ISD4003-05MXY datasheet, PDF - EEWORLD Datasheet

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ISD4003-05MXY: DescriptionSpeech Synthesizer With RCDG, 300s, CMOS, LEAD FREE, DIE-19; CategoryAnalog mixed-signal IC Consumption circuit; File Size393KB，38 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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ISD4003-05MXY Overview

Speech Synthesizer With RCDG, 300s, CMOS, LEAD FREE, DIE-19

ISD4003-05MXY Parametric

Parameter Name	Attribute value
Parts packaging code	DIE
package instruction	DIE,
Contacts	19
Reach Compliance Code	unknown
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-XUUC-N19
Number of functions	1
Number of terminals	19
On-chip memory type	FLASH
Maximum operating temperature	50 °C
Minimum operating temperature
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Certification status	Not Qualified
Maximum read time	300 s
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	UPPER
Base Number Matches	1

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ISD4003 SERIES

SINGLE-CHIP, MULTIPLE-MESSAGES

VOICE RECORD/PLAYBACK DEVICES

4-, 5-, 6-, AND 8-MINUTE DURATION

-1-

Publication Release Date: October 26, 2005

Revision 1.2

ISD4003 SERIES

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 3

3. BLOCK DIAGRAM .............................................................................................................................. 4

4. TABLE OF CONTENTS ...................................................................................................................... 5

5. PIN CONFIGURATION ....................................................................................................................... 6

6. PIN DESCRIPTION ............................................................................................................................. 7

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 12

7.1. Detailed Description.................................................................................................................... 12

7.2. Serial Peripheral Interface (SPI) Description.............................................................................. 13

7.2.1. OPCODES ........................................................................................................................... 14

7.2.2. SPI Diagrams ....................................................................................................................... 15

7.2.3. SPI Control and Output Registers........................................................................................ 16

8. TIMING DIAGRAMS.......................................................................................................................... 18

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20

9.1. Operating Conditions .................................................................................................................. 21

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 22

10.1. Parameters For Packaged Parts .............................................................................................. 22

10.2. Parameters For Die .................................................................................................................. 25

10.3. SPI AC Parameters .................................................................................................................. 26

11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 27

12. PACKAGING AND DIE INFORMATION ......................................................................................... 30

12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 30

12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................... 31

12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC ...................... 32

12.4. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 ................................ 33

12.5. Die Information ......................................................................................................................... 34

13. ORDERING INFORMATION........................................................................................................... 36

14. VERSION HISTORY ....................................................................................................................... 37

-5-

Publication Release Date: October 26, 2005

Revision 1.2

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