R5F101LEAFB#50 datasheet, PDF - EEWORLD Datasheet

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R5F101LEAFB#50: DescriptionRL78 series 微控制器 IC 16 位 32MHz 64KB（64K x 8）闪存 64-LFQFP（10x10）; Categorysemiconductor The embedded processor and controller; File Size3MB，207 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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R5F101LEAFB#50 Overview

RL78 series 微控制器 IC 16 位 32MHz 64KB（64K x 8）闪存 64-LFQFP（10x10）

R5F101LEAFB#50 Parametric

Parameter Name	Attribute value
category
Maker	Renesas Electronics Corporation
series	RL78/G13
Package	Tape and Reel (TR)
core processor	RL78
Kernel specifications	16 bit
speed	32MHz
Connectivity	CSI，I²C，LINbus，UART/USART
Peripheral	DMA，LVD，POR，PWM，WDT
Program storage capacity	64KB（64K x 8）
Program memory type	flash memory
EEPROM capacity	-
RAM size	4K x 8
Voltage - Power supply (Vcc/Vdd)	1.6V ~ 5.5V
data converter	A/D 12x8/10b
Oscillator type	internal
Operating temperature	-40°C ~ 85°C（TA）
Installation type	surface mount type
Package/casing	64-LQFP
Supplier device packaging	64-LFQFP（10x10）
Number of I/Os	48
Basic product number	R5F101

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Datasheet

RL78/G13

RENESAS MCU

R01DS0131EJ0350

Rev.3.50

Jun 30, 2020

True low-power platform (66

μA/MHz,

and 0.57

μA

for operation with only RTC and LVD) for the general-purpose

applications, with 1.6-V to 5.5-V operation, 16- to 512-Kbyte code flash memory, and 41 DMIPS at 32 MHz

1. OUTLINE

1.1 Features

Ultra-low power consumption technology



= single power supply voltage of 1.6 to 5.5 V



HALT mode



STOP mode



SNOOZE mode

RL78 CPU core



CISC architecture with 3-stage pipeline



Minimum instruction execution time: Can be changed

from high speed (0.03125

μs:

@ 32 MHz operation

with high-speed on-chip oscillator) to ultra-low speed

(30.5

μs:

@ 32.768 kHz operation with subsystem

clock)



Address space: 1 MB



General-purpose registers: (8-bit register × 8) × 4

banks



On-chip RAM: 2 to 32 KB

Code flash memory



Code flash memory: 16 to 512 KB



Block size: 1 KB



Prohibition of block erase and rewriting (security

function)



On-chip debug function



Self-programming (with boot swap function/flash shield

window function)

Data Flash Memory



Data flash memory: 4 KB to 8 KB



Back ground operation (BGO): Instructions can be

executed from the program memory while rewriting the

data flash memory.



Number of rewrites: 1,000,000 times (TYP.)



Voltage of rewrites: V

= 1.8 to 5.5 V

High-speed on-chip oscillator



Select from 32 MHz, 24 MHz, 16 MHz, 12 MHz, 8 MHz,

6 MHz, 4 MHz, 3 MHz, 2 MHz, and 1 MHz



High accuracy: +/- 1.0 % (V

= 1.8 to 5.5 V, T

= -20

to +85°C)

Operating ambient temperature



= -40 to +85°C (A: Consumer applications, D:

Industrial applications )



= -40 to +105°C (G: Industrial applications)

Power management and reset function



On-chip power-on-reset (POR) circuit



On-chip voltage detector (LVD) (Select interrupt and

reset from 14 levels)

DMA (Direct Memory Access) controller



2/4 channels



Number of clocks during transfer between 8/16-bit

SFR and internal RAM: 2 clocks

Multiplier and divider/multiply-accumulator



16 bits × 16 bits = 32 bits (Unsigned or signed)



32 bits ÷ 32 bits = 32 bits (Unsigned)



16 bits × 16 bits + 32 bits = 32 bits (Unsigned or

signed)

Serial interface



CSI: 2 to 8 channels



UART/UART (LIN-bus supported): 2 to 4 channels



C/Simplified I

C communication: 3 to 10 channels

Timer



16-bit timer: 8 to 16 channels



12-bit interval timer: 1 channel



Real-time clock:

1 channel (calendar for 99 years,

alarm function, and clock

correction function)



Watchdog timer:

1 channel (operable with the

dedicated low-speed on-chip

oscillator)

A/D converter



8/10-bit resolution A/D converter (V

= 1.6 to 5.5 V)



Analog input: 6 to 26 channels



Internal reference voltage (1.45 V) and temperature

sensor

Note 1

I/O port



I/O port: 16 to 120 (N-ch open drain I/O [withstand

voltage of 6 V]: 0 to 4, N-ch open drain I/O

withstand voltage

Note 2

/EV

withstand

voltage

Note 3

]: 5 to 25)



Can be set to N-ch open drain, TTL input buffer, and

on-chip pull-up resistor



Different potential interface: Can connect to a 1.8/2.5/3

V device



On-chip key interrupt function



On-chip clock output/buzzer output controller

Others



On-chip BCD (binary-coded decimal) correction circuit

Notes 1.

Can be selected only in HS (high-speed main)

mode

Products with 20 to 52 pins

Products with 64 to 128 pins

Remark

The functions mounted depend on the product.

See

1.6 Outline of Functions.

<R>

R01DS0131EJ0350 Rev.3.50

Jun 30, 2020

1 of 200

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