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MLP2520WR68MT0S1

Description
Fixed Inductors
CategoryPassive components   
File Size49KB,3 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
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Fixed Inductors

MLP2520WR68MT0S1 Parametric

Parameter NameAttribute value
Product CategoryFixed Inductors
ManufacturerTDK Corporation
ProductPower Inductors
PackagingReel
Factory Pack Quantity3000
(1/3)
SMD Inductors(Coils)
For Power Line(Multilayer, Magnetic Shielded)
MLP Series MLP2520
In response to market demands for smaller mobile devices with a
longer lasting life, mounted switching supply circuits with even
higher frequencies are now being developed.
With optimized materials the MLP2520 type contributes to the
improved efficiency of power sources, and reduces the losses
caused by ferrite, even if the products are used for supply circuits
with high drive frequencies.
FEATURES
• Optimized ferrite materials enable the reduction of losses.
• Compared to the existing MLP2520 type, DC superposition
characteristics have been substantially improved.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Cellular phones, DSCs, DVCs, HDs, etc.
SPECIFICATIONS
Operating temperature range
Storage temperature range
–40 to +125°C
[Including self-temperature rise]
–40 to +85°C
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLP 2520 S 1R0 M T
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L W
2520
2.5 2.0mm
(3) Product characteristics classification code
S
P
STD
Improved DC superimposition
characteristics
(4) Inductance value
1R0
1R5
2R2
3R3
4R7
• S1R0S: 1.2 H, S2R2S: 2.5 H
1.0
1.5
2.2
3.3
4.7
H
H
H
H
H
(5) Management number
M
S
t=1.0mm max.
t=1.2mm max.
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
(6) Packaging style
10s max.
250 to 260˚C
230˚C
Natural
cooling
T
Taping [reel]
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Thickness T(mm)
1.0mm max.
1.2mm max.
Quantity
3000 pieces/reel
3000 pieces/reel
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
003-01 / 20101021 / e533_mlp2520.fm

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