SMALL SIGNAL TRANSISTOR
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | ROHM Semiconductor |
| package instruction | SMALL OUTLINE, R-PDSO-G3 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Other features | DIGITAL, BUILT IN BIAS RESISTOR RATIO 1 |
| Maximum collector current (IC) | 0.05 A |
| Collector-emitter maximum voltage | 50 V |
| Configuration | SINGLE WITH BUILT-IN RESISTOR |
| Minimum DC current gain (hFE) | 30 |
| JESD-30 code | R-PDSO-G3 |
| JESD-609 code | e3/e2 |
| Number of components | 1 |
| Number of terminals | 3 |
| Maximum operating temperature | 150 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 |
| Polarity/channel type | NPN |
| Maximum power dissipation(Abs) | 0.2 W |
| Certification status | Not Qualified |
| surface mount | YES |
| Terminal surface | TIN/TIN COPPER |
| Terminal form | GULL WING |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 10 |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
| DTC114ECA | DTC114ESA | |
|---|---|---|
| Description | SMALL SIGNAL TRANSISTOR | SMALL SIGNAL TRANSISTOR |
| Is it Rohs certified? | conform to | conform to |
| Maker | ROHM Semiconductor | ROHM Semiconductor |
| package instruction | SMALL OUTLINE, R-PDSO-G3 | IN-LINE, R-PSIP-T3 |
| Reach Compliance Code | compli | unknow |
| ECCN code | EAR99 | EAR99 |
| Other features | DIGITAL, BUILT IN BIAS RESISTOR RATIO 1 | BUILT-IN BIAS RESISTOR RATIO IS 1 |
| Maximum collector current (IC) | 0.05 A | 0.1 A |
| Collector-emitter maximum voltage | 50 V | 50 V |
| Configuration | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR |
| Minimum DC current gain (hFE) | 30 | 30 |
| JESD-30 code | R-PDSO-G3 | R-PSIP-T3 |
| Number of components | 1 | 1 |
| Number of terminals | 3 | 3 |
| Maximum operating temperature | 150 °C | 150 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED |
| Polarity/channel type | NPN | NPN |
| Maximum power dissipation(Abs) | 0.2 W | 0.3 W |
| Certification status | Not Qualified | Not Qualified |
| surface mount | YES | NO |
| Terminal form | GULL WING | THROUGH-HOLE |
| Terminal location | DUAL | SINGLE |
| Maximum time at peak reflow temperature | 10 | NOT SPECIFIED |
| transistor applications | SWITCHING | SWITCHING |
| Transistor component materials | SILICON | SILICON |
京公网安备 11010802033920号
EEWORLD
