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MUR220_06

Description
switchmode TM power rectifier
File Size55KB,5 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet View All

MUR220_06 Overview

switchmode TM power rectifier

MUR220
Preferred Device
SWITCHMODEt
Power Rectifier
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
http://onsemi.com
Ultrafast 25 Nanosecond Recovery Times
175°C Operating Junction Temperature
Low Forward Voltage
Low Leakage Current
High Temperature Glass Passivated Junction
These are Pb−Free Devices*
ULTRAFAST RECTIFIER
2.0 AMPERES − 200 VOLTS
Mechanical Characteristics:
Case: Epoxy, Molded
Weight: 0.4 Gram (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Cathode Indicated by Polarity Band
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (Note 1)
(Square Wave Mounting Method #3 Per Note 3)
Non−Repetitive Peak Surge Current
(Surge applied at rated load conditions,
halfwave, single phase, 60 Hz)
Operating Junction Temperature and Storage
Temperature Range
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FSM
Value
200
2.0 @
T
A
= 90°C
35
Unit
V
AXIAL LEAD
CASE 059−10
PLASTIC
MARKING DIAGRAM
A
A
A
MUR220
YYWW
G
G
T
J
, T
stg
− 65 to
+175
°C
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Ambient
Symbol
R
qJA
Max
(Note 3)
Unit
°C/W
A
= Assembly Location
MUR220 = Device Code
YY
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MUR220
MUR220G
MUR220RL
MUR220RLG
Package
Axial Lead**
Axial Lead**
Axial Lead**
Axial Lead**
Shipping
1000 Units / Bulk
1000 Units / Bulk
5000 / Tape & Reel
5000 / Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
2.0%.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
**This package is inherently Pb−Free.
Preferred
devices are recommended choices for future use
and best overall value.
1
July, 2006 − Rev. 7
Publication Order Number:
MUR220/D
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