RGF15A THRU RGF15M
SURFACE MOUNT GLASS PASSIVATED JUNCTION FAST RECOVERY RECTIFIER
Reverse Voltage - 50 to 1000 Volts
Forward Current - 1.5 Amperes
ENTED
PAT
0.150(3.80)
0.130(3.30)
DO-214AA
FEATURES
0.083(2.12)
0.077(1.95)
0.187(4.75)
0.167(4.24)
0.016(0.40)
0.006(0.15)
0.102(2.60)
0.079(2.00)
0.050(1.27)
0.030(0.76)
0.236(6.00)
0.197(5.00)
GPRC (Glass Passivated Rectifier Chip) inside
Glass passivated cavity-free junction
Ideal for surface mount automotive applications
Fast switching for high efficiency
Built-in strain relief
Easy pick and place
o
High temperature soldering guaranteed: 260 C/10 seconds,
at terminals
* Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
*
*
*
*
*
*
*
MECHANICAL DATA
Case :
JEDEC DO-214AA molded plastic over passivated chip
Terminals :
Solder plated , solderable per MIL-STD-750,
Method 2026
Polarity :
Color band denotes cathode end
Mounting Position :
Any
Weight :
0.003 ounes , 0.093 gram
*Dimensions in inches and (millimeters)
TM
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature
SYMBOLS
unless otherwise specified.
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current T
A
=75 C
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.5 A
Maximum full load reverse current, full cycle
o
average , 0.375" (9.5mm) lead lengths at T
A
=55 C
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time (NOTE 1)
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
Operating junction and storage temperature range
T
A
=25 C
o
T
A
=125 C
o
T
A
=150 C
o
o
o
RGF15
A
B
100
70
100
UNITS
K
800
560
800
D
200
140
200
G
400
280
400
J
600
420
600
JA
600
420
600
KA
800
560
800
M
1000
700
1000
MA
1000
700
1000
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R (AV)
50
35
50
Volts
Volts
Volts
Amps
Amps
Volts
uA
1.5
50
1.3
100
5
30
80
150
250
25
55
18
-65 to +175
150
500
300
500
300
I
R
uA
trr
C
J
R
R
JA
JL
nS
pF
o
C/W
o
T
J
,T
STG
C
NOTES : (1) Reverse recovery test condition : IF 0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas.
REV. : 0
Zowie Technology Corporation
RATINGS AND CHARACTERISTIC CURVES RGF15A THRU RGF15M
FIG.1 - FORWARD CURRENT DERATING CURVE
1.50
AVERAGE FORWARD RECTIFIED
CURRENT, AMPERES
1.25
1.00
0.75
0.50
0.25
0
0
25
50
75
100
125
o
FIG.2 - MAXIMUM NON-REPETITIVE
PEAK FORWARD SURGE CURRENT
50
PEAK FORWARD SURGE CURRENT,
AMPERES
60Hz
RESISTIVE OR
INDUCTIVE LOAD
40
T
J
=T
J
max.
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
30
20
10
5
150
175
1
10
NUMBER OF CYCLES AT 60Hz
100
AMBIENT TEMPERATURE, C
FIG.3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
10.00
IINSTANTANEOUS FORWARD CURRENT,
AMPERES
INSTANTANEOUS REVERSE LEAKAGE
CURRENT, MICROAMPERES
100
FIG.4 - TYPICAL REVERSE CHARACTERISTICS
T
J
=25 C
o
1.00
PULSE WIDTH=300uS
1% DUTY CYCLE
10
1
0.10
T
J
=125 C
T
J
=150 C
o
o
0.1
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
0
20
40
60
80
100 110
PERCENT OF RATED PEAK REVERSE VOLTAGE,%
200
JUNCTION CAPACITANCE, pF
TRANSIENT THERMAL IMPEDANCE( C/W)
FIG.5 - TYPICAL JUNCTION CAPACITANCE
T
J
= 25 C
o
FIG.6 - TYPICAL TRANSIENT THERMAL IMPEDANCE
100
100
60
40
20
10
6
4
2
1
.1
.2
.4
1.0
2
4
10
20
40
100
REVERSE VOLTAGE, VOLTS
o
10
1
0.1
0.01
0.10
1.0
10
100
t , PULSE DURATION, sec
REV. : 0
Zowie Technology Corporation
Microcontroller MCU
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