Radiation Hardened
NPN Silicon Switching Transistors
2N2221A, 2N2221AL, 2N2221AUA, 2N2221AUB
2N2222A, 2N2222AL, 2N2222AUA, 2N2222AUB
Features
•
•
Qualified to MIL-PRF-19500/255
Levels:
JANSM-3K Rads (Si)
JANSD-l0K Rads (Si)
JANSP-30K Rads (Si)
JANSL-50K Rads (Si)
JANSR-l00K Rads (Si)
•
TO-18 (TO-206AA), Surface mount UA & UB Packages
Absolute Maximum Ratings (Tc = +25 °C unless otherwise noted)
Ratings
Collector - Emitter Voltage
Collector - Base Voltage
Emitter - Base Voltage
Collector Current
Total Power Dissipation @ TA = +25 °C
2N2221A, L
2N2222A, L
2N2221UA
2N2222UA
2N2221UB
2N2222UB
Operating & Storage Temperature Range
Symbol
VCEO
VCBO
VEBO
IC
PT
Value
50
75
6.0
800
0.5
0.5
0.5
-65 to +200
Units
Vdc
Vdc
Vdc
mAdc
W
Top, Tstg
°C
Thermal Characteristics
Characteristics
Thermal Resistance, Junction-to-Ambient
2N2221A, L
2N2221UA
2N2221UB
2N2222A, L
2N2222UA
2N2222UB
R
θJC
325
325
325
°C/W
Symbol
Maximum
Units
Electrical Characteristics (TA = +15°C, unless otherwise noted)
OFF Characteristics
Collector - Emitter Breakdown Voltage
IC = 10 mAdc
Collector - Base Cutoff Current
VCB = 75 Vdc
VCB = 60 Vdc
Emitter - Base Cutoff Current
VEB = 6.0 Vdc
VEB = 4.0 Vdc
Collector - Emitter Cutoff Current
VCE = 60 Vdc, VBE = 1.5 Vdc
Symbol
V(BR)CEO
ICBO1
ICBO2
IEBO1
IEBO2
ICES
Mimimum
50
---
Maximum
---
10
10
10
10
10
Units
Vdc
μAdc
nAdc
μAdc
nAdc
nAdc
---
---
---
Revision Date: 3/15/2014
1
2N2221A, L, UA, UB
2N2222A, L, UA, UB
Electrical Characteristics (TA = +15°C, unless otherwise noted)
ON Characteristics (1)
Forward Current Transfer Ratio
IC = 0.1 mAdc, VCE = 10 Vdc
2N2221A, L, UA, UB
2N2222A, L, UA, UB
IC = 1.0 mAdc, VCE = 10 Vdc
2N2221A, L, UA, UB
2N2222A, L, UA, UB
IC = 10 mAdc, VCE = 10 Vdc
2N2221A, L, UA, UB
2N2222A, L, UA, UB
IC = 150 mAdc, VCE = 10 Vdc
2N2221A, L, UA, UB
2N2222A, L, UA, UB
IC = 10 mAdc, VCE = 10 Vdc
Collector - Emitter Saturation Voltage
IC = 150 mAdc, IB = 15 mAdc
IC = 500 mAdc, IB = 50 mAdc
Base - Emitter Saturation Voltage
IC = 150 Adc, IB = 0.5 Vdc
IC = 500 Adc, IB = 2.0 Vdc
2N2221A, L, UA, UB
2N2222A, L, UA, UB
VCE(sat)1
VCE(sat)2
VBE(sat)1
VBE(sat)2
Symbol
Mimimum
Maximum
Units
HFE
30
50
35
75
40
100
40
100
20
30
---
---
0.6
---
0.3
1.0
1.2
2.0
Vdc
120
300
150
325
Vdc
DYNAMIC Characteristics
Small-Signal Short-Circuit Forward Current Transfer Ratio
IC = 1.0 Adc, VCE = 10 Vdc, f = 1.0 MHz 2N2221A, L, UA, UB
2N2222A, L, UA, UB
Magnitude of Small-Signal Short-Circuit
Forward Current Transfer Ratio
IC = 10 Adc, VCE= 20 Vdc, f = 100 MHz
Output Capacitance
VCB = 10 Vdc, IE = 0, 100 kHz
≤
f
≤
1.0 MHz
Output Capacitance
VCB = 0.5 Vdc, IE = 0, 100 kHz
≤
f
≤
1.0 MHz
hfe
30
50
| hfe |
Cobo
Cibo
2.5
---
---
8.0
25
pF
pF
Switching Characteristics
Turn-On Time
See figure 8 of MIL-PRF-19500/255
Turn-Off Time
See Figure 9 of MIL-PRF-19500/255
(1) Pulse Test: Pulse Width = 300
μs,
Duty Cycle
≤2.0%.
ton
toff
35
300
ns
ns
2
603-641-3800 • 888-641--SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Revision Date: 3/15/2014
2N2221A, L, UA, UB
2N2222A, L, UA, UB
Outline Drawing (TO-18):
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Beyond r (radius) maximum, TL shall be held for a minimum length
of .011 inch (0.28 mm).
