1
2
3
4
5
6
7
8
9
A
B
SPECIFICATIONS
Contact material: Phosphor bronze 0.35mm
Contact plating:
Gold over nickel in contact area
Tin over nickel in solder tail area
Housing material: PBT glass filled, UL94V-0, black
Shield material:
Stainless steel 0.20mm
Shield plating:
Tin plating on ground pin
A
B
C
C
D
D
E
E
Series
Positions
Ports
Style
SGCTJ
8
12
3022
Stacked ganged 8=8 positions 2-16 ports 3022 style
modular jack
F
RoHS compliant
Rev.
Description
Date
Approved
Drawing
Name
Approved Howard
Checked Lizzy
Drawn Tina
0.0 ± 0.35
1
2
3
4
Contacts
Color
Plating
Shielding
Panel Ground
8
BK
PX
S
PG
8=8 contacts BK=Black P1=15μ” gold [blank]=None [blank]=None
P2=30μ” gold S=Shielded PG=Panel ground
P3=50μ” gold
Date
Central Components Manufacturing
08/10/99
440 Lincoln Blvd., Middlesex, New Jersey 08846
Phone 732 469-5720 888 288-5152 Fax 732 469-1919
08/10/99
08/10/99 Part No.:
SGCTJ-08-12-3022-8-BK-XX-S-PG4
Description: Stacked ganged modular jack,12
port, 8P8C,
shielded
6
7
8
9
F
G
0.00 ± 0.20 Angles ± 3’
UNIT: mm
5
G
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
