reduces electromagnetic interference (EMI) at the clock
source, which provides system wide reduction of EMI of
all clock dependent signals. The P278xA allows
significant system cost savings by reducing the number of
circuit board layers and shielding that are traditionally
required to pass EMI regulations.
The P278xA uses the most efficient and optimized
modulation profile approved by the FCC. The P278xA
modulates the output of a single PLL in order to “spread”
the bandwidth of a synthesized clock and, more
importantly, decreases the peak amplitudes of its
harmonics. This result in significantly lower system EMI
compared to the typical narrow band signal produced by
oscillators and most frequency generators. Lowering EMI
by increasing a signal’s bandwidth is called spread
spectrum clock generation.
Product Description
The P278xA is a versatile spread spectrum frequency
modulator designed specifically for digital camera and
other digital video and imaging applications. The P278xA
Applications
The P278xA is targeted towards MFP, xDSL, fax modem,
set-top box, USB controller, DSC, and embedded systems.
Block Diagram
FS0
FS1
LF
VDD
PLL
Modulation
XIN /CLKIN
XOUT
Crystal
Oscillator
Frequency
Divider
Feedback
Divider
Phase
Detector
VCO
Output
Divider
ModOUT
VSS
PulseCore Semiconductor Corporation
1715 S. Bascom Ave Suite 200, Campbell, CA 95008
•
Tel: 408-879-9077
•
Fax: 408-879-9018
www.pulsecoresemi.com
Notice: The information in this document is subject to change without notice.
October 2006
rev 1.6
Pin Configuration
XIN / CLKIN
XOUT
FS1
LF
1
2
8
7
VDD
FS0
ModOUT
VSS
P2781/82/84
P278xA
3
4
6
5
Standard pin Configuration offered in both
8 pin SOIC and TSSOP Packages
Pin Description (P278xA)
Pin#
1
2
3
4
5
6
7
8
Pin Name
XIN/CLKIN
XOUT
FS1
LF
VSS
ModOUT
FS0
VDD
Type
I
O
I
I
I
O
I
P
Description
Connect to crystal or clock input. This pin has dual functions. It can be connected
either to an external crystal or an external reference clock.
Crystal connection. If using an external reference, this pin must be left
unconnected.
Digital logic input used to select input frequency range
(see the Input Frequency Selection Table). This pin has an internal pull-up
resistor.
External Loop Filter for the PLL. By changing the value of the CRC circuit, the
percentage spread can be adjusted accordingly. See the Loop Filter Selection
Table for detail value.
Ground Connection. Connect to system ground.
Spread Spectrum Clock Output.
Digital logic input used to select input frequency range
(see the Input Frequency Selection Table). This pin has an internal pull-up
resistor.
Connect to +3.3 V
Input Frequency Selection Table
FS1
0
0
1
1
FS0
0
1
0
1
Input (MHz)
3 to 9
10 to 19
20 to 38
39 to 78
Output Frequency Scaling (MHz)
P2781A
3 to 9
10 to 19
20 to 38
39 to 78
P2782A
6 to 18
20 to 38
40 to 76
78 to 156
P2784A
12 to 36
40 to 76
80 to 152
156 to 312
Modulation Rate (KHz)
Fin / 128
Fin / 256
Fin / 512
Fin / 1024
General Purpose EMI Reduction IC
Notice: The information in this document is subject to change without notice.
2 of 11
October 2006
rev 1.6
Loop Filter Selection Table VDD 3.3V
P2781/82/84
Contact PulseCore for loop values that are not listed in the table and for
component selection values for industrial and automotive temperatures.
