W25Q32FVXGJQ datasheet, PDF - EEWORLD Datasheet

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W25Q32FVXGJQ: DescriptionFLASH - NOR 存储器 IC 32Mb（4M x 8） SPI - 四 I/O，QPI 104 MHz 8-XSON（4x4）; Categorysemiconductor memory; File Size2MB，99 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W25Q32FVXGJQ Overview

FLASH - NOR 存储器 IC 32Mb（4M x 8） SPI - 四 I/O，QPI 104 MHz 8-XSON（4x4）

W25Q32FVXGJQ Parametric

Parameter Name	Attribute value
category
Maker	Winbond Electronics Corporation
series	SpiFlash®
Package	Pipe fittings
memory type	non-volatile
memory format	flash memory
technology	FLASH - NOR
storage	32Mb（4M x 8）
memory interface	SPI - 四 I/O，QPI
Clock frequency	104 MHz
Write cycle time - words, pages	50µs，3ms
Voltage - Power supply	2.7V ~ 3.6V
Operating temperature	-40°C ~ 105°C（TA）
Installation type	surface mount type
Package/casing	8-XDFN Exposed Pad
Supplier device packaging	8-XSON（4x4）
Basic product number	W25Q32

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W25Q32FV

3V 32M-BIT

SERIAL FLASH MEMORY WITH

DUAL/QUAD SPI & QPI

Publication Release Date: June 03, 2016

Revision J

W25Q32FV

Table of Contents

GENERAL DESCRIPTIONS ............................................................................................................. 5

FEATURES ....................................................................................................................................... 5

PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.1

4.2

4.3

4.4

4.5

4.6

Pin Configuration SOIC 208-mil / VSOP 208-mil.................................................................. 6

Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 6

Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm ...................................... 6

Pin Configuration SOIC 300-mil ........................................................................................... 7

Pin Description SOIC 300-mil ............................................................................................... 7

Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8

Ball Description TFBGA 8x6-mm ......................................................................................... 8

Pin Configuration PDIP 300-mil ............................................................................................ 9

Pin Description PDIP 300-mil ............................................................................................... 9

Chip Select (/CS) ................................................................................................................ 10

Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 10

Write Protect (/WP) ............................................................................................................ 10

HOLD (/HOLD) ................................................................................................................... 10

Serial Clock (CLK) .............................................................................................................. 10

Reset (/RESET) .................................................................................................................. 10

PIN DESCRIPTIONS ...................................................................................................................... 10

BLOCK DIAGRAM .......................................................................................................................... 11

FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12

6.1

SPI / QPI Operations .......................................................................................................... 12

6.1.1

6.1.2

6.1.3

6.1.4

6.1.5

6.1.6

Standard SPI Instructions .................................................................................................... 12

Dual SPI Instructions ............................................................................................................ 12

Quad SPI Instructions .......................................................................................................... 13

QPI Instructions .................................................................................................................... 13

Hold Function ....................................................................................................................... 13

Software Reset & Hardware /RESET pin ............................................................................. 14

Write Protect Features ......................................................................................................... 15

6.2

Write Protection .................................................................................................................. 15

6.2.1

STATUS AND CONFIGURATION REGISTERS ............................................................................ 16

7.1

Status Registers ................................................................................................................. 16

7.1.1

7.1.2

7.1.3

Erase/Write In Progress (BUSY) –

Status Only

................................................................... 16

Write Enable Latch (WEL) –

Status Only

............................................................................. 16

Block Protect Bits (BP2, BP1, BP0) –

Volatile/Non-Volatile Writable

................................... 16

-1-

W25Q32FV

7.1.4

7.1.5

7.1.6

7.1.7

7.1.8

7.1.9

7.1.10

7.1.11

7.1.12

7.1.13

7.1.14

7.1.15

7.1.16

7.1.17

Top/Bottom Block Protect (TB) –

Volatile/Non-Volatile Writable

.......................................... 17

Sector/Block Protect Bit (SEC) –

Volatile/Non-Volatile Writable

.......................................... 17

Complement Protect (CMP) –

Volatile/Non-Volatile Writable

............................................... 17

Status Register Protect (SRP1, SRP0) –

Volatile/Non-Volatile Writable

.............................. 17

Erase/Program Suspend Status (SUS) –

Status Only

......................................................... 18

Security Register Lock Bits (LB3, LB2, LB1) –

Volatile/Non-Volatile OTP Writable

............. 18

Quad Enable (QE) –

Volatile/Non-Volatile Writable

........................................................... 18

Write Protect Selection (WPS) –

Volatile/Non-Volatile Writable

........................................ 19

Output Driver Strength (DRV1, DRV0) –

Volatile/Non-Volatile Writable

............................ 19

HOLD or /RESET Pin Function (HOLD/RST) –

Volatile/Non-Volatile Writable

.................. 19

Reserved Bits –

Non Functional

......................................................................................... 20

W25Q32FV Status Register Memory Protection (WPS = 0, CMP = 0) .............................. 21

W25Q32FV Status Register Memory Protection (WPS = 0, CMP = 1) .............................. 22

