TECHNICAL DATA
KK74HC30A
8-Input NAND Gate
The
KK74HC30A
is high-speed Si-gate CMOS device and is
compatible with low power Schottky TTL (LSTTL) . The device provide
the 8-input NAND function.
•
Outputs Directly Interface to CMOS, NMOS, and TTL
•
Operating Voltage Range: 2.0 to 6.0 V
•
Low Input Current: 1.0
µA
•
High Noise Immunity Characteristic of CMOS Devices
ORDERING INFORMATION
KK74HC30AN
Plastic
KK74HC30AD
SOIC
T
A
= -55° ÷ 125° C for all packages
LOGIC DIAGRAM
A
B
PIN ASSIGNMENT
A
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V CC
C
D
Y
E
F
G
H
B
C
D
E
F
GND
-
H
G
-.
-
Y
PIN 14 =V
CC
PIN 7 = GND
A
L
X
X
X
X
X
X
X
H
B
X
L
X
X
X
X
X
X
H
С
X
X
L
X
X
X
X
X
H
FUNCTION TABLE
Inputs
D
X
X
X
L
X
X
X
X
H
E
X
X
X
X
L
X
X
X
H
F
X
X
X
X
X
L
X
X
H
G
X
X
X
X
X
X
L
X
H
H
X
X
X
X
X
X
X
L
H
Output
Y
H
H
H
H
H
H
H
H
L
X = don’t care
1
KK74HC30A
MAXIMUM RATINGS
*
Symbol
V
CC
V
IN
V
OUT
I
IN
I
OUT
I
CC
P
D
Tstg
T
L
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, V
CC
and GND Pins
Power Dissipation in Still Air, Plastic DIP**
SOIC Package**
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
Value
-0.5 to +7.0
-1.5 to V
CC
+1.5
-0.5 to V
CC
+0.5
±20
±25
±50
750
500
-65 to +150
260
Unit
V
V
V
mA
mA
mA
mW
°C
°C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
**Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
, V
OUT
T
A
t
r
, t
f
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time (Figure 1)
V
CC
=2.0 V
V
CC
=4.5 V
V
CC
=6.0 V
Min
2.0
0
-55
0
0
0
Max
6.0
V
CC
+125
1000
500
400
Unit
V
V
°C
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, V
IN
and V
OUT
should be constrained to the range GND≤(V
IN
or
V
OUT
)≤V
CC
.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V
CC
). Unused
outputs must be left open.
2
KK74HC30A
AC ELECTRICAL CHARACTERISTICS
(C
L
=50pF,Input t
r
=t
f
=6.0 ns)
V
CC
Symbol
Parameter
V
Guaranteed Limit
25
°C
to
-55°C
175
35
30
75
15
13
10
≤85°C
≤125°C
Unit
t
PHL
, t
PLH
Maximum Propagation Delay (Figure 1)
2.0
4.5
6.0
2.0
4.5
6.0
5.0
220
44
37
95
19
16
10
265
53
45
110
22
19
10
ns
t
THL
, t
TLH
Maximum Output Transition Time
(Figure 1)
Maximum Input Capacitance
Power Dissipation Capacitance (Per Gate)
ns
C
IN
pF
T
A
=25°C,V
CC
=5.0 V
27
pF
C
PD
Used to determine the no-load dynamic power
consumption:
P
D
=C
PD
V
CC2
f+I
CC
V
CC
t
f
0.9
t
r
V
1
0.9
Input
V
2
0.1
0.1
V
2
GND
t
PHL
V
CC
t
PLH
0.9
V
2
0.1
0.9
V
2
0.1
Output
0V
t
TLH
t
THL
V
1
= V
CC
V
2
= 0.5 V
CC
Figure 1. Switching Waveforms
V
CC
V
I
PULSE
GENERATOR
R
T
DEVICE
UNDER
TEST
V
O
Termination resistance R
T
– should
be equal to Z
OUT
of pulse generators
C
L
50 pF
Figure 2. Test Circuit
4
KK74HC30A
N SUFFIX PLASTIC DIP
(MS - 001AA)
A
14
8
B
1
7
Dimension, mm
Symbol
A
B
C
MIN
18.67
6.1
MAX
19.69
7.11
5.33
0.36
1.14
2.54
7.62
0°
2.92
7.62
0.2
0.38
10°
3.81
8.26
0.36
0.56
1.78
F
L
D
F
C
-T-
SEATING
N
G
D
0.25 (0.010) M T
K
PLANE
G
H
H
J
M
J
K
L
M
N
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D SUFFIX SOIC
(MS - 012AB)
Dimension, mm
8
A
14
Symbol
A
MIN
8.55
3.8
1.35
0.33
0.4
1.27
5.27
0°
0.1
0.19
5.8
0.25
MAX
8.75
4
1.75
0.51
1.27
H
B
P
B
C
1
G
7
C
R x 45
D
F
G
-T-
D
0.25 (0.010) M T C M
K
SEATING
PLANE
H
J
F
M
J
K
M
P
R
8°
0.25
0.25
6.2
0.5
NOTES:
1. Dimensions A and B do not include mold flash or protrusion.
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
for A; for B
‑
0.25 mm (0.010) per side.
5
Embedded System
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