EEWORLDEEWORLDEEWORLD

Part Number

Search

HX05-NP

Description
current transducer HX 05~10-NP
File Size147KB,2 Pages
ManufacturerLEM
Websitehttp://www.lem.com
Download Datasheet Compare View All

HX05-NP Overview

current transducer HX 05~10-NP

Current Transducer HX 05...10-NP
For the electronic measurement of currents: DC, AC, pulsed, mixed,
with a galvanic isolation between the primary circuit (high power) and
the secondary circuit (electronic circuit).
I
PN
=
5 .. 10 A
Electrical data
Primary nominal
r.m.s. current
I
PN
(A)
Series
Parallel
Primary current
measuring range
I
P
(A)
Series
±
15
±
30
Parallel
Primary Conductor
Diameter x Turns
(mm)
Type
Features
Galvanic isolation between primary
and secondary circuit
Hall effect measuring principle
2 isolated primary windings
Isolation voltage 3000V
Low power consumption
Extended measuring range(3x
I
PN
)
Power supply from ±12V to ±15V
Material according to UL94-V0
± 5
± 10
V
OUT
R
OUT
R
L
V
C
I
C
V
d
± 10
± 20
± 30
± 60
0.7d
x
(6T+6T)
1.0d
x
(3T+3T)
HX 05-NP
HX 10-NP
V
kΩ
V
mA
kV
kV
V
e
Output voltage @ ±
I
PN
,
R
L
= 10 kΩ,
T
A
= 25°C
±4
Output impedance
< 50
Load resistance
10
1)
Supply voltage (± 5 %)
± 15
Current consumption
< ± 20
R.m.s. voltage for AC isolation test, 50/60Hz, 1 mn
Primary to secondary
>3
Primary 1 to primary 2
>1
R.m.s. voltage for partial discharge extinction
at
10pC
1
Impulse withstand voltage, 1.2/50µs
6
Advantages
kV
kV
Low insection losses
Easy to mount with automatic
handling system
Small size and space saving
High immunity to external
interference.
Accuracy-Dynamic performance data
X
ε
L
V
OE
V
OH
V
OT
TC
ε
G
t
r
f
Accuracy @
I
PN
,
T
A
= 25°C (without offset)
Linearity (0 .. ±
I
PN
)
Electrical offset voltage,
T
A
= 25°C
Hysteresis offset voltage @
I
P
= 0;
after an excursion of 3 x
I
PN
Thermal drift of
V
OE
Thermal drift of the gain (% of reading)
Response time @ 90% of
I
P
Frequency bandwidth (-3 dB)
2)
<±1
<±1
< ± 40
< ± 15
max. ± 1.5
± 0.1
3
50
% of
I
PN
% of
I
PN
mV
mV
mV/K
%/K
µs
kHz
Applications
Switched Mode Power Supplies
(SMPS)
AC variable speed drives
Uninterruptible Power Supplies
(UPS)
Electrical appliances
Battery supplied applications
DC motor drives
General data
T
A
T
S
m
Ambient operating temperature
- 25 .. + 85 °C
Ambient storage temperature
- 25 .. + 85 °C
Mass
8
g
Min. internal creepage distance/clearance
5.5
mm
Isolation material group
I
Standards
EN50178
1)
Notes : Also operate at ±12V power supplies, measuring range reduced to ±2.5x
I
PN
2)
Small signal only to avoid excessive heating of the magnetic core
011012/2
LEM Components
www.lem.com

HX05-NP Related Products

HX05-NP HX10-NP
Description current transducer HX 05~10-NP current transducer HX 05~10-NP
How to use timer to realize digital oscillator experimental procedure
I want to use the timer to realize the experimental program of digital oscillator. I know the program of sine wave generation, but I don't know how and where to use the timer? I don't know if there is...
xujinlong860120 DSP and ARM Processors
How to solve the reset problem of MSP430
Sometimes, MSP430 cannot be reset immediately after the entire system is powered off. It is necessary to short-circuit the power supply of the entire system for a few minutes after the power is off to...
zgh836987437 Microcontroller MCU
Playing web games will shut down
The computer boots up normally and plays the game normally, but it shuts down automatically when playing web games. The power supply and graphics card are normal....
szchow Power technology
In the era of lead-free manufacturing, constant temperature soldering iron soldering stations can learn from the reservoir effect
Many expensive lead-free soldering stations like to emphasize and show off their powerful instantaneous temperature recovery capabilities. In fact, this is a bit of a nitpicking approach. Although the...
ardtek Analog electronics
Experience the whole process of replacing the screen protector for Nokia 8800
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:00[/i]...
lorant Mobile and portable
How to prevent WINCE 5.0 multi-image address space overlap?
In config.bib, the CE image is divided into 4 parts, for example: KERNEL.BIN, DRIVER.BIN, APP.BIN, NK.BIN. This is done so that a single image file can be upgraded later. Now the problem is that the a...
lance0220 Embedded System

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2126  1402  2024  1617  1619  43  29  41  33  18 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号