

industrial)

• LVTTL-compatible inputs and outputs

• Single 3.3V ±0.3V power supply

Options

• Configurations

– 128 Meg x 4 (32 Meg x 4 x 4 banks)

– 64 Meg x 8 (16 Meg x 8 x 4 banks)

– 32 Meg x 16 (8 Meg x 16 x 4 banks)

• Write recovery (

WR)

–

WR = 2 CLK

• Plastic package – OCPL

– 54-pin TSOP II (400 mil) (standard)

– 54-pin TSOP II (400 mil) Pb-free

• Timing – cycle time

– 7.5ns @ CL = 3 (PC133)

– 7.5ns @ CL = 2 (PC133)

• Self refresh

– Standard

– Low power

• Operating temperature range

– Commercial (0˚C to +70˚C)

– Industrial (–40˚C to +85˚C)

• Revision

Notes:

1. See technical note TN-48-05 on

Micron's Web site.

2. Off-center parting line.

3. Available on x4 and x8 only.

4. Contact Micron for availability.

Marking

128M4

64M8

32M16

-75

-7E

None

Table 1: Key Timing Parameters

CL = CAS (READ) latency

Speed Grade

-7E

-75

-7E

-75

Clock

Frequency

143 MHz

133 MHz

100 MHz

Access Time

CL = 2

–

5.4ns

6ns

CL = 3

5.4ns

–

Setup Time

1.5ns

Hold Time

0.8ns

PDF: 09005aef809bf8f3

512Mb_sdr.pdf - Rev. R 05/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

512Mb: x4, x8, x16 SDRAM

Features

Contents

General Description ......................................................................................................................................... 6

Functional Block Diagrams ............................................................................................................................... 7

Pin and Ball Assignments and Descriptions ..................................................................................................... 10

Package Dimensions ....................................................................................................................................... 12

Temperature and Thermal Impedance ............................................................................................................ 13

Electrical Specifications .................................................................................................................................. 15

Electrical Specifications – I

Parameters ........................................................................................................ 17

Electrical Specifications – AC Operating Conditions ......................................................................................... 18

Functional Description ................................................................................................................................... 21

Commands .................................................................................................................................................... 22

COMMAND INHIBIT .................................................................................................................................. 22

NO OPERATION (NOP) ............................................................................................................................... 23

LOAD MODE REGISTER (LMR) ................................................................................................................... 23

ACTIVE ...................................................................................................................................................... 23

READ ......................................................................................................................................................... 24

WRITE ....................................................................................................................................................... 25

PRECHARGE .............................................................................................................................................. 26

BURST TERMINATE ................................................................................................................................... 26

REFRESH ................................................................................................................................................... 27

AUTO REFRESH ..................................................................................................................................... 27

SELF REFRESH ....................................................................................................................................... 27

Truth Tables ................................................................................................................................................... 28

Initialization .................................................................................................................................................. 33

Mode Register ................................................................................................................................................ 35

Burst Length .............................................................................................................................................. 37

Burst Type .................................................................................................................................................. 37

CAS Latency ............................................................................................................................................... 39

Operating Mode ......................................................................................................................................... 39

Write Burst Mode ....................................................................................................................................... 39

Bank/Row Activation ...................................................................................................................................... 40

READ Operation ............................................................................................................................................. 41

WRITE Operation ........................................................................................................................................... 50

Burst Read/Single Write .............................................................................................................................. 57

PRECHARGE Operation .................................................................................................................................. 58

Auto Precharge ........................................................................................................................................... 58

AUTO REFRESH Operation ............................................................................................................................. 70

SELF REFRESH Operation ............................................................................................................................... 72

Power-Down .................................................................................................................................................. 74

Clock Suspend ............................................................................................................................................... 75

PDF: 09005aef809bf8f3

512Mb_sdr.pdf - Rev. R 05/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x4, x8, x16 SDRAM

Features

List of Figures

Figure 1: 128 Meg x 4 Functional Block Diagram ............................................................................................... 7

Figure 2: 64 Meg x 8 Functional Block Diagram ................................................................................................. 8

Figure 3: 32 Meg x 16 Functional Block Diagram ............................................................................................... 9

Figure 4: 54-Pin TSOP (Top View) .................................................................................................................. 10

Figure 5: 54-Pin Plastic TSOP (400 mil) – Package Codes TG/P ......................................................................... 12

Figure 6: Example: Temperature Test Point Location, 54-Pin TSOP (Top View) ................................................. 14

Figure 7: ACTIVE Command .......................................................................................................................... 23

Figure 8: READ Command ............................................................................................................................. 24

Figure 9: WRITE Command ........................................................................................................................... 25

Figure 10: PRECHARGE Command ................................................................................................................ 26

