Product
Specification
Connector, Card Edge, .050 Centerline
1.
1.1.
SCOPE
Content
108-14034
11Mar11 Rev D
This specification covers perform ance, tests and quality requirem ents for the TE Connectivity (TE) .050
centerline card edge connector. This connector is a m ulti-contact edge board type having contacts for
solder applications.
1.2.
Qualification
W hen tests are perform ed on subject product line, procedures specified in Figure 1 shall be used. All
inspections shall be perform ed using applicable inspection plan and product drawing.
2.
APPLICABLE DOCUM ENTS
The following docum ents form a part of this specification to the extent specified herein. Unless
otherwise specified, latest edition of the docum ent applies. In the event of conflict between
requirem ents of this specification and product drawing, product drawing shall take precedence. In the
event of conflict between requirem ents of this specification and referenced docum ents, this specification
shall take precedence.
2.1.
TE Docum ents
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3.
3.1.
109-1: General Requirem ents for Test Specifications
109 Series: Test Specifications as indicated in Figure 1
114-13148: Application Specification (.050 Series Standard Edge Peripheral Com puter
Interconnect (PCI) Surface Mount Connector Assem blies)
114-26012: Application Specification (Card Edge Connectors with Contacts on .050 Inch Centers)
501-203: Qualification Test Report (Connector, Card Edge, .050 Series)
REQUIREM ENTS
Design and Construction
Product shall be of design, construction and physical dim ensions specified on applicable product
drawing.
3.2.
Materials
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Contact: Phosphor bronze, gold or gold flash/palladium nickel over nickel plating
Housing: PPS or PCT
3.3.
Ratings
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Voltage: 203 volts AC
Current: Signal application only
Tem perature: -55 to 85°C
Flam m ability: UL94V-0
©2011 Tyco Electronics Corporation, | Indicates change
a TE Connectivity Ltd. Company
*Trademark
All Rights Reserved
TE logo is a trademark.
For latest revision, visit our website at www.te.com/documents.
For Regional Customer Service, visit our website at www.te.com
Other products, logos, and company names might be trademarks of their respective owners.
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LOC B
108-14034
3.4.
Perform ance and Test Description
Product is designed to m eet electrical, m echanical and environm ental perform ance requirem ents
specified in Figure 1. Unless otherwise specified, all tests shall be perform ed at am bient environm ental
conditions per Test Specification 109-1.
3.5.
Test Requirem ents and Procedures Sum m ary
Test Description
Exam ination of product.
Requirem ent
Meets requirem ents of product
drawing and Application
Specifications 114-13148 and 114-
26012.
ELECTRICAL
Term ination resistance.
20 m illiohm s m axim um initial.
ÄR
10 m illiohm s m axim um final.
TE 109-6-1.
Subject m ated contacts assem bled
in housing to 50 m v m axim um open
circuit at 100 m a m axim um .
See Figure 4.
TE Spec 109-28-4.
Test between adjacent contacts of
unm ated sam ples.
TE Spec 109-29-1.
Test between adjacent contacts of
unm ated sam ples.
Procedure
Visual, dim ensional and functional
per applicable quality inspection
plan.
Insulation resistance.
1000 m egohm s m inim um .
Dielectric withstanding voltage.
500 volts AC at sea level.
MECHANICAL
Vibration, random .
No discontinuities of 1 m icrosecond TE Spec 109-21-7, Condition A.
or longer duration.
Subject m ated sam ples to 5 to 500
See Note.
Hz. Fifteen m inutes in each of 3
m utually perpendicular planes.
No discontinuities of 1 m icrosecond TE Spec 109-26-9.
or longer duration.
Subject m ated sam ples to 100 G's
See Note.
sawtooth shock pulses of 6
m illiseconds duration. Three shocks
in each direction applied along 3
m utually perpendicular planes, 18
total shocks.
See Note.
TE Spec 109-27.
Mate and unm ate sam ples for 100
cycles at m axim um rate of 500
cycles per hour.
TE Spec 109-35.
Measure force necessary to m ate
printed circuit board to sam ples
using free floating fixtures at
m axim um rate of .5 inch per m inute.
Physical shock.
Durability.
Mating force.
8 ounces m axim um per contact
pair.
Figure 1 (continued)
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108-14034
Test Description
Unm ating force.
Requirem ent
0.5 ounce m inim um per contact
pair.
Procedure
TE Spec 109-35.
Measure force necessary to unm ate
printed circuit board from sam ples
at m axim um rate of .5 inch per
m inute.
ENVIRONMENTAL
Therm al shock.
See Note.
TE Spec 109-22.
Subject unm ated sam ples to 5
cycles between -55 and 85°C.
TE Spec 109-23-3, Condition B.
Subject unm ated sam ples to 10
cycles between 25 and 65°C at 95%
RH.
TE Spec 109-43.
Subject m ated sam ples to
tem perature life at 85°C for 1000
hours.
TE Spec 109-85-2.
Subject m ated sam ples to
environm ental class II for 14 days.
Hum idity/tem perature cycling.
See Note.
Tem perature life.
See Note.
Mixed flowing gas.
See Note.
NOTE
Shall meet visual requirements, show no physical damage and shall meet requirements of
additional tests as specified in Test Sequence in Figure 2.
Figure 1 (end)
Rev D
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108-14034
3.6.
Product Qualification and Requalification Test Sequence
Test Group (a)
Test or Exam ination
1
2
3
4
Test Sequence (b)
Exam ination of product
Term ination resistance
Insulation resistance
Dielectric withstanding voltage
Vibration
Physical shock
Durability
Mating force
Unm ating force
Therm al shock
Hum idity/tem perature cycling
Tem perature life
Mixed flowing gas
NOTE
(a)
(b)
(c)
3(c)
3(c)
5
6
4
2
8
4
5
1,9
3,7
1,5
2,4
1,5
2,4
2,6
3,7
1,8
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Precondition samples with 3 cycles durability.
Figure 2
Rev D
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108-14034
4.
4.1.
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
Sam ple Selection
Sam ples shall be prepared in accordance with applicable Instruction Sheets and shall be selected
at random from current production. All test groups shall consist of 5 sam ples each.
B.
Test Sequence
Qualification inspection shall be verified by testing sam ples as specified in Figure 2.
4.2.
Requalification Testing
If changes significantly affecting form , fit or function are m ade to product or m anufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of original testing
sequence as determ ined by developm ent/product, quality and reliability engineering.
4.3.
Acceptance
Acceptance is based on verification that product m eets requirem ents of Figure 1. Failures attributed to
equipm ent, test setup or operator deficiencies shall not disqualify product. W hen product failure occurs,
corrective action shall be taken and sam ples resubm itted for qualification. Testing to confirm corrective
action is required before resubm ittal.
4.4.
Quality Conform ance Inspection
Applicable quality inspection plan will specify sam pling acceptable quality level to be used. Dim ensional
and functional requirem ents shall be in accordance with applicable product drawing and this
specification.
Rev D
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