CIN::APSE
®
High Speed
Interconnect Technology
CIN::APSE
®
High-Speed Interconnect Technology
■
High signal speed capability enabling frequencies greater than 20 GHz.
■
Z-Axis, solderless, compression mount interconnect system.
■
Applications include production Land Grid Array (LGA) integrated circuit sockets, flex circuit to
PCB, and parallel PCB to PCB interconnections.
■
Provides solutions to many of the problems associated with through hole and surface mount
soldered technology.
■
Enables upgrade and system maintenance strategies.
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Available in custom I/O configurations and I/O counts from 1 to over 5,000.
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Offers low profile capabilities with compressed signal path length as short as 0.8 mm.
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Contact centerline spacing of 1mm or greater.
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Excellent reliability in commercial, military, and aerospace applications.
■
Application can result in lower installed and system maintenance costs.
F
EATURES
M
ATERIALS
E
NVIRONMENTAL
Contact Material:
Molybdenum
CIN::APSE Contact Plating:
Gold
Plunger Material:
Copper alloy
Plunger Plating:
Gold
Insulator Material:
Liquid crystal polymer
Packaging Tray Material:
Anti-static ABS
Button-Only Configuration with 0.020" (0.5 mm) Diameter
Temperature Life Testing:
1000 Hours @ 200°C
Thermal Shock:
2,000 Cycles @ 20°C to 110°C
Humidity:
5,000 Hours @ 30°C to 80°C, 80% RH
Salt Spray:
96 Hours
Low Temperature:
Operates in liquid nitrogen (77°K)
Bellcore TR-NWT-001217:
Passed with plungers
IC Component to Board Socket (LGA)
Button-Only Configuration with 0.020" (0.5 mm) Diameter
E
LECTRICAL
DC Resistance:
Inductance:
Current-Carrying Capability:
Insulation Resistance:
Dielectric Withstanding Voltage:
15mΩ average
Less than 1 nH
Up to 3 Amps.
25,000 MegΩ @ 500 VDC
900 VAC at sea level
M
ECHANICAL
Button-Only Configuration with 0.020" (0.5 mm) diameter
Durability:
25,000 Z-axis actuations (CIN::APSE contact only)
Shock:
100 Gs; 6 milliseconds, no discontinuity
greater than 2 nanoseconds
Vibration:
20 Gs; 10-20,000 Hz; no discontinuity
greater than 2 nanoseconds
Flex Circuit to PCB
Call Toll Free: 1 (800) 323-9612
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CIN::APSE
®
High-Speed Interconnect Technology
THE BUTTON CONTACT
The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
•
•
•
•
•
•
Small form factor (0.020" diameter by 0.32" min. high)
Low compression force (approx. 2.5 oz. min. per contact)
Multiple beam structures
Several points of contact per button
Extremely lightweight
Natural wiping action
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
multi-chip modules)
• PC board to PC board (parallel processors,
enhancement/mezzanine cards)
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
CIN::APSE APPLIED
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
Step 2:
Add Z-Axis compression
and secure.
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Call Toll Free: 1 (800) 323-9612
CIN::APSE
®
High-Speed Interconnect Technology
1
TYPICAL CONFIGURATION
1. Button-Only
This is the basic CIN::APSE contact configuration. It is ideally suited for
z-axis applications requiring minimum height, high density, and signal
integrity. This configuration is used in LGA and IC sockets, PCB to PCB,
and flex print circuit to PCB applications.
2. Plunger-Button
The addition of a gold-plated brass plunger increases the durability of the
CIN::APSE contact system while also achieving additional height. This
configuration suits itself especially well for PCB to PCB interconnect and
those that require excessive handling.
Other custom configurations are
available. Contact Cinch for details.
CIN::APSE Applications
Due to its breakthrough nature, it is impossible to illustrate all of the applications CIN::APSE
technology can address. The following applications illustrate only a portion of the types of
interconnect problems that CIN::APSE can solve.
Call Toll Free: 1 (800) 323-9612
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FPGA/CPLD
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