SI7021-A10-GM1 datasheet, PDF - EEWORLD Datasheet

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SI7021-A10-GM1: Description湿度温度传感器 0 ~ 100% 相对湿度 I²C ±2% RH 18 s 表面贴装型; CategoryThe sensor Humidity sensor; File Size579KB，33 Pages; ManufacturerSilicon Labs; Websitehttps://www.silabs.com

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湿度温度传感器 0 ~ 100% 相对湿度 I²C ±2% RH 18 s 表面贴装型

SI7021-A10-GM1 Parametric

Parameter Name	Attribute value
category
Maker	Silicon Labs
series	-
Package	bring
sensor type	humidity, temperature
Humidity range	0 ~ 100% relative humidity
Output type	I²C
output	12b
Accuracy	±2% RH
Sensitivity	-
Voltage - Power supply	1.9V ~ 3.6V
Installation type	surface mount type
Operating temperature	-40°C ~ 85°C
Package/casing	6-WDFN Exposed Pad
Supplier device packaging	6-DFN（3x3）
Response time	18 s

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Si 7 0 2 1 - A1 0

C H

UMIDITY A N D

EMPERATURE

ENSOR

Features



Precision Relative Humidity Sensor



± 3% RH (max), 0–80% RH

High Accuracy Temperature Sensor



±0.4 °C (max), –10 to 85 °C

0 to 100% RH operating range

Up to –40 to +125 °C operating

range

Wide operating voltage

(1.9 to 3.6 V)

Low Power Consumption



150 µA active current



60 nA standby current



Factory-calibrated

C Interface

Integrated on-chip heater

3x3 mm DFN Package

Excellent long term stability

Optional factory-installed cover



Low-profile



Protection during reflow



Excludes liquids and particulates

Si7021

Ordering Information:

See page 27.

Pin Assignments

Top View

SDA

GND

DNC

SCL

VDD

DNC

Applications



HVAC/R

Thermostats/humidistats

Respiratory therapy

White goods

Indoor weather stations

Micro-environments/data centers



Automotive climate control and

defogging



Asset and goods tracking



Mobile phones and tablets



Description

The Si7021 I

C Humidity and Temperature Sensor is a monolithic CMOS IC

integrating humidity and temperature sensor elements, an analog-to-digital

converter, signal processing, calibration data, and an I

C Interface. The patented

use of industry-standard, low-K polymeric dielectrics for sensing humidity enables

the construction of low-power, monolithic CMOS Sensor ICs with low drift and

hysteresis, and excellent long term stability.

The humidity and temperature sensors are factory-calibrated and the calibration

data is stored in the on-chip non-volatile memory. This ensures that the sensors

are fully interchangeable, with no recalibration or software changes required.

The Si7021 is available in a 3x3 mm DFN package and is reflow solderable. It can

be used as a hardware- and software-compatible drop-in upgrade for existing RH/

temperature sensors in 3x3 mm DFN-6 packages, featuring precision sensing

over a wider range and lower power consumption. The optional factory-installed

cover offers a low profile, convenient means of protecting the sensor during

assembly (e.g., reflow soldering) and throughout the life of the product, excluding

liquids (hydrophobic/oleophobic) and particulates.

The Si7021 offers an accurate, low-power, factory-calibrated digital solution ideal

for measuring humidity, dew-point, and temperature, in applications ranging from

HVAC/R and asset tracking to industrial and consumer platforms.

Patent Protected. Patents pending

Rev. 1.1 6/15

Si7021-A10

Si7021-A10

ABLE O F

ONTENTS

Section

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.1. Relative Humidity Sensor Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4.2. Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.3. Prolonged Exposure to High Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

4.4. PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.5. Protecting the Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.6. Bake/Hydrate Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.7. Long Term Drift/Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5. I

5.1. Issuing a Measurement Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5.2. Reading and Writing User Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.3. Electronic Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

5.4. Firmware Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.5. Heater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6. Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.1. Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7. Pin Descriptions: Si7021 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

9. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

9.1. Package Outline: 3x3 6-pin DFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

9.2. Package Outline: 3x3 6-pin DFN with Protective Cover . . . . . . . . . . . . . . . . . . . . . . 29

10. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

11. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

11.1. Si7021 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

11.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

12. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

Rev. 1.1

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