Figure 11: Initialize and Load Mode Register .................................................................................................. 34

Figure 12: Mode Register Definition ............................................................................................................... 36

Figure 13: CAS Latency .................................................................................................................................. 39

Figure 14: Example: Meeting

RCD (MIN) When 2 <

RCD (MIN)/

CK < 3 .......................................................... 40

Figure 15: Consecutive READ Bursts .............................................................................................................. 42

Figure 16: Random READ Accesses ................................................................................................................ 43

Figure 17: READ-to-WRITE ............................................................................................................................ 44

Figure 18: READ-to-WRITE With Extra Clock Cycle ......................................................................................... 45

Figure 19: READ-to-PRECHARGE .................................................................................................................. 45

Figure 20: Terminating a READ Burst ............................................................................................................. 46

Figure 21: Alternating Bank Read Accesses ..................................................................................................... 47

Figure 22: READ Continuous Page Burst ......................................................................................................... 48

Figure 23: READ – DQM Operation ................................................................................................................ 49

Figure 24: WRITE Burst ................................................................................................................................. 50

Figure 25: WRITE-to-WRITE .......................................................................................................................... 51

Figure 26: Random WRITE Cycles .................................................................................................................. 52

Figure 27: WRITE-to-READ ............................................................................................................................ 52

Figure 28: WRITE-to-PRECHARGE ................................................................................................................. 53

Figure 29: Terminating a WRITE Burst ............................................................................................................ 54

Figure 30: Alternating Bank Write Accesses ..................................................................................................... 55

Figure 31: WRITE – Continuous Page Burst ..................................................................................................... 56

Figure 32: WRITE – DQM Operation ............................................................................................................... 57

Figure 33: READ With Auto Precharge Interrupted by a READ ......................................................................... 59

Figure 34: READ With Auto Precharge Interrupted by a WRITE ........................................................................ 60

Figure 35: READ With Auto Precharge ............................................................................................................ 61

Figure 36: READ Without Auto Precharge ....................................................................................................... 62

Figure 37: Single READ With Auto Precharge .................................................................................................. 63

Figure 38: Single READ Without Auto Precharge ............................................................................................. 64

Figure 39: WRITE With Auto Precharge Interrupted by a READ ........................................................................ 65

Figure 40: WRITE With Auto Precharge Interrupted by a WRITE ...................................................................... 65

Figure 41: WRITE With Auto Precharge ........................................................................................................... 66

Figure 42: WRITE Without Auto Precharge ..................................................................................................... 67

Figure 43: Single WRITE With Auto Precharge ................................................................................................. 68

Figure 44: Single WRITE Without Auto Precharge ............................................................................................ 69

Figure 45: Auto Refresh Mode ........................................................................................................................ 71

Figure 46: Self Refresh Mode .......................................................................................................................... 73

Figure 47: Power-Down Mode ........................................................................................................................ 74

Figure 48: Clock Suspend During WRITE Burst ............................................................................................... 75

Figure 49: Clock Suspend During READ Burst ................................................................................................. 76

Figure 50: Clock Suspend Mode ..................................................................................................................... 77

PDF: 09005aef809bf8f3

512Mb_sdr.pdf - Rev. R 05/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

512Mb: x4, x8, x16 SDRAM

Features

List of Tables

Table 1: Key Timing Parameters ....................................................................................................................... 1

Table 2: Address Table ..................................................................................................................................... 2

Table 3: 512Mb SDR Part Numbering ............................................................................................................... 2

Table 4: Pin and Ball Descriptions .................................................................................................................. 11

Table 5: Temperature Limits .......................................................................................................................... 13

Table 6: Thermal Impedance Simulated Values ............................................................................................... 14

Table 7: Absolute Maximum Ratings .............................................................................................................. 15

Table 8: DC Electrical Characteristics and Operating Conditions ..................................................................... 15

Table 9: Capacitance ..................................................................................................................................... 16

Table 10: I

Specifications and Conditions (-7E, -75) ..................................................................................... 17

Table 11: Electrical Characteristics and Recommended AC Operating Conditions (-7E, -75) ............................. 18

Table 12: AC Functional Characteristics (-7E, -75) ........................................................................................... 19

Table 13: Truth Table – Commands and DQM Operation ................................................................................. 22

Table 14: Truth Table – Current State Bank

Command to Bank

.................................................................. 28

Table 15: Truth Table – Current State Bank n, Command to Bank

................................................................. 30

Table 16: Truth Table – CKE ........................................................................................................................... 32

Table 17: Burst Definition Table ..................................................................................................................... 38

PDF: 09005aef809bf8f3

512Mb_sdr.pdf - Rev. R 05/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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