W25Q32FV Individual Block Memory Protection (WPS=1) ............................................... 23

INSTRUCTIONS ............................................................................................................................. 24

8.1

Device ID and Instruction Set Tables ................................................................................. 24

8.1.1

8.1.2

8.1.3

8.1.4

Manufacturer and Device Identification ................................................................................ 24

Instruction Set Table 1 (Standard/Dual/Quad SPI Instructions)

(1)

........................................ 25

Instruction Set Table 2 (Standard/Dual/Quad SPI Instructions)

(1)

........................................ 26

Instruction Set Table 3 (QPI Instructions)

(14)

........................................................................ 27

Write Enable (06h) ............................................................................................................... 29

Write Enable for Volatile Status Register (50h) ................................................................... 29

Write Disable (04h) .............................................................................................................. 30

Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .............. 30

Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .............. 31

Read Data (03h) ................................................................................................................... 34

Fast Read (0Bh) ................................................................................................................... 35

Fast Read Dual Output (3Bh) ............................................................................................... 37

Fast Read Quad Output (6Bh) ............................................................................................. 38

Fast Read Dual I/O (BBh) .................................................................................................. 39

Fast Read Quad I/O (EBh) ................................................................................................. 41

Word Read Quad I/O (E7h)................................................................................................ 44

Octal Word Read Quad I/O (E3h) ...................................................................................... 46

Set Burst with Wrap (77h) .................................................................................................. 48

Page Program (02h) ........................................................................................................... 49

Quad Input Page Program (32h) ........................................................................................ 51

Sector Erase (20h) ............................................................................................................. 52

32KB Block Erase (52h) ..................................................................................................... 53

64KB Block Erase (D8h) .................................................................................................... 54

Chip Erase (C7h / 60h) ...................................................................................................... 55

8.2

Instruction Descriptions ...................................................................................................... 29

8.2.1

8.2.2

8.2.3

8.2.4

8.2.5

8.2.6

8.2.7

8.2.8

8.2.9

8.2.10

8.2.11

8.2.12

8.2.13

8.2.14

8.2.15

8.2.16

8.2.17

8.2.18

8.2.19

8.2.20

-2-

Publication Release Date: June 03, 2016

Revision J

W25Q32FV

8.2.21

8.2.22

8.2.23

8.2.24

8.2.25

8.2.26

8.2.27

8.2.28

8.2.29

8.2.30

8.2.31

8.2.32

8.2.33

8.2.34

8.2.35

8.2.36

8.2.37

8.2.38

8.2.39

8.2.40

8.2.41

8.2.42

8.2.43

Erase / Program Suspend (75h) ........................................................................................ 56

Erase / Program Resume (7Ah) ......................................................................................... 58

Power-down (B9h) .............................................................................................................. 59

Release Power-down / Device ID (ABh)............................................................................. 60

Read Manufacturer / Device ID (90h) ................................................................................. 62

Read Manufacturer / Device ID Dual I/O (92h) .................................................................. 63

Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 64

Read Unique ID Number (4Bh) .......................................................................................... 65

Read JEDEC ID (9Fh) ........................................................................................................ 66

Read SFDP Register (5Ah) ................................................................................................ 67

Erase Security Registers (44h) .......................................................................................... 68

Program Security Registers (42h) ...................................................................................... 69

Read Security Registers (48h) ........................................................................................... 70

Set Read Parameters (C0h) ............................................................................................... 71

Burst Read with Wrap (0Ch) .............................................................................................. 72

Enter QPI Mode (38h) ........................................................................................................ 73

Exit QPI Mode (FFh) .......................................................................................................... 74

Individual Block/Sector Lock (36h) ..................................................................................... 75

Individual Block/Sector Unlock (39h) ................................................................................. 76

Read Block/Sector Lock (3Dh) ........................................................................................... 77

Global Block/Sector Lock (7Eh) ......................................................................................... 78

Global Block/Sector Unlock (98h) ...................................................................................... 78

Enable Reset (66h) and Reset Device (99h)...................................................................... 79

ELECTRICAL CHARACTERISTICS ............................................................................................... 80

9.1

Absolute Maximum Ratings (1)(2) ................................................................................... 80

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

9.10

Operating Ranges............................................................................................................... 80

Power-Up Power-Down Timing and Requirements(1) ....................................................... 81

DC Electrical Characteristics(1).......................................................................................... 82

AC Measurement Conditions(1) ......................................................................................... 83

AC Electrical Characteristics

(6)

........................................................................................... 84

Serial Output Timing ........................................................................................................... 86

Serial Input Timing .............................................................................................................. 86

HOLD Timing ...................................................................................................................... 86

WP Timing .......................................................................................................................... 86

8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 87

8-Pin VSOP 208-mil (Package Code ST) ........................................................................... 88

8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 89

8-Pad WSON 8x6-mm (Package Code ZE) ....................................................................... 90

10.

PACKAGE SPECIFICATIONS ........................................................................................................ 87

10.1

10.2

10.3

10.4

-3-

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