TS16GUSDHC10 datasheet, PDF - EEWORLD Datasheet

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TS16GUSDHC10: Description16G X 8 FLASH 2.7V PROM, UUC, CARD; Categorystorage storage; File Size747KB，2 Pages; ManufacturerTranscend Information, Inc.; Websitehttps://www.transcend-info.com/; Environmental Compliance

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TS16GUSDHC10 Overview

16G X 8 FLASH 2.7V PROM, UUC, CARD

TS16GUSDHC10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Transcend Information, Inc.
package instruction	DIE,
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
JESD-30 code	R-XUUC-N
memory density	137438953472 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
word count	17179869184 words
character code	16000000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	16GX8
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	2.7 V
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
Base Number Matches	1

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microSD & microSDHC

miniSD

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Mobile devices are playing an increasingly important

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World-Class

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Performance

TS16GUSDHC10 Related Products

	TS16GUSDHC10	TS16GUSDHC4	TS16GUSDHC2-P3	TS16GUSDHC6	TS4GUSDC4	TS2GUSDC
Description	16G X 8 FLASH 2.7V PROM, UUC, CARD	16G X 8 FLASH 2.7V PROM, UUC, CARD	16G X 8 FLASH 2.7V PROM, UUC, CARD	16G X 8 FLASH 2.7V PROM, UUC, CARD	4G X 8 FLASH 2.7V PROM, UUC, CARD	2G X 8 FLASH 2.7V PROM, UUC, CARD
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Transcend Information, Inc.	Transcend Information, Inc.	Transcend Information, Inc.	Transcend Information, Inc.	Transcend Information, Inc.	Transcend Information, Inc.
package instruction	DIE,	DIE,	DIE,	DIE,	DIE,	DIE,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
JESD-30 code	R-XUUC-N	R-XUUC-N	R-XUUC-N	R-XUUC-N	R-XUUC-N	R-XUUC-N
memory density	137438953472 bit	137438953472 bit	137438953472 bit	137438953472 bit	34359738368 bit	17179869184 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
word count	17179869184 words	17179869184 words	17179869184 words	17179869184 words	4294967296 words	2147483648 words
character code	16000000000	16000000000	16000000000	16000000000	4000000000	2000000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
organize	16GX8	16GX8	16GX8	16GX8	4GX8	2GX8
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	DIE	DIE	DIE	DIE	DIE
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Programming voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER	UPPER	UPPER	UPPER	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
Base Number Matches	1	1	1	1	-	-

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