BW = ±0.50%
Input
MHz
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21-22
23-24
25-26
27-28
29-30
31-32
33-34
35-36
37-38
39-42
43-46
47-50
51-54
55-58
59-62
63-66
67-70
71-74
75-78
FS1 FS0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
C1
(pF)
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
C2
(pF)
330,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
1
BW = ±0.75%
C1
(pF)
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
C2
(pF)
330,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
100,000
1
BW = ±1.00%
C1
(pF)
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
270
C2
(pF)
1
BW = ±1.25%
C1
(pF)
560
560
560
680
330
680
270
560
560
680
470
330
330
680
390
270
270
560
560
680
470
330
330
680
390
270
270
560
560
680
470
330
330
680
390
270
270
C2
(pF)
100,000
100,000
100,000
6,800
3,300
6,800
2,700
100,000
100,000
6,800
4,700
3,300
3,300
6,800
3,900
2,700
2,700
100,000
100,000
6,800
4,700
3,300
3,300
6,800
3,900
2,700
2,700
100,000
100,000
6,800
4,700
3,300
3,300
6,800
3,900
2,700
2,700
1
R1
(ohm)
220
270
390
510
620
820
1,000
330
390
510
560
620
750
820
910
1,000
1,200
330
390
510
560
620
750
820
910
1,000
1,200
330
390
510
560
620
750
820
910
1,000
1,200
R1
(ohm)
300
390
560
750
1,000
1,200
1,500
510
560
750
820
1,000
1,100
1,200
1,300
1,500
1,600
560
620
750
820
1,000
1,100
1,200
1,300
1,500
1,600
560
620
750
820
1,000
1,100
1,200
1,300
1,600
1,800
R1
(ohm)
R1
(ohm)
510
680
910
1,200
1,200
2,200
2,200
910
1,100
1,200
1,200
1,200
1,500
2,200
2,200
2,200
2,700
910
1,100
1,200
1,200
1,200
1,500
2,200
2,200
2,200
2,700
910
1,100
1,200
1,200
1,200
1,500
2,200
2,200
2,200
2,700
100,000
390
100,000
560
100,000
750
10,000
1,000
5,600
1,200
12,000
2,200
5,600
2,200
100,000
750
100,000 866(1%)
10,000
1,000
12,000
1,200
5,600
1,200
3,900
1,200
12,000
2,200
10,000
2,200
5,600
2,200
3,300
2,200
100,000
750
100,000 866 (1%)
10,000
1,000
12,000
1,200
6,800
1,200
3,900
1,200
12,000
2,200
10,000
2,200
5,600
2,200
3,300
2,200
100,000
750
100,000 866 (1%)
10,000
1,000
12,000
1,200
6,800
1,200
3,900
1,200
12,000
2,200
8,200
2,200
5,600
2,200
3,300
2,200
1 The BW value is representative of typical conditions
General Purpose EMI Reduction IC
Notice: The information in this document is subject to change without notice.
3 of 11
October 2006
rev 1.6
Spread Spectrum Selection
P2781/82/84
The P278xA performs Zero Cycle Slip when set at low percentage spreading. This allows no occurrence of system timing
error. The optimal setting should minimize system EMI to the fullest without affecting system performance. The spreading is
described as a percentage deviation of the center frequency.
(Note: the center frequency is the frequency of the external reference input on CLKIN, Pin 1.)
The P2781A is designed for PC peripheral, networking, notebook PC, and LCD monitor applications. It is optimized for
operation between 3 to 78MHz range. In the following application schematic example, the P2781A spread percentage
selection is determined by the external LF value specified in the Loop Filter Selection Table. The Input Frequency Selection
Table specifies the input frequency range. The external LF allows the user to fine tune the spread percentage to optimize the
EMI reduction benefits of the spread spectrum.
+3.3V
16 MHz
1 XIN/CLKIN VDD 8
2 XOUT
3 FS1
R1
C1
4 LF
0 Ohm
FS0 7
ModOUT 6
VSS 5
P278xA
2.2 K
0.1µF
Modulated 16MHz Clock
To target Chip
C2
Note: Both logic input pins FS1 and FS0 have to be connected to either VDD or VSS. Do not leave them floating.
General Purpose EMI Reduction IC
Notice: The information in this document is subject to change without notice.
