GaAs Flip Chip Schottky Diodes
Features
Single - DMK2783-000, DMK2790-000
I
Designed for High Volume Designs
I
High Frequency (20–100 GHz)
I
Exceeds Environmental Requirements for
MIC & Hybrid Applications
I
Designed for Low Junction Capacitance
and Low Series Resistance
I
Applications Include PCN Mixers and
Circuits, As Well As Low Power, Fast
Switching
I
Low Parasitic Flip Chip Configuration
Series Pair - DMK8001-000
Anti-Parallel - DMK2308-000
Description
This new series of GaAs Schottky barrier diodes offer high
performance at commercial market prices. They are
designed for low junction capacitance, as well as low series
resistance. Diodes are designed for MIC work (hard and soft
substrates), but the leadless design eliminates the
problems associated with mounting of beam lead diodes.
Due to its rigid construction, it exceeds environmental
requirements for MIC and hybrid applications. Diodes can
be supplied on expandable film frame for high speed pick
and place process. Standard packing will be in a gel pack.
Flexible conductive epoxy is the most effective
method for circuitry attachments. Standard mounting
temperatures should not exceed 175°C.
Electrical Specifications at 25°C
Recommended
Frequency
(GHz)
V
B
1
@ 10
µ
A
(V)
C
T
2
0 V, 1 MHz
(pF)
Min.
20–100
20–100
20–100
3.0
3.0
3.0
0.03
0.04
0.05
Max.
0.05
0.07
0.08
R
S
@ 10 mA
Ω
(Ω)
Max.
9
7
7
V
F
@ 1 mA
(mV)
Min.
680
650
650
Max.
780
750
750
Single
540-011
DMK2783-000
DMK2790-000
DMK8001-000
DMK2308-000
Series Pair
540-012
Anti-Parallel
540-025
1. V
B
cannot be measured nondestructively in anti-parallel configuration.
2. C
T
= junction capacitance plus 0.02 pF (overlay).
Alpha Industries, Inc.
[781] 935-5150
•
Fax
[617] 824-4579
•
Email
sales@alphaind.com
•
www.alphaind.com
Specifications subject to change without notice. 3/00A
1
GaAs Flip Chip Schottky Diodes
Typical Parameter Distribution on Wafer
0.080
0.076
0.072
0.068
0.064
0.060
0.056
0.052
0.048
0.044
0.040
0.036
0.032
0.028
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
4.5
5.0
65
60
55
50
45
40
35
30
25
20
15
10
5
0
680
Device Capacitance (pF)
Number of Obs
V
F
= Mixer
DMK2790
x = 719 mV
σ
= 6.3 mV
700
720
740
Bias Voltage (V)
V
F
1 mA (mV)
Capacitance/Voltage Variation
Aug 0.063 pF SD = 0.002 pF
60
55
50
45
40
35
30
25
20
15
10
5
0
0.055
Histogram
165 x = 5.0
σ
= 0.25
154
143
132
121
110
99
88
77
66
55
44
33
22
11
0
4.0
4.5
Number of Obs
0.060
0.065
0.070
Number of Obs
C
J
0.0063 pF
Average
0.0014 pF SD
R
T
= Mixer
DMK2790
x = 5.0
Ω
σ
= 0.25
Ω
5.0
5.5
6.0
Capacitance 0 V (pF)
R
T
10 mA (Ω)
Histogram
Histogram
Spice Parameters (Per Junction)
I
S
Amp
0.5 E–12
R
S
Ω
4
n
1.05
T
D
S
1E–11
C
J
0
pF
0.05
m
0.26
E
G
eV
1.43
V
J
eV
0.82
X
TI
2
FC
0.5
B
V
V
4.0
I
BV
A
1E–05
2
Alpha Industries, Inc.
[781] 935-5150
•
Fax
[617] 824-4579
•
Email
sales@alphaind.com
•
www.alphaind.com
Specifications subject to change without notice. 3/00A
GaAs Flip Chip Schottky Diodes
Suggested Setup Values For WEST-BOND
Model 7200A Epoxy Die Bonder
Materials
Epoxy
Microelectronic grade one component, solvent-free
silver-filled, electrically conductive adhesive — example:
Ablebond 8380 by Ablestick.