4. Dimension TL measured from maximum HD.
5. Body contour optional within zone defined by HD, CD, and Q.
6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm)
below seating plane shall be within .007 inch (0.18 mm) radius of
true position (TP) at maximum material condition (MMC) relative to
tab at MMC.
7. Dimension LU applies between L
1
and L
2
. Dimension LD applies
between L
2
and LL minimum. Diameter is uncontrolled in L
1
and
beyond LL minimum.
8. All three leads.
9. The collector shall be internally connected to the case.
10. Dimension r (radius) applies to both inside corners of tab.
11. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
12. Lead 1 = emitter, lead 2 = base, lead 3 = collector.
13. For L suffix devices, dimension LL = 1.5 inches (38.10 mm) min.
and 1.75 inches (44.45 mm) max.
Symbol
CD
CH
HD
LC
LD
LL
LU
L
1
L
2
P
Q
TL
TW
r
α
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.178
.195
4.52
4.95
.170
.210
4.32
5.33
.209
.230
5.31
5.84
.100 TP
2.54 TP
.016
.021
0.41
0.53
.500
.750
12.70 19.05
.016
.019
0.41
0.48
.050
1.27
.250
6.35
.100
2.54
.030
0.76
.028
.048
0.71
1.22
.036
.046
0.91
1.17
.010
0.25
45° TP
45° TP
1, 2, 9, 11, 12, 13
Note
6
7,8
7,8,13
7,8
7,8
7,8
5
3,4
3
10
6
603-641-3800 • 888-641--SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Revision Date: 3/15/2014
3
2N2221A, L, UA, UB
2N2222A, L, UA, UB
Outline Drawing (UA surface mount):
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimension CH controls the overall package thickness. When a
window lid is used, dimension CH must increase by a minimum of
.010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm).
4. The corner shape (square, notch, radius) may vary at the
manufacturer's option, from that shown on the drawing.
5. Dimensions LW2 minimum and L3 minimum and the appropriate
castellation length define an unobstructed three-dimensional space
traversing all of the ceramic layers in which a castellation was
designed. (Castellations are required on the bottom two layers,
optional on the top ceramic layer.) Dimension LW2 maximum and
L3 maximum define the maximum width and depth of the
castellation at any point on its surface. Measurement of these
dimensions may be made prior to solder dipping.
6. The co-planarity deviation of all terminal contact points, as defined
by the device seating plane, shall not exceed .006 inch (0.15mm) for
solder dipped leadless chip carriers.
7. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
Symbol
BL
BL2
BW
BW2
CH
L3
LH
LL1
LL2
LS
LW
LW2
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.215
.225
5.46
5.71
.225
5.71
.145
.155
3.68
3.93
.155
3.93
.061
.075
1.55
1.90
.003
.007
0.08
0.18
.029
.042
0.74
1.07
.032
.048
0.81
1.22
.072
.088
1.83
2.23
.045
.055
1.14
1.39
.022
.028
0.56
0.71
.006
.022
0.15
0.56
Note
3
5
5
Pin no.
Transistor
1
Collector
2
Emitter
3
Base
4
N/C
4
603-641-3800 • 888-641--SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Revision Date: 3/15/2014
2N2221A, L, UA, UB
2N2222A, L, UA, UB
Outline Drawing (UB Surface mount):
UB
Symbol
BH
BL
BW
CL
CW
LL1
LL2
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.046
.056
1.17
1.42
.115
.128
2.92
3.25
.085
.108
2.16
2.74
.128
3.25
.108
2.74
.022
.038
0.56
0.96
.017
.035
0.43
0.89
Note
Symbol
LS
1
LS
2
LW
r
r
1
r
2
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.036
.040
0.91
1.02
.071
.079
1.81
2.01
.016
.024
0.41
0.61
.008
.203
.012
.305
.022
.559
Note
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Hatched areas on package denote metalized areas.
4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid.
5. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
603-641-3800 • 888-641--SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Revision Date: 3/15/2014
5
Embedded System
京公网安备 11010802033920号
EEWORLD