4 of 11
October 2006
rev 1.6
Absolute Maximum Ratings
Symbol
V
DD
, V
IN
T
STG
T
A
T
s
T
J
T
DV
Storage temperature
Operating temperature
Max. Soldering Temperature (10 sec)
Junction Temperature
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
P2781/82/84
Parameter
Voltage on any pin with respect to Ground
Rating
-0.5 to +4.6
-65 to +125
-40 to +85
260
150
2
Unit
V
°C
°C
°C
°C
KV
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
DC Electrical Characteristics
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)
Symbol
V
IL
V
IH
I
IL
I
IH
I
XOL
I
XOH
V
OL
V
OH
I
DD
I
CC
VDD
Input low voltage
Parameter
Input high voltage
Input low current
(internal input pull-up resistor on FS0 and FS1)
Input high current
(internal input pull-up resistor on FS0 and FS1)
XOUT output low current
XOUT output high current
Output low voltage (VDD = 3.3V, I
OL
= 20mA)
Output high voltage (VDD = 3.3V, I
OH
= 20mA)
Static supply current
Typical dynamic supply current
(25pF scope probe loading)
Operating voltage
Min
VSS – 0.3
2.0
-
-
-
-
-
2.5
-
5.2 at 3MHz
3.0
Typ
-
-
60
60
10
10
-
-
3
-
3.3
Max
0.8
VDD +0.3
-
-
-
-
0.4
-
-
21.2 at 82MHz
3.6
Unit
V
V
µA
µA
mA
mA
V
V
mA
mA
V
General Purpose EMI Reduction IC
Notice: The information in this document is subject to change without notice.
[color=#3e3e3e]Before describing the Miller plateau, let's first look at the "culprit" Miller effect. [/color] [color=#3e3e3e]Assume an ideal reverse voltage amplifier with a gain of -Av as shown in F...
Solar energy is an inexhaustible source of energy. A device that directly converts solar energy (or other light energy) into electrical energy is called a solar cell. As people's awareness of energy c...
Friends in the circle, I wonder what the current level of mobile phone monitoring is? Is it better to use a network video server that supports mobile phone browsing with a general camera, or to use a ...
The actual value of R2 is 5.1K. What I want to ask now is: 1. Is there any problem with the circuit diagram? Is it reasonable to use OP07 as the op amp? Because the information of TGS4161 requires TLC...
Under WM6, the emulator can be used with the Cellular Emulator to test calls and text messages, but how can I do this in the emulator environment for wince6?...
Good design habits:1. Both input and output data must be buffered by registers!2. Use intermediate registers for data transition;3. Use a fully synchronous design!...
On August 24th, Tesla CEO Elon
Musk
revealed information about the upcoming FSD V14, claiming it will outperform human drivers. Tesla FSD lead Ashok stated last year that FSD version 12.5, ...[Details]
Reflow soldering is a critical process in electronics assembly production, and the cleanliness of the reflow oven has a direct impact on product quality. Dust and residue accumulation within the ov...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
As the number of cars increases, environmental pressures are also increasing. At this time, some people are saying that new energy vehicles are energy-efficient and environmentally friendly, and ar...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
When discussing autonomous driving technology, there are often two extremes: on the one hand, there's the vision of "fully autonomous driving," while on the other, there's concern about potential s...[Details]
Since the beginning of this year, price wars have intensified, new models have been launched one after another, used cars with zero kilometers have become a hot topic, and the industry's internal c...[Details]
While the current industry consensus is that autonomous vehicles are robots and that their systems are managed using robotics-developed thinking, there are also cases where autonomous driving is ac...[Details]
Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
1. Ease of Use: The HMI module should be designed to be simple and clear, allowing users to easily operate and configure the energy storage device.
2. Ease of Maintenance: The HMI module should...[Details]
On August 22, according to CNBC's report today, the National Highway Traffic Safety Administration (NHTSA) is launching an investigation into Tesla, and the latter is questioned whether it has fail...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
Analogue and Mixed Signal
京公网安备 11010802033920号
EEWORLD