Dispense Tube
WEST-BOND B-1831-1 with 9.5 mil I.D., or WEST-BOND
B-1831-2 with 15.5 mil I.D. Other sizes available.
Die Pickup Tool
SPT Part Number 2101-W625-CT-031 x 0.016 x 0.0075.
Hole diameter 0.016" face diameter 0.031", O.D. 0.625".
Use vacuum pressure to pick and place chip.
Adjustment
Bond Force
35 grams at tool.
Dispense Air
30 psi.
Dispense Time
To give diameter of dot required.
Curing Time
Temperature
250°C
130°C
100°C
85°C
Time
10 min.
20 min.
60 min.
120 min.
Flexible Conductive Epoxy Mounting of
Alpha Beamless Flip Chip Diodes – To
Soft or Hard Substrate – As Plated
10 Mil Gap
Conductive Epoxy
Drops (Minimum Amount)
Approximately 8 mil Diameter
1–2 mil height
Deposit Conductive Epoxy
Perform Die Attach
• Flip Device
• Align Bond Pads to Epoxy Dot
(Alignment Marks Help)
• Use Even Pressure to Make Correct Connection
Acceptable
Epoxy Runout
Excessive
Epoxy Runout
Cure Epoxy & DC Continuity Check
• Inspect for Adequate Epoxy Fillet
• Cure According to Mfg. Preferred Schedule.
Typically 110–150°C @ 60 Minutes, or 150°C,
4 Minutes for Snap-Cure Epoxies
Alpha Industries, Inc.
[781] 935-5150
•
Fax
[617] 824-4579
•
Email
sales@alphaind.com
•
www.alphaind.com
Specifications subject to change without notice. 3/00A
3
GaAs Flip Chip Schottky Diodes
Outline Drawings
540-011
0.026 (0.66 mm)
± 0.001 (0.025 mm)
0.008
(0.20 mm)
± 0.001
(0.025 mm)
0.005 (0.13 mm)
± 0.001 (0.025 mm)
0.005 (0.13 mm)
± 0.001 (0.025 mm)
MAX.
0.013 (0.33 mm)
± 0.001 (0.025 mm)
0.013
(0.33 mm)
± 0.001
(0.025 mm)
540-025
0.026 (0.66 mm)
± 0.001 (0.025 mm)
0.008
(0.20 mm)
± 0.001
(0.025 mm)
0.005 (0.13 mm)
± 0.001 (0.025 mm)
0.013 (0.33 mm)
± 0.001 (0.025 mm)
0.013
(0.33 mm)
± 0.001
(0.025 mm)
0.005 (0.13 mm)
± 0.001 (0.025 mm) MAX.
540-012
0.005
(0.127 mm)
± 0.001
(0.025 mm)
TYP.
0.008
(0.203 mm)
± 0.001
(0.025 mm)
TYP.
0.020 (0.508 mm)
± 0.001 (0.025 mm)
C
L
CATHODE LEAD
3
SCHEMATIC
0.010 (0.254 mm)
± 0.001 (0.025 mm)
0.005 (0.127 mm)
± 0.001 (0.025 mm)
1
2
1
2
C
L
0.009
(0.229 mm)
± 0.001
(0.025 mm)
0.019
(0.483 mm)
± 0.001
(0.025 mm)
3
0.009 (0.229 mm)
± 0.001 (0.025 mm)
0.028 (0.711 mm)
± 0.001 (0.025 mm)
0.005 (0.13 mm)
± 0.001 (0.025 mm) MAX.
0.014 (0.356 mm)
± 0.001 (0.025 mm)
4
Alpha Industries, Inc.
[781] 935-5150
•
Fax
[617] 824-4579
•
Email
sales@alphaind.com
•
www.alphaind.com
Specifications subject to change without notice. 3/00A
京公网安备 11010802033920号
EEWORLD
